Qualcomm Snapdragon XR2 (SXR2130P) is the latest and most powerful virtual & extended reality processor from the company and Facebook recently announced it would be found in their Oculus Quest 2 standalone VR headset.
But it now looks like the processor will be used well beyond virtual reality applications as Lantronix has unveiled a Snapdragon XR2 SoM with Open-Q 865XR system-on-module designed for AI boxes, video conference systems, multi-camera systems, machine vision platforms, advanced high-resolution multi-display systems, medical imaging, and handheld data collectors.
Open-Q 865XR SoM
- SoC – Qualcomm SXR2130P (Snapdragon XR2)
- Octa-core processor with 1x Kryo Gold prime @ 2.84 GHz + 3x Kryo Gold @ 2.42 GHz + 4x Kryo Silver @ 1.81 GHz
- Adreno 650 GPU @ up to 587 MHz
- Hexagon 698 DSP with quad Hexagon Vector eXtensions
- Spectra 480 Image Signal Processor
- Adreno 665 Video Processing unit for decode up to 4K240/8K60, encode up to 4K120/8K30, concurrent 4K60 decode & 4K30 encode for wireless display
- Adreno 995 Display Processing unit
- NPU230 Neural Processing unit
- SPU240 Secure Processing unit
- System Memory + Storage Configurations
- 6GB LPDDR5 @ 2750MHz + 64GB UFS 2.1
- 8GB LPDDR5 @ 2750MHz + 128GB UFS 2.1
- Wireless – 802.11ax WiFi 6 2×2 MU-MIMO, Bluetooth 5.1,” Bluetooth Milan” ready (what is that?)
- 3x board-to-board connectors (2x 100-pin + 1x 120-pin) offering
- Display Interfaces
- 2x 4-lane MIPI DSI D-PHY 1.2 up to 5040 × 2160 @ 60 fps (or 120 Hz in VR mode) + touchscreen support
- DisplayPort v1.4 on USB Type-C, at 8.1 Gbps/lane, with USB3 and USB2 data concurrency
- Up to three 4K displays
- Camera Support
- 3x 4-lane MIPI CSI camera ports + CCI I2C control
- 64 MP 30 fps ZSL with a dual ISP
- Audio
- Supports WCD938x high fidelity audio codec and WSA881x speaker amp on carrier board
- SoundWire, MI2S, DMIC, TDM/PCM interfaces for audio devices on carrier board
- USB
- 1x USB3.1 with support for Type-C + DisplayPort v1.4 with USB SS data concurrency
- 1x USB 3.1 for Type-A connector
- 1x PCIe Gen3 2-lane
- 4-bit SD 3.0, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O
- Display Interfaces
- Power Management
- Input Voltage – 3.7V nominal
- Battery charging solution on SOM
- Dimensions – 50 x 29 mm
Snapdragon XR2 AI Engine is said to provide twice the performance of the previous generation with up to 15 TOPS (trillion operations per second), and the company provides an Android 10 BSP for the module and notes that “all hardware features may not be supported by SW”.
Open-Q 865XR SoM Development Kit
To make evaluation easier, and allow their customers to start software development as soon as possible, Lantronix also provides the Open-Q 865XR SOM Development Kit comprise of the Snapdragon XR2 SoM and a mini-ITX carrier board with the following key features:
- Storage – MicroSD card socket
- Display I/F
- 2x 4 lane MIPI DSI connector for optional LCD / touch panel
- DisplayPort v1.4 via USB Type-C
- Camera Interfaces – 3x 4-lane MIPI CSI for optional camera accessories
- Audio
- Qualcomm WCD9381 Hi-Fi audio codec
- 3.5mm headset jack (stereo out + mic in)
- Analog out header, Analog in header, digital I/O header (SoundWire/DMIC/MI2S/PDM)
- USB – 1x USB3.1 Type-C port, 1x USB 3.1 Type-A host
- Expansion
- 1x PCIe Gen3 2-lane M.2 socket
- I/O expansion headers for sensor board, UART, I2C, SPI, configurable GPIOs
- Debugging – UART via serial USB
- Power Supply – 12V/3A or single-cell Li-Ion battery (not included)
- Dimensions – 170 x 170 mm
Both the module and development kit are available now with the 6GB/64GB version of Open-Q 865XR SoM going for $445 on Intrinsyc online store, while the mini-ITX development kit sells for $995 with the CPU module, carrier board, power supply, and other accessories, but not the LCD and camera which are sold separately.
Additional information may be found on the product page on Lantronix website.
Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.
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