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March 19, 2026 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Grinn GenioSoM-360 MediaTek Genio 360P LGA system-on-module enables Edge AI in space-constrained applications

Grinn GenioSoM-360 is the first system-on-module (SoM) based on MediaTek Genio 360P octa-core Cortex-A76/A55 SoC with a 7.4 TOPS AI accelerator. It comes in a compact (30x30mm) LGA package targeting edge AI applications in space-constrained applications. The SoM features up to 8GB LPDDR4x RAM, up to 64GB eMMC flash, a PMIC, and exposes all I/Os through 303 pads, notably MIPI DSI, LVDS, eDP/DP display interfaces, MIPI CSI camera interfaces, Gigabit Ethernet, USB 3.2/2.0 interfaces, PCIe Gen2, CAN FD, and more Grinn GenioSoM-360 specifications: SoC – MediaTek Genio 360P (MT8367); note the photo above shows the MT8366, the hexa-core Genio 360 variant Octa-core CPU 2x Arm Cortex-A76 cores clocked at up to 1.9 GHz (industrial) / 2.0GHz (commercial) 6x Arm Cortex-A55 cores clocked at up to 1.7 GHz (industrial) / 2.0GHz (commercial) GPU – Arm Mali-G57 MC2 at up to 700MHz with support for OpenGL ES 3.2, Vulkan 1.1, OpenCL 2.0 […]

March 12, 2026March 11, 2026 by Debashis Das - 4 Comments

SolidRun P100 COM Express Type 6 module features LPCAMM2 memory, up to 12-core AMD Ryzen AI Embedded P185 SoC

Ryzen AI Embedded P100 COM Express module

We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced its new P100 COM Express Type 6 module family. These compact (95 x 95mm) modules are among the first to support the newly released 8- to 12-core Zen 5 SKUs, with up to 50 TOPS from the NPU and 80 TOPS of total system AI. Another fairly unique feature of the new SolidRun computer-on-module is support for LPCAMM2 LPDDR5X memory. The company uses a screw-lock mechanism to deliver high-bandwidth LPDDR5X performance (up to 9600 MT/s) while maintaining the mechanical reliability required for “systems in motion,” such as autonomous mobile robots (AMRs), heavy machinery, and rail systems. A mini-ITX development kit for the module is also available. SolidRun P100 COM Express Type 6 module SolidRun P100 COM Express Type 6 module specifications: AMD Ryzen AI Embedded P100 Series […]

March 11, 2026 by Debashis Das - No Comments

AMD Ryzen AI Embedded P100 series expands with up to 12 Zen 5 cores, 80 TOPS of AI performance

AMD Ryzen AI Embedded P100 series Embedded World 2026

At CES 2026, we saw AMD launch its new Ryzen AI Embedded P100 series of SoCs, with four- and six-core models designed for Edge AI. At the time of writing, the lineup had six SKUs, with higher-core variants to be announced later. Now at Embedded World 2026, AMD has expanded the Ryzen AI Embedded P100 series with six additional SKUs available in commercial and industrial temperature grades, while the automotive-grade SoCs remain unchanged. The new SOCs integrate 8-12 Zen 5 CPU cores (upgrade from 4-6 cores ), RDNA 3.5 graphics, and an XDNA 2 NPU on a single chip to deliver up to 80 TOPS (upgrade from 50 TOPS) of combined/system AI performance AMD claims up to 39% higher multithreaded CPU performance and 2.1× higher total system TOPS compared to Ryzen Embedded 8000 Series. They support unified CPU-GPU memory, enabling low-latency processing for tasks such as multi-camera machine vision, Visual […]

March 10, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP i.MX 93W wireless MPU SiP pairs dual-core Arm Cortex-A55 processor with NXP iW610 WiFi 6, Bluetooth LE, and 805.15.4 radio

NXP i.MX 93W is the company’s first integrated wireless MPU System-in-Package (SiP) and combines a dual-core Cortex-A55 processor (NXP i.MX 93) with an iW610 WiFi 6, Bluetooth LE, and 802.15.4 tri-radio into a single chip. The 14.2 x 12 mm package also includes all the external radio components needed for wireless connectivity, replacing up to 60 discrete components on the PCB. NXP says it reduces the PCB area, simplifies PCB design and regulatory approval, and speeds up time-to-market. NXP i.MX 93W specifications: CPU Dual-Core Arm Cortex-A55 at up to 1.7 GHz Arm Cortex-M33 core at 250 MHz for real-time control GPU – 2D graphics accelerator AI accelerator – Arm Ethos-U65 microNPU Memory I/F – Up to 3.7GT/s 16-bit LPDDR4/LPDDR4X with inline ECC Storage I/F – 2x SD 3.0/SDIO 3.0/eMMC 5.1 Display Interfaces MIPI DSI up to 1080p60 LVDS up to 720p60 24-bit parallel RGB Camera Interface – 2-lane MIPI CSI up […]

March 10, 2026March 9, 2026 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Intel Arrow Lake-S ATX motherboard supports up to 256GB CU-DIMM DDR5 RAM, features W880 chipset

Jetway ATX-ARS1-W880 is an ATX motherboard taking socketed Intel Arrow Lake-S SoCs with up to 24 cores, 36 TOPS of AI performance, and featuring four CU-DIMM (Clocked Unbuffered DIMM) sockets for up to 256GB DDR5 ECC memory, and a W880 chipset. Targeting Smart Factory applications, the industrial-grade motherboard also features four SATA III ports and two M.2 M-Key PCIe Gen5/4 sockets for storage, seven PCIe slots, three 2.5GbE ports, M.2 E-Key and B-Key sockets for WiFi, Bluetooth, and cellular (4G/5G) connectivity, sixteen USB interfaces (Type-A and headers), and a few serial interfaces. The ATX-ARS1-W880 also supports up to four independent displays through DP, HDMI, and VGA ports, and features a combo audio block with Line-in, Line-out, and MIC-out jacks. Jetway ATX-ARS1-W880 specifications: SoC – Intel LGA1851 socket for Intel Core Ultra 200S “Arrow Lake-S” processor up to 125W TDP Chipset – Intel W880 “workstation” chipset System Memory – 4x DDR5 […]

March 5, 2026March 5, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

ADLINK Express-PTL Panther Lake COM Express Type 6 module supports up to Intel Core Ultra 7 368H, 128GB DDR5

ADLINK Express-PTL COM Express Type 6 computer-on-module is built on Intel Core Ultra Series 3 “Panther Lake-H” SoCs up to the 16-core Core Ultra 7 368H processor delivering 180 TOPS of AI performance. The module pairs up to 128 GB DDR5 memory with IBECC support, features high-speed I/O such as PCIe Gen4, multiple display options, USB4/Thunderbolt capability, and industrial features such as TSN Ethernet, TPM 2.0, and advanced power management. As an industrial part, the Express-PTL is designed to operate across an extended –40°C to 85°C temperature range, and targets applications in robotics, industrial automation, medical imaging, transportation, and smart infrastructure. ADLINK Express-PTL specifications: SoC – Intel Core Ultra Series 3 Panther Lake-H processors (one or the other) Intel Core Ultra 5 336H 12-core (4P+4E+4LPE) processor up to 1.9 GHz / 4.6 GHz (Turbo) with 18MB cache, 4-core Xe3 graphics (37 TOPS), 47 TOPS NPU; TDP: 25W (15-65W cTDP) Intel […]

February 23, 2026February 23, 2026 by Debashis Das - 1 Comment

Silex SX-SDMAX6E tri-band Wi-Fi 6E + Bluetooth LE module features NXP IW623 SoC, comes in M.2 or LGA package

Silex SX SDMAX6E tri band Wi Fi 6E + Bluetooth LE module LGA(Right) M.2(Left)

Back in August last year, we wrote about NXP’s IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. Now, NXP has partnered with Silex Technology to launch the SX-SDMAX6E module, available in a surface-mount LGA package or an M.2 2230 Key-E card. The module supports Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO. It operates from a 3.3V supply with 1.8V support on the LGA version. It has an industrial operating temperature range of -40°C to +85°C and is designed for both high-throughput applications, such as video streaming, and low-power, battery-operated devices in harsh environments. It also supports various antenna options, fast roaming, and long-term lifecycle backing through Silex and NXP. Silex SX-SDMAX6E specifications: Wireless chipset – NXP IW623 tri-band SoC Connectivity Wi-Fi Tri-band Wi-Fi 6E (2.4 GHz, 5 GHz, 6 GHz) IEEE 802.11a/b/g/n/ac/ax […]

February 14, 2026February 15, 2026 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Android 17 Beta 1 released with H.266/VVC support, camera improvements, and more

Google has just announced the release of Android 17 Beta 1 with performance improvements, H.266/VVC video codec support, smoother camera mode transitions, privacy and security enhancements, and more. The company is not releasing Developer Previews anymore, and instead follows the “continuous Canary channel” announced with the first Android 16 Developer Preview. So, with Android 17, the very first release is the “Beta 1” release. Some of the key changes in Android 17 so far: Developers can’t opt out of orientation and resizability restrictions on large screen devices (sw > 600 dp), so they’ll have to make sure their apps work on tablets, foldables, and desktop windowing environments. With one exception: apps categorized as games with android:appCategory flag. Google published a separate blog post about the change. Performance improvements and tools Lock-free MessageQueue that will reduce missed frames. Added Generational garbage collection to ART’s Concurrent Mark-Compact collector. This aims to reduce […]