embedded

Posted on by Debashis Das - No Comments on ADLINK AVA-1000 is a rugged EN50155-compliant T2G gateway for railway and industrial applications

ADLINK AVA-1000 is a rugged EN50155-compliant T2G gateway for railway and industrial applications

ADLINK AVA 1000 T2G gateway top view

The ADLINK AVA-1000 T2G gateway is a rugged, EN50155-compliant T2G (Train-to-Ground) gateway designed for railway and industrial environments. Powered by a choice of NXP i.MX8M Plus Quad Cortex-A53 processor or an Intel Processor N50 Alder Lake-N processor. The i.MX8M Plus model is equipped with up to 8GB LPDDR4 and a 64GB eMMC flash whereas the Alder Lake variant features up to 4GB LPDDR5 memory and a 32GB eMMC flash. In terms of connectivity, the gateway features three M12 GbE ports and supports a wide range of options including 5G, WiFi 6, and GNSS. The AVA-1000 T2G gateway’s fanless design, wide operating temperature range, and 24-110V DC input ensure reliable operation in industrial environments. Additionally, its compliance with EN50155 and other industrial standards makes it ideal for various industrial applications. AVA-1000 T2G gateway specifications System Processor (multiple options) NXP i.MX8M Plus quad-core Cortex-A53 processor @ up to 1.8 GHz with Cortex-M7 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Cincoze DV-1100 is a rugged embedded computer with Raptor Lake or Alder Lake SoC for industrial and railway applications

Cincoze DV-1100 is a rugged embedded computer with Raptor Lake or Alder Lake SoC for industrial and railway applications

Cincoze DV-1100 Rugged Embedded Computer

Cincoze DV-1100 is a rugged embedded computer powered by a choice of Intel 13th Gen Raptor Lake or 12th Gen Alder Lake S Series embedded processors with up to 32GB DDR5 DO-DIMM memory, various NVMe and SATA storage options, up to three display interfaces, 2.5GbE and GbE networking, optional WiFi, Bluetooth, 4G LTE, and/or 5G wireless connectivity, six USB ports for expansion, and more. The system is housed in a fanless enclosure made of extruded aluminum with heavy-duty metal that’s good enough for 35W processors, but an additional fan kit is required for 65W processors. As a rugged embedded system designed for industrial environments, the Cincoze DV-1000 takes 9 to 48V DC input, integrates two RS232/RS422/RS485 COM ports, complies with the MIL-STD-810H shock and vibration standard plus various other industrial and railways standards, and can operate in a wide  -40°C to 70°C temperature range. Cincoze DV-1100 specifications: SoC (multiple options) […]

Posted on by Debashis Das - 3 Comments on NetBurner SOMRT1061 – A stamp-sized dual Ethernet SoM powered by NXP’s i.MX RT1061 crossover processor

NetBurner SOMRT1061 – A stamp-sized dual Ethernet SoM powered by NXP’s i.MX RT1061 crossover processor

i.MX RT1061 Embedded System on Module SOMRT1061

The NetBurner SOMRT1061 is a System-on-Module (SoM) that comes in a very compact stamp-sized footprint that measures just 25.4mm x 25.4mm, yet boasts a rugged design and 67 usable GPIO pins with edge connectors. These features make this SoM ideal for a wide range of medical, industrial, and robotics applications. The SoM is built around the NXP’s i.MX RT1061 Arm Cortex M7 SoC, and features 1MB of internal SRAM, 32MB of external RAM, and 8MB of flash storage. It also features dual 10/100M Ethernet with PTP, an on-die temperature sensor, three FlexIO modules, two USB OTG 2.0 controllers, I2C, SPI, ADC, SD Card, CAN, UART, and many more. NetBurner SOMRT1061 System-on-Module (SOM) Specifications SoC  –  NXP i.MX RT1061 Arm Cortex-M7 @ 528MHz. Memory 1MB SRAM on the processor 32MB of external RAM Storage Flash – 1MB boot, 8MB application SDHC – Flash card interface Ethernet Up to two 10/100 Ethernet […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on Qualcomm RB3 Gen 2 Platform with Qualcomm QCS6490 AI SoC targets robotics, IoT and embedded applications

Qualcomm RB3 Gen 2 Platform with Qualcomm QCS6490 AI SoC targets robotics, IoT and embedded applications

Qualcomm RB3 Gen 2 Platform Vision Kit

Qualcomm had two main announcements at Embedded World 2024: the ultra-low-power Qualcomm QCC730 WiFi microcontroller for battery-powered IoT devices and the Qualcomm RB3 Gen 2 Platform hardware and software solution designed for IoT and embedded applications based on the Qualcomm QCS6490 processor that we’re going to cover today. The kit is comprised of a QCS6490 octa-core Cortex-A78/A55 system-on-module with 12 TOPS of AI performance, 6GB RAM, and 128GB UFS flash connected to the 96Boards-compliant Qualcomm RBx development mainboard through interposer, as well as optional cameras, microphone array, and sensors. Qualcomm QCS6490/QCM6490 IoT processor Specifications: CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU – Adreno 643L GPU @ 812 MHz with support for Open GL ES 3.2, Open CL 2.0, Vulkan 1.x, DX FL 12 DSP – Hexagon […]

Posted on by Tomisin Olujinmi - 1 Comment on Renesas RZ/V2H Cortex-A55/R8/M33 MPU comes with 80 TOPS AI accelerator for robotics and autonomous applications

Renesas RZ/V2H Cortex-A55/R8/M33 MPU comes with 80 TOPS AI accelerator for robotics and autonomous applications

Renesas RZ/V2H block chart

The RZ/V2H is the latest addition to the Reneasas family of 32-bit and 64-bit microprocessors. Renesas RZ/V2H microprocessor features four Arm Cortex-A55 application processing cores, dual Arm Cortex-R8 real-time processing cores, and one Cortex-M33 core for system management, as well as an AI accelerator with up to 80 TOPS (sparse) of performance. The RZ/V2H MPU includes the third generation of Renesas’ dynamically reconfigurable processor for AI (DRP-AI3) accelerator, a staple of the RZ/V series. The DRP-AI accelerator can run complex image AI models at a power efficiency of 10 TOPS per watt (TOPS/W), as much as 10 times higher than conventional microprocessors. Additionally, the RZ/V2H has another DRP that can be used in image processing and robotics applications. The board also comes with PCIe Gen3, USB 3.2, and Gigabit Ethernet for high-speed applications such as autonomous robotics and factory automation machine vision. It offers a performance boost over previous products […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 7 Comments on Embedded Open Source Summit 2024 schedule – Embedded Linux, Zephyr OS, and Real-time Linux

Embedded Open Source Summit 2024 schedule – Embedded Linux, Zephyr OS, and Real-time Linux

Embedded Open Source Summit 2024

The Embedded Open Source Summit 2024 (EOSS 2024) will take place on April 16-18 and the Linux Foundation has already announced the schedule with conference sessions, lightning talks, and birds of a feather (BoF) sessions covering embedded Linux, Zephyr OS, and real-time (RT) Linux. While I won’t be attending in person, I still find it interesting to check out the schedule as we may learn more about the current status of embedded Linux. So I’ve created my own little virtual schedule out of the available talks. Tuesday, April 16 – Day 1, Embedded Open Source Summit 2024 9:05 – 9:45 – No, It’s (Still) Never Too Late to Upstream Your Legacy Linux-Based Platforms by Neil Armstrong, Linaro Nearly 7 years ago, Neil already spoke about this subject in Berlin, and it’s still very true. Do you maintain or used to maintain a Linux-based board or SoC off-tree? Then there are […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on AMD Ryzen Embedded 7000 Zen 4 SoC integrates Radeon RDNA 2 graphics, up to 28 lanes of PCIe 5 connectivity

AMD Ryzen Embedded 7000 Zen 4 SoC integrates Radeon RDNA 2 graphics, up to 28 lanes of PCIe 5 connectivity

AMD Ryzen Embedded 7000

AMD Ryzen Embedded 7000 Series is a new “Zen 4” processor with integrated Radeon RDNA 2 graphics designed for high-performance embedded systems targetting industrial automation, machine vision, robotics, and edge servers. The last two Ryzen Embedded families from AMD, namely the Ryzen Embedded V3000 and Ryzen Embedded 5000, mostly targeted headless networking and storage applications since the processors lacked any 3D GPU. But the new Ryzen Embedded 7000 processors bring back graphics with a Radeon RDNA 2 GPU clocked at up to 2.2 GHz and also come with up to 12 Zen4 cores clocked at up to 5.4 GHz, and feature up to 28 lanes of PCIe 5 connectivity. Ryzen Embedded 7000 Series specifications: CPU – Up to 12-core/24-thread “Zen 4” processor GPU – Radeon RDNA 2 graphics 1WGP @ 2.2GHz max with support for AV1/VP9 decode, H.264/HEVC decode/cncode Cache – Up to 1MB L2 cache/Core, up to 32MB L3 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Cincoze DS-1400 series embedded computers feature 12th Gen Alder Lake-S processors, PCIe expansion slots

Cincoze DS-1400 series embedded computers feature 12th Gen Alder Lake-S processors, PCIe expansion slots

Cincoze DX1400

Cincoze DS-1400 series rugged embedded computer comes with a choice of 12th Gen Alder Lake-S processor, up to 64GB DDR5 ECC memory, supports two 2.5-inch SATA drives, as well as mSATA and NVMe SSD storage, and up to two PCIe expansion slots. The embedded computers also come with two Gigabit Ethernet ports, support up to four independent displays via HDMI, DisplayPort, and VGA interfaces, feature eight USB ports, two RS232/422/485 DB9 connectors, and offer 9V to 48V DC input for industrial applications.   Cincoze DS-1400 specifications: SoC – 12th Gen Alder Lake-S processor (one or the other) Intel Core i9-12900E 16 cores up to 5 GHz with Intel UHD Graphics 770; TDP: 65W Intel Core i7-12700E 12 cores up to 4.8 GHz with Intel UHD Graphics 770; TDP: 65W Intel Core i5-12500E 6 cores up to 4.5 GHz with Intel UHD Graphics 770; TDP: 65W Intel Core i3-12100E 4 cores […]

EmbeddedTS embedded systems design