nRF54L15 DK: A Development Kit for nRF54L15, nRF54L10, and nRF54L05 SoCs with Bluetooth, Thread, and Zigbee

nRF54L15 development kit

The nRF54L15 DK is a development kit designed to evaluate the wireless SoCs of the nRF54L15, nRF54L10, and nRF54L05 wireless SoCs. These SoCs support multiple wireless protocols, including Bluetooth Low Energy, Bluetooth Mesh, Matter, Thread, Zigbee, and 2.4GHz proprietary protocols, with data rates of up to 4Mbps. The kit integrates the nRF54L15 SoC and provides emulation capabilities for the nRF54L10 and nRF54L05, enabling flexible testing and development across the nRF54L Series. The nRF54L series SoCs differ in memory configurations to meet various application requirements. The nRF54L15 includes 1.5 MB of non-volatile memory (NVM) and 256 KB of RAM for high-performance applications. The nRF54L10 features 1.0 MB of NVM and 192 KB of RAM for mid-range use cases, while the nRF54L05 offers 0.5 MB of NVM and 96 KB of RAM for entry-level designs requiring fewer resources. The kit is supported by the nRF Connect SDK and tools, providing access to […]

PCBWay: Your One-Stop Shop for Electronics Manufacturing from Design to Production (Sponsored)

PCBWAY PCB electronics manufacturing

PCBWay, founded in 2013, is a global electronics manufacturing services company driven by customer value. With 5 factories in Shenzhen China (2 offering PCB services, 2 offering PCBA services, and 1 offering CNC machining, sheet metal, and injection molding services), we are able to leverage advanced electronics technology, component resources, experienced technicians, and more. We also work with a number of manufacturers in Shenzhen and other cities to support products beyond our own capabilities. PCBWay has a long history of providing manufacturing support and design advice based on our customers’ products, and we continue to provide our customers with printed circuit boards, components, PCB assembly, molding services, electronic assemblies, contract manufacturing, etc. from design to mass production. Today, multiple technology trends are driving PCB adoption. The Internet of Things (IoT) and Artificial Intelligence (AI), combined with the development of 5G systems, have opened up a whole new level of connectivity […]

Murata unveils stretchable PCB technology for medical and bio-sensing applications

Murata Stretchable PCB

Many PCB vendors now provide flexible PCB manufacturing services, but Murata goes further with stretchable PCB technology that’s not only bendable but can be twisted and stretched to better fit on the body for bio-sensing and medical applications even on parts such as an elbow. Traditional bio-monitoring sensors have some limitations. For example, they can become unstuck when the body moves, damage the delicate skin of infants and the elderly, data may be distorted due to body movement, and Murata explains “there is a risk of a decline in insulation and the occurrence of ion migration when using a thermoplastic polyurethane elastomer (TPU), known as a stretchable base material, in a high humidity environment”. The company’s stretchable printed circuits ((SPC) are supposed to solve or at least mitigate all those issues. The technology is under development, but Murata still shared some highlights of the technology: Stretchable electrode printing in compliance […]

STMicro’s low-power ST1VAFE3BX AI biosensor integrates biopotential signal monitoring and motion tracking

STMicro ST1VAFE3BX biosensor

STMicroelectronics (STMicro) has announced the ST1VAFE3BX biosensor, a highly integrated chip that combines “cardio and neurological sensing with motion tracking and embedded AI functionalities,” and is targeted at healthcare and fitness wearables. The ST1VAFE3BX biosensor chip integrates biopotential inputs with an accelerometer and a machine learning core for reduced power consumption. It features a complete vertical analog front end (vAFE) for simplified detection of vital signs in electrocardiography, electroencephalography, and other healthcare monitoring applications. Inertial sensing by the accelerometer is synchronized with biopotential sensing “to infer any link between measured signals and physical activity.” The integrated machine-learning core (MLC) and finite state machine (FSM) allow for ultra-low-power and accurate biopotential input recognition at a degree of responsiveness that is reportedly faster than the current industry standard. The ST1VAFE3BX is aimed at applications in healthcare and fitness wearables such as smartwatches, smart patches, sports bands, connected rings, and smart glasses. It […]

Microchip PIC64HX1000 64-bit RISC-V AI MPU delivers post-quantum security for aerospace, defense, and automotive applications

Microchip PIC64HX1000 64 bit AI MPU

Microchip recently unveiled the PIC64HX1000 64-bit RISC-V AI microprocessor (MPU) family designed for mission-critical intelligent edge applications in the aerospace, defense, industrial, and medical sectors thanks to a quantum-resistant design. These new MPUs feature eight SiFive’s Intelligence X280 cores, each clocked at 1 GHz. The MPUs are engineered with a decoupled vector pipeline enabling 512-bit operations enabling the PIC64HX1000 to achieve up to 2 TOPS for AI/ML processing and come equipped with integrated Time-Sensitive Networking (TSN) Ethernet connectivity. This new microprocessor includes a dedicated system controller for runtime monitoring and fault management, WorldGuard architecture for workload isolation, and post-quantum defense-grade cryptography, which includes the NIST-standardized FIPS 203 and FIPS 204 cryptographic algorithms, ensuring protection against future quantum computing threats. PIC64HX1000 64-bit AI MPU specification MPU variants PIC64HX1000 – IN (Industrial) PIC64HX1000 – AV (Aviation) PIC64HX1000 – MI (Military) CPU – 8x 64-bit RISC-V cores (SiFive X280), up to 1 GHz, […]

KAGA FEI ES4L15BA1 is an ultra-small Bluetooth LE 6.0 and 802.15.4 module based on Nordic nRF54L15 SoC

ultra small Bluetooth 6.0 module

Japanese company KAGA FEI has recently unveiled the incredibly small ES5L15BA1 Bluetooth LE 6.0 and 802.15.4 module based on Nordic Semi nRF54L15 ultra-low-power Cortex-M33 wireless MCU. We had previously covered the u-Blox NORA-B2 which I already found pretty small at 14.3 x 10.4 x 1.9mm, but the ES5L15BA1 module goes a step further measuring just 8.55 x 3.25 x 1.00 mm with an integrated antenna which could make it the world’s smallest Bluetooth LE module. KAGA FEI ES4L15BA1 specifications: SoC – Nordic Semiconductor nRF54L15 MCU cores Arm Cortex-M33 with Arm TrustZone @ 128MHz RISC-V coprocessor for software-defined peripheral Memory – 256KB SRAM Storage – 1.5MB non-volatile memory Wireless Bluetooth 6.0 Data rates – 2Mbps, 1Mbps, 500kbps, 125kbps Features AoA / AoD Channel Sounding 802.15.4 radio for Thread / Zigbee / Matter Nordic Proprietary 2.4 GHz protocol up to 4 Mbps Frequency – 2402 to 2480 MHz +8dBm output power Antenna […]

Altera’s 7nm Agilex 3 SoC FPGA features Cortex-A55 cores, AI Tensor Block, DSP, 10 GbE, and more.

Altera Agilex 3 AI SoC FPGA

Altera, an independent subsidiary of Intel, has launched the Altera Agilex 3 SoC FPGA lineup built on Intel’s 7nm technology. According to Altera, these FPGAs prioritize cost and power efficiency while maintaining essential performance. Key features include an integrated dual-core Arm Cortex A55 processor, AI capabilities within the FPGA fabric (tensor blocks and AI-optimized DSP sections), enhanced security, 25K–135K logic elements, 12.5 Gbps transceivers, LPDDR4 support, and a 38% lower power consumption versus competing FPGAs. Built on the Hyperflex architecture, it offers nearly double the performance compared to previous-generation Cyclone V FPGAs. These features make this device useful for manufacturing, surveillance, medical, test and measurement, and edge computing applications. Altera’s Agilex 3 AI SoC FPGA specifications Device Variants B-Series – No definite information is available C-Series – A3C025, A3C050, A3C065, A3C100, A3C135 SoC FPGAs Hard Processing System (HPS) – Dual-core 64-bit Arm Cortex-A55 up to 800 MHz that supports secure […]

MSI MS-CF13 is a fanless mini-ITX motherboard powered by Intel N97, Core i3-N305, or Atom x7425E Alder Lake-N SoC

MSI MS-CF13 mini-ITX motherboard

MSI MS-CF13 is a low-profile, low-power, fanless mini-ITX motherboard offered with a choice of Alder Lake-N processors namely Intel Processor N97, Intel Core i3-N305, or Intel Atom x7425E SoC. The motherboard supports up to 16GB DDR5 SO-DIMM memory and SATA III storage, features dual 2.5GbE, six internal COM ports, six USB interfaces, M.2 Key-B and Key-E sockets for wireless expansion, and supports up to three independent display through up to two DisplayPort, one HDMI, LVDS/eDP display interfaces, MSI MS-CF13 specifications: Alder Lake N-series SoC (one or the other) Intel Atom x7425E quad-core processor up to 3.4 GHz with 6MB cache, 24EU Intel UHD Graphics @ 1.00 GHz; TDP: 12W Intel Processor N97 quad-core processor up to 3.6 GHz with 6MB cache, 24EU Intel UHD Graphics @ 1.20 GHz; TDP: 12W Intel Core i3-N305 octa-core processor up to 3.8 GHz with 6MB cache, 32EU Intel UHD Graphics @ 1.25 GHz; TDP: […]

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UP 7000 x86 SBC