Snapdragon 888 Mobile Hardware Development Kit ships with 12GB RAM, 256GB UFS storage

Snapdragon 888 Mobile Hardware Development Kit

Snapdragon 888 is the latest premium mobile SoC from Qualcomm with the octa-core processor combining one Cortex-X1 core, three Cortex-A78 cores, and four low-power Cortex-A55 cores, with Adreno 660 GPU and Snapdragon X60 5G modem. The processor will likely most be found in smartphones, but Qualcomm partnered with Lantronix to launch the Snapdragon 888 Mobile Hardware Development Kit designed for Android app developers, hardware vendors, and original equipment manufacturers (OEMs). Snapdragon 888 development board specifications: SoC – Qualcomm Snapdragon 888 (SM8350) octa-core Qualcomm Kryo 680 CPU with 1x Cortex-X1 core @ 2.84 GHz, 3x Cortex-A78 cores @ 2.42 GHz, and 4x Cortex-A55 cores @ 1.80 GHz, Adreno 660 GPU with support for OpenCL 2.0 FP, OpenGL ES 3.2, Vulkan 1.1, DX12, and up to 8K 360 VR video playback, Hexagon 780 DSP System Memory – 12GB LPDDR5 PoP memory Storage – 256GB UFS 3.0 flash, 1x MicroSD/UFS card Display HDMI 2.0 output up to 4K UHD DisplayPort 1.4 over USB3.1 […]

Qualcomm QCS610 micro SoM and devkit to power AI and ML smart cameras

Qualcomm QCS610 Development Board

Last July, we missed Qualcomm’s announcement of QCS410 and QCS610 processors designed to bring “premium camera technology, including powerful artificial intelligence and machine learning features formerly only available to high-end devices, into mid-tier camera segments”. The new SoC’s were recently brought to our attention by Lantronix as they have just introduced a new Open-Q 610 micro system-on-module (μSOM) based on Qualcomm QCS610 processor, as well as a development kit designed to bring such smart cameras to market. I first got a bit confused by the product name, but this goes without saying that it is completely unrelated to Qualcomm Snapdragon 610 announced over six years ago. Open-Q 610 micro system-on-module Open-Q 610 specifications: SoC – Qualcomm QCS610 CPU – Octa-core processor with 2x Kryo 460 Gold cores @ 2.2 GHz (Cortex-A76 class), and 6x Kryo 430 Silver low-power cores @ 1.8GHz (Cortex-A55 class) GPU – Qualcomm Adreno 612 GPU @ 845 MHz, with OpenGL ES 3.2, Vulkan 1.1, OpenCL 2.0 […]

Lantronix Open-Q 865XR SoM Brings Snapdragon XR2 Processor Beyond Virtual Reality

Lantronix Snapdragon XR2 Development Kit

Qualcomm Snapdragon XR2 (SXR2130P) is the latest and most powerful virtual & extended reality processor from the company and Facebook recently announced it would be found in their Oculus Quest 2 standalone VR headset. But it now looks like the processor will be used well beyond virtual reality applications as Lantronix has unveiled a Snapdragon XR2 SoM with Open-Q 865XR system-on-module designed for AI boxes, video conference systems, multi-camera systems, machine vision platforms, advanced high-resolution multi-display systems, medical imaging, and handheld data collectors. Open-Q 865XR SoM specifications: SoC – Qualcomm SXR2130P (Snapdragon XR2) Octa-core processor with 1x Kryo Gold prime @ 2.84 GHz + 3x Kryo Gold @ 2.42 GHz + 4x Kryo Silver @ 1.81 GHz Adreno 650 GPU @ up to 587 MHz Hexagon 698 DSP with quad Hexagon Vector eXtensions Spectra 480 Image Signal Processor Adreno 665 Video Processing unit for decode up to 4K240/8K60, encode up to 4K120/8K30, concurrent 4K60 decode & 4K30 encode for wireless […]

Lantronix XPort Pro Lx6 is a Tiny Embedded Linux Server Fitted into an RJ45 Connector

Lantronix has recently launched XPort(R) Pro Lx6, a secure embedded device server supporting IPv6, that barely larger than an RJ45 connector. The device runs Linux or the company’s Evolution OS, and is destined to be used in wired industrial IoT / M2M applications. Lantronix XPort Pro Lx6 Specifications: Processor – Freescale ColdFire MCF5208 up to 166.67 MHz (TBC) 32-bit processor System memory – 16MB SDRAM Storage – 16MB Flash Serial Interface –  Software selectable data rates from 300 to 921kbps Programmable IO – 3 PIO pins (software selectable) Network Interface – 10Base-T and 100Base-TX Link with support for IPv4 and IPv6, and the following protocols: TCP/IP, UDP/IP, ARP, ICMP, SNMPv2, TFTP, FTP, Telnet, DHCP, BOOTP, HTTP, SMTP, PPP, AutoIP, RSS, and SYSLOG Security – TCP/AES and UDP/AES Temperature Range – Operating and storage: -40° to +85° C Relative Humidity – 0% to 90% non-condensing Regulatory Approvals – FCC Part 15, Subpart B, Class B, ICES-003 Issue 4 (2004), Class B, EN55022:2006 […]

Lantronix Unveils xPico Wi-Fi Module For the Internet of Things

With Texas Instruments SimpleLink Wi-Fi CC3000 and Qualcomm Atheros AR4100P embedded Wi-Fi processors that fully handle Wi-Fi internally, and transfer data to an MCU with an SPI interface, and solutions such as Electric Imp, there are already ways to add Wi-Fi at relatively low cost to appliances. There’s now another solution available on the market with Lantronix xPico Wi-Fi Module. Listed features and specification of xPico Wi-Fi: SoC – ARM Cortex M3 class processor with 1MB on-chip Flash and 128 KB SRAM Storage – SPI Flash storage Wireless LAN Interface IEEE 802.11 b/g and IEEE 802.11n (single stream) WLAN interface (2.4 GHz only) IEEE 802.11 d/h/i/j/k/w/r WPS 2.0 support u.FL connector for external antenna Serial Interface Two Serial CMOS Ports (3.3V, 5V tolerant) 300 to 921.6 Kbps Flow control XON/XOFF, RTS/CTS (SPort 1 only) Lantronix tunneling application (SPort 1 only) Host Interface –  Dual Serial Port, SPI, USB 2.0 (device), 8 GPIOs Network Protocols – TCP/IP, UDP/IP, DHCP, ARP, ICMP, […]