Intel packaging & process roadmap to 2025 and beyond

Intel Process Technology History

Intel has a mixed history with its ability to keep production schedules for new processes, with notably its 10nm process suffering from years of delays before finally being deployed into chips. But the US company has now held an event unveiling the process & package roadmap through 2025 and beyond, which includes 7nm, 4nm, 3nm, and even the switch the angstrom scale (1A = 0.1 nm) with a 20A process expected in 2024/2025. Intel Process roadmap to 2025 and beyond On the process node sides of things, here’s what to expect in the next few years: Intel 7 delivers 10% to 15% performance-per-watt improvements, and will be found in Alder Lake for client in 2021 and Sapphire Rapids for the data center, with the latter expected to be in production in Q1 2022. Intel 4 promises a 20% performance-per-watt increase over Intel 7, and is the first Intel FinFET node […]

Intel Unveils Foveros “big.SMALL” Hybrid x86 Processor, Roadmap for Atom Processors

Once upon a time Intel manufactured mobile processors for smartphones and tablets, but they eventually gave up as their solutions failed to gain traction. However, it looks like they may be back, as one customers required them to developer a chip with higher performance than Atom processors combined with a 2 mW standby power state. The chip was developed using “Foveros” 3D stacking technology was showcased at Intel’s Architecture Day 2018, but before going into further details, let’s have a look at Atom and Core processors roadmap to 2023 unveiled at the event. First, Intel will have developed three new Atom micro-architectures going into 2023. As we’ve seen previously, Tremont will succeed Goldmont Plus microarchitecture found in Gemini Lake and Denverton processors, and improve single-threaded performance, network server performance, and battery life starting in 2019. Around 2021, Gracemont will be launched with again higher single-thread performance and frequency, as well […]