industrial News - Page 2 of 122 - CNX Software

February 27, 2026February 27, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Lepton XDS dual-camera module combines 160 x 120 thermal imager with 5MP RGB camera

The Teledyne FLIR Lepton XDS dual-camera module combines a factory‑aligned radiometric 160 × 120 Lepton 3.5 thermal camera with a 5 MP visible camera. Its size, weight, and power (SWaP)‑optimized design makes it suitable for mobile devices, compact electronics, smart buildings, fire detection, occupancy analytics, and equipment‑condition‑monitoring applications. The company highlights that the Lepton XDS module is International Traffic in Arms Regulations (ITAR)-free, which reduces development risk and accelerates time‑to‑market, since it’s easier to export or integrate into products sold globally. Lepton XDS specifications: EO Camera Optics – EFL 1.57 mm, 98.2° HFOV, F/1/2.2 Sensor – 2592 x 1944 pixels (5 MP), 1.4 µm pitch Video – 640×480 @ 30Hz IR Camera Optics – 57° HFOV, f/1.1 Video – 8.7 Hz (commercial application exportable, since it’s below 9 FPS) Thermal Imaging Detector Lepton 3.5 160 x 120 pixels, 12 µm pitch Thermal Sensitivity – <50 mK (0.050 °C) Temperature Accuracy […]

February 25, 2026February 25, 2026 by Debashis Das - No Comments

NXP TJA1410 and TJF1410 PMD transceivers enable “CAN-like” Single Pair Ethernet (SPE) connectivity

We’ve reported on 10BASE-T1S and 10BASE-T1L Single Pair Ethernet (SPE) chips from Microchip and Analog Devices in the past, which support Ethernet communication over a single twisted-pair cable. But those chips integrate a full Ethernet PHY or MAC-PHY inside the device. NXP takes a different approach with their TJA1410 (automotive) and TJF1410 (industrial) Physical Medium Dependent (PMD) transceivers. These new PMDs separate the analog physical layer from the digital Ethernet logic. By integrating the digital portion of the PHY into the host microcontroller or switch, the TJA1410 and TJF1410 only need to handle the essential analog functions for transmitting and receiving signals over the physical medium. They communicate with the host via a 3-pin OPEN Alliance (OA) interface. TJA1410 and TJF1410 PMD transceivers specifications: Networking – 10BASE-T1S (Compliant with IEEE 802.3cg and OPEN Alliance TC14,TC10 specifications) Host Interface – 3-pin OA interface (requires host MCU/switch with a 10BASE-T1S digital PHY) […]

February 24, 2026February 24, 2026 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

PocketBeagle 2 SBC gets industrial version with 1GB RAM, 64GB eMMC flash

PocketBeagle 2 Industrial 1GB RAM 64GB eMMC flash

The PocketBeagle 2 Industrial is an update to the PocketBeagle 2 Rev A1 SBC featuring 1GB DDR4 RAM, a 64GB eMMC flash, and industrial temperature range support. The original board only comes with 512MB DDR4 memory, an eMMC flash footprint (unpopulated), and commercial temperature range support. Apart from those changes, the other specifications remain the same, with a Texas Instruments AM6254 quad-core Cortex-A53 SoC, an MSPM0L1105 Cortex-M0+ microcontroller, a microSD card slot, a USB-C port, UART and JTAG debugging support, and two 36-pin GPIO headers. Another difference is that the PCB is red for the PocketBeagle 2 Industrial (like the BeagleBone Black Industrial 4G), while the PocketBeagle 2 features a black PCB. PocketBeagle 2 Industrial specifications: Main SoC – Texas Instruments AM6254 CPU Quad-core 64-bit Arm Cortex-A53 @ 1.4 GHz Arm Cortex-M4F real-time core @ 400 MHz with 256KB SRAM GPU – Imagination PowerVR Rogue AXE-1-16M with support for OpenGL […]

February 23, 2026February 23, 2026 by Debashis Das - 1 Comment

Silex SX-SDMAX6E tri-band Wi-Fi 6E + Bluetooth LE module features NXP IW623 SoC, comes in M.2 or LGA package

Silex SX SDMAX6E tri band Wi Fi 6E + Bluetooth LE module LGA(Right) M.2(Left)

Back in August last year, we wrote about NXP’s IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. Now, NXP has partnered with Silex Technology to launch the SX-SDMAX6E module, available in a surface-mount LGA package or an M.2 2230 Key-E card. The module supports Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO. It operates from a 3.3V supply with 1.8V support on the LGA version. It has an industrial operating temperature range of -40°C to +85°C and is designed for both high-throughput applications, such as video streaming, and low-power, battery-operated devices in harsh environments. It also supports various antenna options, fast roaming, and long-term lifecycle backing through Silex and NXP. Silex SX-SDMAX6E specifications: Wireless chipset – NXP IW623 tri-band SoC Connectivity Wi-Fi Tri-band Wi-Fi 6E (2.4 GHz, 5 GHz, 6 GHz) IEEE 802.11a/b/g/n/ac/ax […]

February 23, 2026February 23, 2026 by Debashis Das - No Comments

AMD VEK385 Versal AI Edge Gen 2 FPGA evaluation kit plugs directly into a PCIe Gen5/Gen4 slot

VEK385 Evaluation Kit with AMD Versal AI Edge Series Gen 2 XC2VE3858 adaptive SoC

AMD has introduced the VEK385 Evaluation Kit built around the Versal AI Edge Gen 2 XC2VE3858 SoC FPGA, which combines eight Cortex-A78AE cores, ten Cortex-R52 cores, FPGA fabric with 543,104 LUTs, 144 AI Engine-ML v2 tiles (up to 184 INT8 TOPS), 2,064 DSPs, a Mali-G78AE GPU, and an integrated ISP. The kit features 20 GB of LPDDR5X memory, a PCIe x8 edge connector supporting Gen5 x4 and Gen3/4 x8, and two HDMI 2.1 RX/TX ports for video. There is also an SFP28 port for 25–100 Gb/s Ethernet, and CAN-FD alongside PL/PS Ethernet for deterministic control applications. The board is designed to accelerate prototyping for automotive (ADAS, autonomous driving), industrial (AMR, edge AI boxes), healthcare (ultrasound, endoscopy, 3D imaging), and aerospace-grade systems. VEK385 Evaluation Kit specifications Adaptive SoC – AMD Versal AI Edge Series Gen 2 XC2VE3858-2MSESSVA2112 heterogeneous adaptive SoC CPU – 8x Arm Cortex-A78AE application cores Real-time – 10x Arm Cortex-R52 […]

February 23, 2026February 23, 2026 by Debashis Das - No Comments

OnLogic Factor 101 – A fanless industrial edge AI computer with Qualcomm QCS6490 SoC, 10GbE networking

Onlogic Factor 101 Qualcomm QCS6490 powered industrial computer

The OnLogic Factor 101 (FR101) is an ultra-small form factor, fanless industrial computer built around the Qualcomm QCS6490 platform for edge AI and data gateway applications. Designed for space-constrained applications, it targets light machine vision, inspection, monitoring, and low-speed autonomous systems. The octa-core Qualcomm Kryo 670 (Cortex-A78/A55-class) processor is paired with 8GB LPDDR4x memory and 128GB UFS flash storage. The fanless system features 10GbE and Gigabit Ethernet ports, five USB ports, and HDMI and USB-C (DisplayPort) video output. Its compliance with various standards makes it suitable for general office and industrial edge deployments. OnLogic Factor 101 specifications: SoC – Qualcomm Dragonwing QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU – Adreno 643L GPU @ 812 MHz with support for Open GL ES 3.2, Open CL 2.0, Vulkan […]

February 20, 2026February 20, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

MediaTek Genio 360/360P hexa/octa-core Cortex-A76/A55 AIoT SoC features 8 TOPS NPU for cost-sensitive embedded applications

MediaTek Genio 360 and Genio 360P are respectively hexa-core and octa-core Arm Cortex-A76/A55 AIoT processors featuring a MediaTek NPU delivering up to 8 TOPS of AI performance, and designed for cost-sensitive embedded applications. The chips support up to 8GB of memory and eMMC 5.1, SPI NOR, and SD 3.0 storage interfaces. They feature two 4-lane MIPI DSI and one 4-lane DP/eDP interfaces for single or dual display setups, two 4-lane MIPI CSI camera interfaces, audio inputs/outputs, Gigabit Ethernet with TSN, optional WiFi 5 and Bluetooth 5.3 via MT6631N, USB 3.1 and USB 2.0 interfaces, PCIe Gen2 x1, and low-speed interfaces. MediaTek Genio 360/360P specifications: CPU MediaTek Genio 360 (MT8366) – Hexa-core processor 1x Arm Cortex-A76 core clocked at up to 1.9 GHz (industrial) / 2.0GHz (commercial) 5x Arm Cortex-A55 cores clocked at up to 1.7 GHz (industrial) / 2.0GHz (commercial) MediaTek Genio 360P (MT8367) – Octa-core processor 2x Arm Cortex-A76 […]

February 13, 2026February 13, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Avalue EMX-PTLP – A thin mini-ITX motherboard powered by up to an Intel Core Ultra 7 358H Panther Lake-H SoC

Intel Panther Lake-H thin mini-ITX motherboard

Avalue’s EMX-PTLP is an industrial, thin mini-ITX motherboard powered by Intel Panther Lake-H Core Ultra (Series 3) family, up to the 12-core Intel Core Ultra 7 358H SoC delivering up to 180 TOPS for AI and industrial automation deployments. The board supports up to 64GB of DDR5 SoDIMM/CSoDIMM memory, features M.2 PCIe 5.0 and PCIe 4.0 sockets for storage and expansion, M.2 E-Key and B-Key sockets for wireless and cellular connectivity, a PCIe x8 slot, HDMI, DisplayPort, USB-C, and LVDS/eDP display interfaces, GbE and 2.5GbE networking interfaces, a range of USB4, USB 3.2, and USB 2.0 interfaces, and more. Avalue EMX-PTLP specifications: SoC – Intel Panther Lake processor with Intel Xe LPG graphics (one or the other) Intel Core Ultra 5 322 6-core (2P + 4LPE) CPU at up to 4.4 GHz with 12MB Smart Cache, 2x Xe core Intel Graphics (18 TOPS), AI accelerator (46 TOPS); PBP: 25 Watts […]