m.2 News - Page 2 of 12 - CNX Software

March 3, 2026 by Debashis Das - No Comments

Quectel RM255C mid-tier 5G RedCap M.2 and LGA modules support LTE Cat 4 fallback, multi-constellation GNSS

Quectel RG255C NA (Left) and RM255C GL (Right) mid tier 5G RedCap GPP release 17 modules

Quectel has just announced two new 5G RedCap modules, the RM255C-GL (Global, M.2) and RG255C-NA (North America, LGA), both of which are 3GPP Release 17-compliant 5G RedCap (Reduced Capability) modules designed to bridge the gap between LTE Cat 4/6 and full-featured 5G. Both the modules support 5G Sub-6GHz SA with LTE Cat 4 fallback, peak data rates of up to 223 Mbps downlink and 123 Mbps uplink, and backward compatibility with Rel-15/16 networks. Additionally, the modules support optional multi-constellation GNSS via Qualcomm IZat Gen 9VT technology along with various interfaces such as USB 2.0 and PCIe 2.0 (plus UART, SPI, I2C, SGMII, PCM on the RG255C-NA). Both support dual SIM, DFOTA, and embedded protocol stacks, and are suitable for industrial IoT, smart grids, video surveillance, mobile hotspots, wearables, and other medium-speed applications. Quectel RM255C-GL and RG255C-NA specifications: Connectivity 5G NR – 3GPP Release 17 RedCap (Reduced Capability) Sub-6 GHz Standalone (SA) […]

February 23, 2026February 23, 2026 by Debashis Das - 1 Comment

Silex SX-SDMAX6E tri-band Wi-Fi 6E + Bluetooth LE module features NXP IW623 SoC, comes in M.2 or LGA package

Silex SX SDMAX6E tri band Wi Fi 6E + Bluetooth LE module LGA(Right) M.2(Left)

Back in August last year, we wrote about NXP’s IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. Now, NXP has partnered with Silex Technology to launch the SX-SDMAX6E module, available in a surface-mount LGA package or an M.2 2230 Key-E card. The module supports Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO. It operates from a 3.3V supply with 1.8V support on the LGA version. It has an industrial operating temperature range of -40°C to +85°C and is designed for both high-throughput applications, such as video streaming, and low-power, battery-operated devices in harsh environments. It also supports various antenna options, fast roaming, and long-term lifecycle backing through Silex and NXP. Silex SX-SDMAX6E specifications: Wireless chipset – NXP IW623 tri-band SoC Connectivity Wi-Fi Tri-band Wi-Fi 6E (2.4 GHz, 5 GHz, 6 GHz) IEEE 802.11a/b/g/n/ac/ax […]

February 16, 2026February 16, 2026 by Debashis Das - 16 Comments

xSDR – A tiny M.2 2230 SDR module with Artix-7 FPGA and LMS7002M RFIC (Crowdfunding)

xSDR single sided M.2 software defined radio with 2× RX TX channels up to 3.8 GHz

Wavelet Lab’s xSDR is a tiny, single-sided M.2 2230 software-defined radio (SDR) module designed for integration into laptops, embedded systems, and edge computing devices. A successor to the company’s previous uSDR, the “x” in xSDR stands for “extended,” adding 2×2 MIMO support and a wider frequency range to the same tiny footprint. The module is built around the Lime Microsystems LMS7002M RFIC and an AMD Artix-7 XC7A50T FPGA as found in the LimeNET Micro 2.0 Developer Edition board. This combination allows for a tuning range of 30 MHz to 3.8 GHz and a sample rate of up to 122.88 MSPS, making this SDR suitable for cellular research (LTE/5G), spectrum analysis, satellite tracking, and high-speed data links (with two modules). Wavelet Lab’s xSDR specifications: RFIC – Lime Microsystems LMS7002M programmable RF (FPRF) transceiver IC FPGA – AMD Embedded XC7A50T (Artix-7) with 52,160 logic cells RF capabilities Channels – 2×2 MIMO (2x […]

January 13, 2026January 16, 2026 by Sponsored Post - No Comments

Compex Wi-Fi 7 Dual-Band Dual-Concurrent Modules: High-Performance Solutions for Next-Gen Connectivity (Sponsored)

Compex has been a Qualcomm Authorized Design Centre (ADC) since 2014, helping customers design specialized, high-specification Wi-Fi products for demanding and mission-critical applications. For Wi-Fi 7 (802.11be), Compex has introduced a family of standard modules for system designers who are looking for flexible module options that support different band combinations, form factors, and deployment scenarios. The Compex Wi-Fi 7 Dual-Band Dual-Concurrent Module family is designed to address these requirements by offering a versatile set of dual-band configurations across 2.4GHz, 5GHz, and 6GHz, delivering high performance and adaptability for a wide range of applications. Qualcomm-Powered Dual-Band Dual-Concurrent Modules Powered by Qualcomm’s QCN6224, QCN6274, and QCN9274 ‘Waikiki’ radio chipsets, the Compex Wi-Fi 7 Dual-Band Dual-Concurrent Module family features dual-band combinations across 2.4GHz, 5GHz, and 6GHz bands. These modules support advanced Wi-Fi 7 functions such as Multi-Link Operation (MLO), OFDMA, and 4096-QAM. These 2×2 MU-MIMO modules are available in standard MiniPCIe, M.2 E-Key, […]

January 8, 2026January 9, 2026 by Debashis Das - No Comments

Intel Core Ultra Series 3 Panther Lake-H CPU powers TGS-2000 series stackable Edge AI computers

Vecow TGS 2000 Series Panther Lake Edge AI computers

At CES 2026, Intel unveiled the Core Ultra Series 3 processors, codenamed Panther Lake-H, built on the Intel 18A (1.8-nanometer class) process, and targeting both consumer and industrial applications. Vecow introduced one of the first industrial Panther Lake-H platforms with the TGS-2000 series, a new family of ultra-compact, stackable Edge AI computers designed for high-performance space-constrained applications and based on either the 16-core Intel Core Ultra 9 386H or 12-core Intel Core Ultra 5 336H SoC. This new 2000 series is an upgrade of the previous TGS-1000 series, which was launched in 2024 with Intel Meteor Lake processors. While the overall design stays mostly the same, the transition to Core Ultra Series 3 enhances AI performance, reaching up to 100 TOPS combined performance with the selected SKUs (note: the top-end Panther Lake-H CPU can deliver up to 180 TOPS). The TGS-2000 Series is available in three variants, including the fanless […]

November 26, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

FORTEC SBCPRO-X51 3.5-inch Amston Lake SBC supports M.2 V-By-One or M.2 USB-C DisplayPort expansion module

The FORTEC Group’s SBCPRO-X51 is a 3.5-inch industrial, fanless SBC powered by Intel Atom x7211RE Amston Lake dual-core processor that takes M.2 modules to add USB-C DisplayPort or V-By-One display interfaces, or other features. The board takes up to 16GB DDR5 memory, supports M.2 NVMe SSD storage, and offers a DisplayPort video output, two 2.5GbE RJ45 ports, an M.2 slot for WiFi and Bluetooth, several USB 3.2/2.0 interfaces, two RS232/RS422/RS485 interfaces, and more. The SBCPRO-X51 is engineered to run in a wide operating temperature range from –20°C to +85°C for demanding industrial and IoT environments. FORTEC SBCPRO-X51 specifications: SoC – Intel Atom x7211RE dual-core Amstom Lake processor @ up to 3.2 GHz with 6MB cache, 16EU Intel UHD graphics; TDP: 6W System Memory – Up to 16GB DDR5 4800 MT/s via SO-DIMM slot; Note: Intel says 32GB is the maximum, but 64GB is likely supported. Storage – M.2 M-key 2242 […]

November 24, 2025November 23, 2025 by Debashis Das - 5 Comments

Waveshare’s updated Raspberry Pi 5 dual micro HDMI to HDMI adapter adds NVMe storage support

Raspberry Pi 5 PCIe To M.2 Multifunctional Adapter

Waveshare has recently released the Pi5 Connector Adapter (C), an upgraded version of its earlier Pi5 Connector Adapter, adding support for M.2 NVMe SSDs and enabling direct OS booting from an SSD. The board connects to the Raspberry Pi 5 via its 16-pin PCIe interface and supports M.2 NVMe SSDs in 2230/2242 sizes with PCIe Gen2/Gen3 speeds. It also converts the Pi’s micro HDMI ports into full-size HDMI connectors and brings all ports on one side next to the USB and Ethernet ports of the SBC. It offers two methods for power: a USB-C input or a screw-terminal supply. Pi5 Connector Adapter (C) specifications: Supported SBC – Raspberry Pi 5 (it can support the Raspberry Pi 4B too, but the SSD functionality will not work) Storage – M.2 M-key 2230 / 2242 socket for NVMe SSD (support direct OS boot) Display – 2x HDMI outputs via 2x micro HDMI input […]

October 10, 2025October 9, 2025 by Debashis Das - 1 Comment

Avalue EPC-ASL Intel N97 fanless industrial mini PC is designed for 24/7 operation

Avalue EPC ASL Intel N97 Fanless Compact System

Avalue Technology’s EPC-ASL is a rugged fanless industrial mini PC built around the Intel Processor N97. Designed for 24/7 operation and edge computing, the mini PC is suitable for industrial environments, such as smart manufacturing, retail, logistics, and surveillance. The PC supports up to 16GB DDR5 memory, dual 2.5GbE, and various I/O options, including six USB ports, dual RS-232, HDMI 2.0, and DisplayPort 1.4a for multi-display setups. Storage and expansion are supported by M.2 Key-B/E slots, which accommodate Wi-Fi 6E, LTE, 5G, or SSD modules for enhanced connectivity and storage. The system also includes TPM 2.0 security, +12V/24V DC input, and wall-mount support. Avalue EPC-ASL specifications: SoC – Intel Processor N97 quad-core processor up to 3.6 GHz with 6MB cache, 24EU Intel UHD Graphics Gen 12 @ 1.2 GHz; TDP: 12W System Memory – Up to 16GB DDR5 4800MHz via 1x SO-DIMM socket (Up to 64GB DDR5 is likely supported, but Avalue […]