Linux 6.2 release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.2 release

Linux 6.2 has just been released with Linus Torvalds making the announcement on LKML as usual: So here we are, right on (the extended) schedule, with 6.2 out. Nothing unexpected happened last week, with just a random selection of small fixes spread all over, with nothing really standing out. The shortlog is tiny and appended below, you can scroll through it if you’re bored. Wed have a couple of small things that Thorsten was tracking on the regression side, but I wasn’t going to apply any last-minute patches that weren’t actively pushed by maintainers, so they will have to show up for stable. Nothing seemed even remotely worth trying to delay things for. And this obviously means that the 6.3 merge window will open tomorrow, and I already have 30+ pull requests queued up, which I really appreciate. I like how people have started to take the whole “ready for […]

MediaTek Dimensity 7200 Armv9 Cortex-A715/A510 processor targets mainstream 5G smartphones

MediaTek Dimensity 7200

Manufactured with a 4nm processor, the MediaTek Dimensity 7200 is an octa-core Armv9 processor designed for mainstream smartphones. with two Cortex-A715 cores, six Cortex-A510 cores, a Mali-G610 MC4 GPU, as well as 5G, WiFi 6E, and Bluetooth 5.3 connectivity. So far, I had only seen Armv9 SoCs with a mix of Cortex-A510 “LITTLE” cores, Cortex-A710/A715 “big” core, and Cortex-X2 or Cortex-X3 “flagship cores” as found in the Dimensity 9200 processor,  but the Dimensity 7200 is one of the first Armv9 processors – one other being the Snapdragon 7 Gen 1 – without a Cortex-X core in order to provide a more affordable solution. MediaTek Dimensity 7200 specifications: CPU 2x Arm Cortex-A715 up to 2.8GHz 6x Arm Cortex-A510 2MB L3 cache GPU – Arm Mali-G610 MC4 with MediaTek HyperEngine 5.0 APU – MediaTek APU 650 AI accelerator DPU/VPU – MediaTek MiraVision 765 engine for display and 4K HDR video decoding/encoding Memory […]

Bluetooth 5.4 adds electronic shelf label (ESL) support

Bluetooth 5.4

The Bluetooth Special Interest Group (SIG) has just adopted the Bluetooth 5.4 Core Specification with features such as PAwR and EAD designed for Electronic Shelf Label (ESL) systems. The Bluetooth 5.3 Core Specification was adopted in August 2021 with various improvements, and Bluetooth 5.4 now follows with features that appear to be mainly interesting for large-scale Bluetooth networks with support for bi-directional communication with thousands of end nodes from a single access point, as would be the case for Electronic Shelf Label or Shelf Sensor systems. Four new features have been added to Bluetooth 5.4: Periodic Advertising with Responses (PAwR) – PAwR is a new Bluetooth Low Energy (LE) logical transport that provides a way to perform energy-efficient, bi-directional, communication in a large-scale one-to-many topology with up to up to 32,640 devices. Devices can also be allocated to groups allowing them to listen only to their group’s transmissions. An Electronic […]

Eoxys Xeno+ Nano ML board combines NuMicro M2354 or STM32L4 MCU with Talaria TWO ultra low power WiFi & BLE 5.0 module

Eoxys Xeno+ Nano ML board

Eoxys Xeno+ Nano ML is a wireless machine learning (ML) board with either Nuvoton NuMicro M2354 or STMicro STM32L4 microcontroller, InnoPhase IoT’s Talaria TWO ultra-low power Wi-Fi and BLE 5.0 module, and the Syntiant Core 2 NDP120 neural decision processor we first noticed in the Arduino Nicla Voice module a few weeks ago. The boards/modules are designed for intelligent and secure IoT devices for smart home, industrial, and medical automation applications, and the company claims it can be used in Wi-Fi IoT sensors with up to 10+ years thanks to the low-power chips and circuitry used in the design. Eoxys Xeno+ Nano ML specifications: General purpose MCU (one or the other) STMicro STM32L4 Arm Cortex-M4 microcontroller at 80MHz with 1MB flash, 128KB/352KB SRAM Nuvoton NuMicro M2354 Arm Cortex-M23 microcontroller at 96MHz with 1MB flash, 128KB SRAM. Wireless module Innophase Talaria TWO ultra-low-power 2.4GHz 802.11b/n/g WiFi 4 and Bluetooth LE 5.0 […]

The Wi-R protocol relies on body for data communication, consumes up to 100x less than Bluetooth

Wi-R vs Bluetooth

The Wi-R protocol is a non-radiative near-field communication technology that uses Electro-Quasistatic (EQS) fields for communication enabling the body to be used as a conductor and that consumes up to 100x less energy per bit compared to Bluetooth. In a sense, Wi-R combines wireless and wired communication. Wi-R itself only has a wireless range of 5 to 10cm, but since it also uses the body to which the Wi-R device is attached, the range on the conductor is up to 5 meters. While traditional wireless solutions like Bluetooth create a 5 to 10-meter field around a person, the Wi-R protocol creates a body area network (BAN) that could be used to connect a smartphone to a pacemaker, smartwatch, and/or headphones with higher security/privacy and longer battery life.   One of the first Wi-R chips is Ixana YR11 with up to 1Mbps data rate, and they are working on a YR21 […]

Nordic Semi nRF7002 DK low-power dual-band WiFi 6 IoT development kit launched for $56 and up

nRF7002-DK development kit

Nordic Semi nRF7002 DK is an IoT development kit based on the nRF5340 dual-core Cortex-M33 multi-protocol wireless SoC and nRF7002 companion chip adding low-power dual-band (2.4GHz and 5.0 GHz) WiFi 6 connectivity. When Nordic Semi introduced the nRF7200 dual-band WiFi 6 companion chip for nRF52840 and nRF5340 wireless SoCs and nRF9160 cellular IoT SiP last summer, the “nRF7002-PDK” development kit was only mentioned in passing with a 3D render and not much else. The company has now announced the availability of the nRF7002 DK to help developers create low-power Wi-Fi 6 IoT applications. nRF7002 DK specifications: Wireless MCU – Nordic Semi nRF5340 dual-core Arm Cortex-M33 microcontroller @ 128/64 MHz with 1 MB Flash + 512 KB RAM for the application core and 256 KB Flash + 64 KB RAM for the network core, Bluetooth 5.1 LE with direction-finding support, Bluetooth mesh, NFC, Thread, Zigbee, 802.15.4, ANT, and 2.4 GHz proprietary […]

Beken BK7256 320 MHz dual-core RISC-V IoT MCU offers WiFi 6, Bluetooth 5.2, JPEG video encoder/decoder

Beken BK7256 development board

Until now, I had only heard about Beken Bluetooth audio chips, but I’ve just been informed the company is also making WiFi chips such as the BK7256 that are notably found in some Tuya Smart Home modules. Beken offers both RISC-V and Arm WiFi and Bluetooth chips with features summarized as follows: BK7235 single-core RISC-V MCU up to 320 MHz with 2.4 GHz WiFi 6 802.11ax and Bluetooth 5.2 LE, 4MB flash, 512KB SRAM, optional 4MB PSRAM BK7236 dual-core Arm MCU up to 120 to 240 MHh with 2.4 GHz WiFi 6 802.11ax and Bluetooth 5.3 dual mode, 4MB flash, 512KB SRAM, optional 4MB PSRAM BK7237 dual-core RISC-V MCU up to 320 MHz with 2.4 GHz WiFi 6 802.11ax and Bluetooth 5.2 dual mode, 4 or 8MB flash, 512KB SRAM, optional 4MB PSRAM BK7256 dual-core RISC-V MCU up to 320 MHz with 2.4 GHz WiFi 6 802.11ax and Bluetooth 5.2 […]

FOSDEM 2023 schedule – Open-source Embedded, Mobile, IoT, Arm, RISC-V, etc… projects

FOSDEM 2023

After two years of taking place exclusively online, FOSDEM 2023 is back in Brussels, Belgium with thousands expected to attend the 2023 version of the “Free and Open Source Developers’ European Meeting” both onsite and online. FOSDEM 2023 will take place on February 4-5 with 776 speakers, 762 events, and 63 tracks. As usual, I’ve made my own little virtual schedule below mostly with sessions from the Embedded, Mobile and Automotive devroom, but also other devrooms including “Open Media”, “FOSS Educational Programming Languages devroom”, “RISC-V”, and others. FOSDEM Day 1 – Saturday February 4, 2023 10:30 – 10:55 – GStreamer State of the Union 2023 by Olivier Crête GStreamer is a popular multimedia framework making it possible to create a large variety of applications dealing with audio and video. Since the last FOSDEM, it has received a lot of new features: its RTP & WebRTC stack has greatly improved, Rust […]

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