industrial

Posted on by Debashis Das - No Comments on Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec has recently announced Six new COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core(Raptor Lake) processors. The module comes with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W.

We’ve noticed a surge in the popularity of COM Express modules and Congatec has recently announced six new conga-TC675r COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core (Raptor Lake) processors that happen to come with soldered RAM instead of the usual SO-DIMM memory slots found in this form factor. The modules come with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W. According to Congatec, this device is designed to work under extreme temperatures (-40°C to +85°C), and is built to withstand the highest standards for shock and vibrations notably thanks to the user of soldered onboard RAM, making this device suitable for off-road vehicles for mining, construction, agriculture, forestry, and other demanding mobility applications. Previously we have seen manufacturers like ADLINK announce COM Express modules based on the 13th Gen architecture, and both ADLINK and Congatec have also just […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on AMD Ryzen Embedded V3000 COM Express Type 7 module supports up to 64GB DDR5 memory

AMD Ryzen Embedded V3000 COM Express Type 7 module supports up to 64GB DDR5 memory

AMD Ryzen V3000 COM Express Module

ADLINK Express VR7 is a COM Express Basic size Type 7 computer-on-module powered by the eight-core AMD Ryzen Embedded V3000 processor with two 10GbE interfaces, fourteen PCIe Gen 4 lanes, and optional support for the “extreme temperature range” between -40°C and 85°C. The COM Express module supports up to 64GB dual-channel DDR5 SO-DIMM  (ECC/non-ECC) memory and targets headless embedded applications such as edge networking equipment, 5G infrastructure at the edge, video storage analytics, intelligent surveillance, industrial automation and control, and rugged edge servers. Express-VR7 specifications: SoC – AMD Embedded Ryzen V3000 (one or the other Ryzen V3C48 8-core/16-thread processor @ 3.3/3.8GHz; TDP: 45W Ryzen V3C44 4-core/8-thread processor @ 3.5/3.8GHz; TDP: 45W Ryzen V3C18I 8-core/16-thread processor 1.9/3.8GHz; TDP: 15W (useful in the extreme temperature range) Ryzen V3C16 6-core/12-thread processor 2.0/3.8GHz; TDP: 15W Ryzen V3C14 4-core/8-thread processor 2.3/3.8GHz; TDP: 15W System Memory – Up to 64GB (2x 32GB) dual-channel ECC/non-ECC DDR5 memory […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Robustel introduces EG5101 and EG5200 Debian 11 industrial IoT gateways with 4G LTE cellular connectivity

Robustel introduces EG5101 and EG5200 Debian 11 industrial IoT gateways with 4G LTE cellular connectivity

Robustel EG5101 EG5200 Debian 11 industrial gateways

Robustel introduced the EG5101 and EG5200 industrial IoT gateways running Debian 11 a few weeks ago, both with 4G LTE cellular connectivity, but the NXP i.MX 6ULL-based EG5101 has a more compact design, while the NXP i.MX 8M Plus-powered EG5200 provides more I/Os and resources. Expanding the earlier EG5100, EG5120, and LG5100 models from the company, the two edge computing gateways target Industry 4.0 and smart infrastructure applications and enable real-time analytics at the edge with lower latency than running workloads in the cloud. Robustel EG5101 and EG5200 SoC/Memory/Storage EG5101 NXP i.MX 6ULL Cortex-A7 32-bit processor @ 792 MHz 512MB to 1024MB DDR3 8GB eMMC flash EG5200 NXP i.MX 8M Plus quad-core Cortex-A53 64-bit processor @ 1.6 GHz with 2.3 TOPS NPU 4GB DDR4 32GB eMMC flash, microSD card socket Connectivity EG5101 1x 10/100 Mbps Ethernet port 4G LTE with 1x SMA-K antenna connector, 2x Mini SIM (2FF) EG5200 5x […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Cincoze P2202 Alder Lake-P embedded computer powers industrial panel PCs

Cincoze P2202 Alder Lake-P embedded computer powers industrial panel PCs

Alder Lake-P industrial Panel PCs

Cincoze P2202 is an Intel Alder Lake-P embedded computer based on the Core i3-1215UE or Core i5-1245UE processor and designed for industrial, sunlight readable, or open-frame panel PCs from the company with sizes ranging from 12.1-inch to 24-inch. The P2202 supports up to 64GB DDR5 memory and two 2.5-inch SATA drives, and the system also offers four display interfaces including the company’s CDS (Convertible Display System) interface, two gigabit Ethernet ports, optional WiFi and 4G LTE/5G connectivity, multiple USB ports, four serial RS232/RS422/RS485 ports, digital I/Os, and various M.2, mPCIe, and PCIe sockets and slots for expansion. Cincoze P2202 specifications: Intel Alder Lake-P U-series SoC (one or the other) Intel Core i3-1215UE hexa-core processor up to 4.40 GHz with Intel UHD Graphics; TDP: 15W Intel Core i5-1245UE deca-core processor up to 4.40 GHz with Intel Iris Xe Graphics; TDP 15W System Memory – 2x DDR5 4800MHz SO-DIMM sockets for up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on MediaTek unveils 5G RedCap solutions: M60 5G modem and T300 Arm Cortex-A35 SoC

MediaTek unveils 5G RedCap solutions: M60 5G modem and T300 Arm Cortex-A35 SoC

MediaTek M60 5G RedCap Modem

MediaTek has introduced its first 5G RedCap solutions with the M60 5G modem and the MediaTek T300 Arm Cortex-A35 SoC design to bring 5G-NR to wearables, light-weight AR devices, IoT modules, and consumer and industrial Edge AI devices. 5G RedCap (Reduced Capability), part of 3GPP Release 17, aims to keep some 5G features such as low latency, low power consumption, enhanced security, and network slicing while limiting the bandwidth (to around 85 Mbps) in order to be used in IoT devices and products that may not need the bandwidth required by smartphones and computers, but would benefit from longer battery life and a smaller footprint. MediaTek claims to be the first company to unveil 5G RedCap chips with the M60 modem and T300 SoC. MediaTek M60 key features and specifications: 3GPP Release 17 standard 5G modem R17 UE power saving R17 Coverage enhancement R17 Small data transmission LTE & NR-FR1 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 7 Comments on STMicro STM32WL3 sub-GHz wireless MCU targets smart metering, smart building, and industrial monitoring

STMicro STM32WL3 sub-GHz wireless MCU targets smart metering, smart building, and industrial monitoring

STM32WL3

STMicroelectronics STM32WL3 is an Arm Cortex-M0+ low-power, long-range, multi-protocol wireless microcontroller working in sub-GHz ISM frequency bands, namely 413MHz – 479MHz, 826MHz – 958MHz, and soon 169MHz (2024) for protocols such as wireless M-Bus (mode N) and Wize. The multi-protocol and multi-modulation radio supports 4-(G)FSK up to 600kbit/s, 2-(G)FSK, (G)MSK, DBPSK, DSSS, OOK, ASK modulation schemes suitable for proprietary and standardized wireless protocols such as Sigfox, KNX, WiSun, mioty, M-Bus, and others. STMicro also claims to have implemented new power-saving features that extend the battery life to up to 15 years.   STM32WL3 key features and specifications: MCU Core – Arm Cortex-M0+ up to 64 MHz Memory – 16KB or 32KB SRAM with full retention Storage 128KB or 256KB flash 1 KB OTP flash (user data) Wireless RF bands – 413-479 MHz, 826-958 MHz, and soon 169 MHz Data rate – 0.1 to 600 kbit/s Tx power – up to […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on AAEON PICO-ADN4 Pico-ITX Alder Lake-N SBC features Processor N50 to Atom x7425E SoC

AAEON PICO-ADN4 Pico-ITX Alder Lake-N SBC features Processor N50 to Atom x7425E SoC

AAEON PICO-ADN4

AAEON PICO-ADN4 Pico-ITX SBC comes with a choice of four Alder Lake-N processors – Processor N50, Processor N97, Core i3-N305, or Atom x7425E – and is available in SKUs with both standard (0°C ~ 60°C) and wide-temperature (-40°C ~ 85°C) ranges for industrial applications. The single board computer comes with up to 16GB LPDDR5, SATA and mSATA storage, three display interfaces (HDMI, eDP/LVDS, DDI), dual Ethernet with 2.5GbE and GbE RJ45 ports, USB 3.2 Gen 2 ports, and M.2 and mPCIe sockets for expansion. The board supports 12V DC power input by default, but AAEON company offers a 9V to 36V DC input option. PICO-ADN4 specifications: Alder Lake-N SoC (one or the other) Intel Processor N50 dual-core processor up to 3.4 GHz with 6MB cache, 16EU Intel UHD Graphics; TDP: 6W Intel Processor N97 quad-core processor up to 3.6 GHz with 6MB cache, 24EU Intel UHD Graphics; TDP: 12W Intel […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 4 Comments on Renesas RZ/G2UL Arm Cortex-A55/Cortex-M33 industrial system-on-module sells for as low as $17 in volume

Renesas RZ/G2UL Arm Cortex-A55/Cortex-M33 industrial system-on-module sells for as low as $17 in volume

Renesas RZ/G2UL development board

MYiR Tech MYC-YG2UL is a tiny (39x37mm) system-on-module based on the Renesas RZ/G2UL SoC with a 1GHz Arm Cortex-A55 application core and 200MHz real-time Cortex-M33 cores designed for industrial HMIs and gateways, and the company has also launched the MYD-YG2UL development board with the module and interfaces such dual gigabit Ethernet, RS485, RS232, CAN Bus, and more. MYC-YG2UL Renesas RZ/G2UL CPU module Specifications: SoC – Renesas RZ/G2UL (Type-I) CPU – Arm Cortex-A55 processor at up to 1 GHz MCU – Arm Cortex-M33 clocked at up to 200 MHz GPU – 2D graphics (Image Scaling Unit) System Memory – 512MB DDR3L Storage – 4GB eMMC flash, 4KB EEPROM 1.0mm pitch 140-pin castellated holes and 50-pin LGA Display – RGB LCD interface Camera – MIPI CSI interface Networking – 2x RGMII (gigabit Ethernet) USB – 2x USB 2.0 Analog – 2x ADC Other I/Os – 5x SCIF, 2x SCI, 2x CAN FD, 4x […]