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Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Simplia CONNECT RW612 6-in-1 M.2 2230 module offers WiFi 6, Bluetooth 5.4, 802.15.4, LTE-M, NB-IoT, and GNSS connectivity

Simplia CONNECT RW612 6-in-1 M.2 2230 module offers WiFi 6, Bluetooth 5.4, 802.15.4, LTE-M, NB-IoT, and GNSS connectivity

Simplia CONNECT RW612 6-in-1 M.2 wireless module

Simplia CONNECT RW612 is a 6-in-1 M.2 2230 wireless module that offers dual-band WiFi 6, Bluetooth 5.4 LE, an 802.15.4 radio for Zigbee or Thread, LTE Cat-M, NB-IoT, and GNSS connectivity. It’s the first module I’ve seen that implements so many wireless standards into a tiny M.2 2230 module. It’s made possible by combining an NXP RW612 WiFi, BLE, and 802.15.4 module with an optional Quectel BC77 LTE-M, NB-IoT, and GNSS module. Simplia CONNECT RW612 specifications: Wireless modules Murata Type 2FR (LBESOZZ2FR) SoC – NXP RW612 CPU – Arm Cortex-M33 @ 260 MHz Memory – 1.2 MB SRAM Wireless Dual-band Wi-Fi 6 (802.11ax) 1×1 SISO Bluetooth LE 5.4 802.15.4 radio for Thread and Zigbee Storage – 16MB or 32MB integrated flash memory via FlexSPI Security – NXP EdgeLock Package – 12.0 x 11.0 x 1.5 mm (BGA) Optional Quectel BG77 (BG77LA, similar to the BG770A minus 5G NTN support) LTE […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Gateworks Catalina GW9200 NXP i.MX 95 SBC features Flexible Socket Adapter sockets for M.2 or mPCIe modules

Gateworks Catalina GW9200 NXP i.MX 95 SBC features Flexible Socket Adapter sockets for M.2 or mPCIe modules

Gateworks Catalina GW6200 SBC

Last March, Gateworks introduced the Catalina SBC family, starting with the GW9200 board, based on NXP i.MX 95 SoC for industrial Edge AI applications, and featuring Flexible Socket Adapter (FSA) sockets to accommodate either mini PCIe or M.2 module adapters, depending on requirements. We missed the original announcement, but the new SBC family was brought to our attention when Ezurio announced the acquisition of Gateworks last week. The GW9200 board comprises a system-on-module with the NXP i.MX 95 chip, 4GB LPDDR5 and 8GB eMMC flash by default, as well as a carrier board with 10GbE and GbE RJ45 ports, a MIPI DSI/CSI display/camera interface, two FSA sockets for M.2 or mini PCIe expansion, and a range of I/Os. Ezurio/Gateworks Catalina GW9200 specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 4 Comments on ODROID-H5 SBC Review – Part 1: Unboxing, Type1 case assembly, and first boot

ODROID-H5 SBC Review – Part 1: Unboxing, Type1 case assembly, and first boot

ODROID H5 Review Type 1 case Ubuntu 24.04

Hardkernel has sent me a kit with the ODROID-H5 10GbE SBC for review. In addition to the Intel Core i3-300 board itself, the kit also comes with an ODROID-H5 Type-1 case, an M.2 card for a second 10 Gbps Ethernet port, and other accessories. I’ll start the review with an unboxing, my experience assembling the kit, and first boot using an M.2 NVMe SSD with Ubuntu 24.04 and Windows 11 in a dual-boot configuration. In a few weeks, I’ll continue the review after upgrading to Ubuntu 26.04 and perform thorough testing of all features and performance. ODROID-H5 kit unboxing An advantage of the ODROID family is that it’s highly flexible, and you can build your own customized system. For this review, Hardkernel sent me a package with the following items: External LED power button H5 Case Type 1 enclosure ODROID-H5 16GB DDR5 SO-DIMM (Crucial) 15V/4A PSU with US plug adapter […]

Posted on by Debashis Das - 2 Comments on Argon Industria HMI 5C – An industrial aluminum enclosure for the 5-inch Raspberry Pi Touch Display 2

Argon Industria HMI 5C – An industrial aluminum enclosure for the 5-inch Raspberry Pi Touch Display 2

Argon Industria HMI 5C

The Argon Industria HMI 5C is an industrial-grade aluminum enclosure designed to house a Raspberry Pi 5 and the 5-inch variant of the Pi Touch Display 2, turning it into a compact Human Machine Interface (HMI) system for control panels, automation interfaces, and embedded display applications. The enclosure supports VESA and panel mounting with a soft foam gasket design, with access to USB, Ethernet, HDMI, and GPIO ports via an internal IO board that reroutes connections (including converting micro-HDMI to full-size HDMI), and includes cable punch-outs for clean installation. The design allows HAT expansion (when the cooling column is removed), PCIe-based M.2 NVMe storage expansion, and compatibility with various other modules. Argon Industria HMI 5C Specifications: Compatibility – Raspberry Pi 5 Supported Display – Official Raspberry Pi Touch Display 2 (5-inch, 720 x 1280 resolution) Port access Display – HDMI (re-routed, full-size via internal PCB) Networking – Gigabit Ethernet RJ45 jack USB – 4x […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on LimeSDR Micro M.2 2280 SDR card pairs NXP LA9310 baseband processor with LMS7002M RF transceiver (Crowdfunding)

LimeSDR Micro M.2 2280 SDR card pairs NXP LA9310 baseband processor with LMS7002M RF transceiver (Crowdfunding)

LimeSDR Micro

The LimeSDR Micro M.2 2280 software-defined radio (SDR) card combines an NXP LA9310 baseband processor and a Lime Microsystems LMS7002M transceiver, and targets integration into portable or embedded solutions with a spare M.2 PCIe Gen3 x1 socket. The module is offered in a 1T2R configuration by default, but can be expanded to 1T4R via an FPC connector, supports a 30 MHz to 3.8 GHz frequency range, and up to 100 MHz bandwidth. Target applications include 4G LTE/5G, future RAN research, custom user equipment/modems, drone communications, IoT, satellite communications, and custom waveform generation. LimeSDR Micro M.2 SDR card specifications: SoC – NXP LA9310 programmable baseband processor Vector Signal Processing Accelerator (VSPA) Gen 2 up to 80 GFLOPs Control Processor – Arm Cortex-M4 at up to 307 MHz Storage – 512 Kbit EEPROM memory for NXP LA9310 initial configuration RF Lime Microsystems LMS7002M RF transceiver Channels – 1T2R expandable to 1T4R via […]

Posted on by Debashis Das - 2 Comments on SupTronics X1208 – A UPS + M.2 NVMe SSD HAT for the Raspberry Pi 5

SupTronics X1208 – A UPS + M.2 NVMe SSD HAT for the Raspberry Pi 5

SupTronics X1208 Raspberry Pi 5 UPS + M.2 HAT

The SupTronics X1208 is a UPS and M.2 NVMe SSD HAT for Raspberry Pi 5 designed to offer fast storage and protect the system against data loss during power outages for Edge Computing, NAS, data logging, and other always-on applications. The HAT draws up to 5V/5A from the USB-C port, which charges a 21700 lithium-ion battery (1.5A) and powers the Raspberry Pi 5 directly through the 40-pin GPIO header, eliminating the need for extra cables. It also features an M.2 M-key NVMe slot supporting 2230/2242/2280 SSDs up to 4TB with PCIe 2.0/3.0 speeds. The UPS supports power switching, auto power-on, safe shutdown on low battery, and GPIO-based power/charging control, along with power loss detection. The X1208 board is also equipped with a Maxim fuel gauge I2C chip for battery voltage and capacity monitoring. SupTronics X1208 UPS + M.2 HAT specifications: Compatibility – Raspberry Pi 5 Model B Storage – M.2 M-key […]

Posted on by Debashis Das - 1 Comment on Radxa AICore DX-M1M M.2 2242 low-power AI module delivers 25 TOPS of edge AI performance for just 3W of power

Radxa AICore DX-M1M M.2 2242 low-power AI module delivers 25 TOPS of edge AI performance for just 3W of power

Radxa AICore DX M1M M.2 module

Radxa AICore DX-M1M is a compact, low-power M.2 edge AI acceleration module built around the DeepX DX-M1M neural processing unit (NPU) and delivers up to 25 TOPS (INT8) of AI performance while consuming only 3W of power. Designed for industrial robot arms, autonomous mobile robots (AMR), edge servers, drones, and AIoT devices, the module delivers high-performance AI and ML capabilities without blowing the power budget. It relies on a PCIe Gen3 x2 interface and works with both x86 and Arm systems, including the Raspberry Pi 5 and Radxa ROCK SBCs. AICore DX-M1M specifications: AI Accelerator – DeepX DX-M1M neural processing unit (NPU) with up to 25 TOPS AI System Memory – 1GB LPDDR4X @ 4266 MT/s (on-chip, supports up to 8GB according to DeepX) Storage – 1Gbit QSPI NAND / NOR flash Host Interface – PCIe Gen 3.0 x4 (supports Gen 1/2/3 and x1/x2) via M.2 M + B Key connector […]

Posted on by Debashis Das - No Comments on Quectel RM255C mid-tier 5G RedCap M.2 and LGA modules support LTE Cat 4 fallback, multi-constellation GNSS

Quectel RM255C mid-tier 5G RedCap M.2 and LGA modules support LTE Cat 4 fallback, multi-constellation GNSS

Quectel RG255C NA (Left) and RM255C GL (Right) mid tier 5G RedCap GPP release 17 modules

Quectel has just announced two new 5G RedCap modules, the RM255C-GL (Global, M.2) and RG255C-NA (North America, LGA), both of which are 3GPP Release 17-compliant 5G RedCap (Reduced Capability) modules designed to bridge the gap between LTE Cat 4/6 and full-featured 5G. Both the modules support 5G Sub-6GHz SA with LTE Cat 4 fallback, peak data rates of up to 223 Mbps downlink and 123 Mbps uplink, and backward compatibility with Rel-15/16 networks. Additionally, the modules support optional multi-constellation GNSS via Qualcomm IZat Gen 9VT technology along with various interfaces such as USB 2.0 and PCIe 2.0 (plus UART, SPI, I2C, SGMII, PCM on the RG255C-NA). Both support dual SIM, DFOTA, and embedded protocol stacks, and are suitable for industrial IoT, smart grids, video surveillance, mobile hotspots, wearables, and other medium-speed applications. Quectel RM255C-GL and RG255C-NA specifications: Connectivity 5G NR – 3GPP Release 17 RedCap (Reduced Capability) Sub-6 GHz Standalone (SA) […]