We’ve already covered some COM Express modules based on AMD Ryzen Embedded V2000 processors with products like ADLINK cExpress-AR COM Express Type 6 Compact computer-on-module, but Kontron COMe-bV26 is the first we’ve seen that follow COM Express Basic Type 6 standard. The module supports up to 64GB DDR4 via two SO-DIMM connectors, up to 1TB NVMe onboard SSD, exposes 8x PCIe lanes, and with an 8-core/16-thread Ryzen Embedded V2000 processor is well-suited to IoT edge devices that must perform parallel processing tasks. Kontron COMe-bV26 specifications: AMD Embedded V2000 SoC AMD V2748 octa-core/16-thread processor @ 2.9 GHz / 4.15 GHz (Turbo) with 4MB L2 cache, 7CUs Radeon RX Vega 7 GPU @ 1.6 GHz; TDP: 35-54W AMD V2718 octa-core/16-thread processor @ 1.7 GHz / 4.15 GHz (Turbo) with 4MB L2 cache, 7CUs Radeon RX Vega 7 GPU @ 1.6 GHz; TDP: 10-25W AMD V2546 hexa-core/12-thread processor @ 3.0 GHz / 3.95 […]
WM1302 LoRaWAN gateway mini PCIe module works over SPI or USB
Announced in 2019, Semtech SX1302 LoRa transceiver is designed for cheaper, and more efficient LoRaWAN gateways, and we’ve seen it in mini PCIe concentrator cards such as nFuse SX1302 and Rak Wireless RAK2287 using USB or SPI host interfaces. Seeed Studio adds another option with WM1302 LoRaWAN gateway mPCIe module using either SPI or USB interfaces and supporting 868 or 915 MHz frequency bands. WM1302 module specifications: MCU – STMicro STM3L412 Arm Cortex-M4 microcontroller @ 80 MHz with 40KB RAM, 64 or 128KB flash LoRa Connectivity Semtech SX1302 LoRa Transceiver with 2x SX1250 Tx/Rx front-ends Tx power – Up to 26dBm @ 3.3V Rx sensitivity – Down to -139dBm @ SF12, BW 125 kHz; -125dBm @ 125K/SF7 LoRaWAN 1.0.2 compatible. LoRa band coverage – EU868, US915, AS923, AS920, AU915, KR920, and IN865. u.FL antenna connector Misc – Power, Config, and Tx/Rx LEDs Host Interface – SPI or USB interface on […]
Axiomtek’s Compact Fanless Embedded System Features Intel Processors
Axiomtek has announced eBOX560-52R-FL, which is a palm-size fanless embedded system featuring Intel Core and Celeron Whiskey Lake-U processors. We also saw ICP Germany’s fanless Linux embedded system featuring NXP i.MX 8M processor. This device was dedicated to IoT gateways and data acquisition applications. In contrast, the eBOX560-52R-FL fanless embedded system is for more diverse use cases including machine and logistics automation, station gate controls, and ticket vending machines. The eBOX560-52R-FL fanless embedded system comes with two independent 4K Ultra HD displays via DisplayPort++ and HDMI ports. The device features 2 GbE LAN for faster communication and networking, as well as one M.2 Key E 2230 for the Wi-Fi module. The embedded system can endure up to 50G shock and 3Grms vibration thus suitable for industrial applications. The operating temperature of the device ranges from -10°C to +50°C with 0.7 m/s airflow whereas the storage temperature ranges from -20°C to […]
ESP32-C3-DevKitM-1 RISC-V WiFI & BLE board to launch for $8, modules for $1.8+
ESP32-C3 may be one of the most expected RISC-V processors in the IoT world, as it’s eventually expected to sell for the same price as ESP8266 and offers both WiFi and Bluetooth LE connectivity. Some engineering samples of the chip. modules and boards were distributed to developers shortly after the announcement at the end of the last year, but now it appears ESP32-C3-DevKitM-1 board will become available for $8 next month from distributors such as Mouser or DigiKey. Since I’ve never written about ESP32-C3-DevKitM-1 board let’s check out the specifications: Wireless module – ESP32-C3-MINI-1 with ESP32-C3FH4 (105°C) or ESP32-C3FN4 (85°C) 32-bit RISC-V single-core processor, up to 160 MHz, 4 MB embedded flash, 384 KB ROM, 400 KB SRAM (16 KB for cache), 8 KB SRAM in RTC Connectivity – 2.4 GHz 802.11b/g/n Wi-Fi 4 & Bluetooth LE 5.0 USB – 1x Micro USB port for power and programming via USB-UART […]
Firefly unveils Core-3568J AI Core Rockchip RK3568 system-on-module & devkit
Firefly has unveiled a new 314-pin SO-DIMM system-on-module (SoM) with Core-3568J AI Core powered by Rockchip RK3568 processor and equipped with up to 8GB RAM, 128GB eMMC flash with interfaces including PCIe, SATA, dual Gigabit Ethernet, HDMI 2.0, eDP 1.3, MIPI DSI and more. The company also provides AIO-3568J development kit for the module with all those interfaces plus an M.2 socket for 5G or WiFi 6 connectivity, and PoE support among other features. Core-3568J AI Core system-on-module Specifications: SoC – Rockchip RK3568 quad-core Cortex-A55 processor @ 2.0 GHz with Arm Mali-G52 2EE GPU with support for OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, 0.8 TOPS NPU for AI acceleration, 4Kp60 H.265/H.264/VP9 video decoding, and 1080p100 H.265/H.264 video encoding System Memory – 2GB, 4GB, or 8GB LPDDR4 ECC RAM up to 1600 MHz Storage – 32GB, 64GB, or 128GB eMMC flash 314-pin SO-DIMM edge connector with: Storage – SATA 3.0 […]
MicTrack MT700 Cat M1 & NB-IoT GPS tracker promises up to 8 years of battery life
We’ve covered several Mictrack cellular GPS asset trackers in the past starting with the MT600 4G LTE model, later followed by MT825 with more efficient LTE Cat M1 & NB-IoT connectivity. The company has now introduced a new model with MicTrack MT700 still offering eMTC and NB-IoT cellular networking but with a much larger 7,800mAh battery allowing up to 8 years of battery life with a single daily location update. Mictrack MT700 specifications: Connectivity Cat M1 (LTE-M, eMTC) LTE FDD: B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/B20/B26/B28 LTE TDD: B39 NB-IoT (Cat NB1) – LTE FDD: B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/B20/B26/B28 2G GSM fallback – 850/900/1800/1900Mhz Internal Micro 3FF SIM Optional WiFi Internal antennas GNSS – Qualcomm Gen 8C GNSS receiver (GPS+Glonass+Galileo+Beidou) plus internal GPS antenna Sensors – 3-Axis accelerometer, light sensor Misc – Charge/SYS/GPS LEDs Power Supply – 5V/2A via Micro USB port Power Consumption – <1.5ua standby current (in lowest power configuration) Battery Rechargeable 3.7V/7,800mAh Li-ion battery for […]
ADLINK launches SMARC Short Size Module, Devkit with NXP i.MX 8M Plus
We had seen many i.MX 8M Plus modules with built-in AI accelerator announced at Embedded World 2021, including two SMARC modules from Congatec and iWave Systems. ADLINK has added another of i.MX 8M Plus module compliant with SMARC 2.1 “short” standard with LEC-IMX8MP system-on-module equipped with up to 8GB RAM, 128 GB eMMC flash, as well as a development kit called I-Pi SMARC IMX8M Plus prototyping platform. LEC-IMX8MP module specifications Specifications: SoC – NXP i.MX8M Plus with quad-core ARM Cortex-A53 processor, Vivante GC380 2D GPU and GC7000UL 3D GPU, 1080p60 video decoder & encoder, optional 2.3 TOPS Neural Processing Unit (NPU) System Memory – 2/4/8GB LPDDR4L-4266 Storage – 16, 32, 64, or 128GB eMMC flash (build option) Wireless – Optional 802.11 ac/a/b/g/n WiFi 5 2X2 MIMO and Bluetooth 5.0 module 314-pin MXM 3.0 edge connector Storage – 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 Display – […]
Microsoft previews Azure Percept Edge AI development platform
Microsoft has recently announced the public preview of Azure Percept platform combining hardware and services to ease AI implementations at the edge through the use of Azure AI technologies and Azure cloud for device management, AI model development, and analytics. The hardware currently available includes the Azure Percept DK (Development Kit) with an NXP i.MX 8M powered WiFi & Bluetooth gateway/carrier board, the Azure Percept Vision system on module (SoM), as well as the optional Azure Percept Audio SoM with a 4-mic array. Key features and specifications: Azure Percept DK carrier board SoC – NXP iMX 8M quad-core Cortex-A53 processor System Memory – 4GB RAM Storage – 16GB flash Connectivity – Ethernet, WiFi and Bluetooth connectivity via Realtek USB – 2x USB-A 3.0 port, 1x USB-C port Security – Nuvoton NCPT750 Trusted Platform Module (TPM) version 2.0 Power Supply – 19V/3.4A Systems-on-Module Azure Percept Vision SoM based on Intel Movidius […]