Play games with your brain signals using Octopus 16 wireless EEG device

Octopus 16 biosignal device for gaming

Octopus 16 is a wireless biosignal HID device for the XIAO ESP32-S3 board designed to let users play computer games using brain signals (EEG) with no hands (or implants) needed. The board packs 16 electrodes to measure biosignals, including EEG (electroencephalography), EMG (electromyography), and ECG (electrocardiography), and the coin-sized device is much more compact than other brain-computer interface (BCI) solutions, which typically require a cap kit with 8 to 16 electrodes and wires. Octopus 16 specifications: ADC – 2x Texas Instruments ADS131M08 24-bit, 8-channel, simultaneous-sampling, delta-sigma (ΔΣ) analog-to-digital converters Channels – 16x 24-bit channels (8x per ADC) Programmable gain (PGA) – x1 to x128 (set in firmware; default gain register 0x2222) Input high-pass / DC block – Integrated ADC DC-block filter enabled (≈ >1 Hz) Host interface (to XIAO board) – Power + SPI via 2x 7-pin Brain interface 18x spring-loaded pogo pins 16x electrodes 1x  reference (AINREF) 1x Ground […]

Augmental MouthPad is a tongue-controlled touchpad/trackpad

Augmental Mouthpad

Check your calendar, everyone! It’s definitely not April 1st. Now that we have that out of the way, we can start with the main topic of this article. Ready? Augmental MouthPad is a Bluetooth HID device you put into your mouth and control like a touchpad or trackpad, but with your tongue (and head) instead of your fingers. MouthPad is a custom-fit mouthpiece that turns tongue and head movements into HID data to control a phone, a tablet, and a computer like you would normally do with using a mouse, touchpad, or a touchscreen. When I first read about it and saw a short video on X, it felt like a joke, but it can be a lifesaver for people with disabilities. MouthPad specifications: Compatibility – macOS, Windows, Linux, iOS, Android Connectivity – Bluetooth Battery 7+ hours of continuous use 1.5 hours charge time Dimensions MouthPad – About ~30 × […]

Geniatech XPI-3576-CM5 – A Raspberry Pi CM5-compatible Rockchip RK3576 AI Compute Module with WiFi 6, Bluetooth 5.3

Geniatech XPI-3576-CM5

Geniatech XPI-3576-CM5 is a Rockchip RK3576 octa-core Arm Cortex-A72/A53 system-on-module based on the Raspberry Pi CM4/CM5 form factor with up to 16GB LPDDR5 and 128GB eMMC flash. The module also features a RealTek RTL8211F Gigabit Ethernet controller, an Ampak AP6275S wireless module for dual-band WiFi 6 and Bluetooth 5.3 connectivity, and a Rockchip RK806S-5 PMIC for power management. It features two 100-pin B2B connectors, allowing it to be plugged into carrier boards designed for the Raspberry Pi CM4/CM5, with some limitations as we’ll see further below. Geniatech XPI-3576-CM5 specifications SoC – Rockchip RK3576 Octa-core CPU – 4x Cortex-A72 cores at 2.2GHz, 4x Cortex-A53 cores at 1.8GHz GPU – Arm Mali-G52 MC3 GPU at 1 GHz with support for OpenGL ES 3.2, OpenCL 2.0, and Vulkan 1.1 NPU – 6 TOPS (INT8) AI accelerator with support for INT4/INT8/INT16/BF16/TF32 mixed operations. VPU Video Decoder – H.264, H.265, VP9, AV1, and AVS2 up to […]

Efinix Titanium Edge FPGA family targets low-power edge AI and vision systems

Efinix Titanium Edge Ti125 FPGA

Efinix has introduced the Titanium Edge FPGA family designed for low-power edge AI and machine vision applications. Based on the company’s Titanium FPGA architecture, the new family introduces lower static power consumption, configurable 2.5 Gbps MIPI I/O, built-in single-event upset (SEU) correction, and System-in-Package (SiP) variants that integrate SPI flash and HyperRAM for compact systems. The initial Titanium Edge FPGA family includes the Ti125, Ti40, Ti70, and Ti95 devices, with approximately 39K to 123K logic elements for embedded AI, machine vision, robotics, medical systems, and various other applications. Compared to the high-end Titanium Ti375 and the cost-efficient Topaz FPGA family, the new devices are designed to have about 50% lower static power consumption while retaining the company’s Quantum architecture. Efinix Titanium Edge Ti125 and Ti125 SiP specifications: FPGA Fabric Efinix Quantum architecture Up to 122,792 logic elements (109,440 XLR cells) 288 DSP blocks Embedded Memory – 5.9 Mbit SRAM Memory – […]

Axiomtek PICO570 – An Intel Core Ultra Meteor Lake Pico-ITX SBC with DDR5-5600 SO-DIMM memory, HDMI 2.1 up to 4Kp120

Axiomtek PICO570 Pico ITX SBC with Intel Core Ultra Processors

Axiomtek has recently introduced the PICO570, a high-performance Pico-ITX SBC built around Intel Core Ultra (Series 1)  Meteor Lake-U processors. Measuring just 100 x 72 mm, this ultra-compact board with its 11 TOPS NPU is designed for edge AI applications. The PICO570 board is very similar to the AAEON PICO-MTU4 Pico-ITX SBC, but it features a physical 262-pin DDR5 SO-DIMM slot that allows users to upgrade or replace the RAM instead of solder-on LPDDR5 memory, and features an HDMI 2.1 supporting up to 4K resolution at 120Hz.  The SBC also features an RS-232/422/485 serial interface, two USB 3.0 ports, and a dedicated SMBus connector for system management. With an operating temperature range of -20°C to +60°C, a watchdog timer, hardware monitoring, and a 12V DC input, it can be used for AI inference nodes, automation controllers, medical systems, and intelligent infrastructure. Axiomtek PICO570 specifications: Meteor Lake-U SoC (one of the other) […]

Grinn GenioSoM-360 MediaTek Genio 360P LGA system-on-module enables Edge AI in space-constrained applications

Mediatek Genio 360P system-on-module

Grinn GenioSoM-360 is the first system-on-module (SoM) based on MediaTek Genio 360P octa-core Cortex-A76/A55 SoC with a 7.4 TOPS AI accelerator. It comes in a compact (30x30mm) LGA package targeting edge AI applications in space-constrained applications. The SoM features up to 8GB LPDDR4x RAM, up to 64GB eMMC flash, a PMIC, and exposes all I/Os through 303 pads, notably MIPI DSI, LVDS, eDP/DP display interfaces, MIPI CSI camera interfaces, Gigabit Ethernet, USB 3.2/2.0 interfaces, PCIe Gen2, CAN FD, and more Grinn GenioSoM-360 specifications: SoC – MediaTek Genio 360P (MT8367); note the photo above shows the MT8366, the hexa-core Genio 360 variant Octa-core CPU 2x Arm Cortex-A76 cores clocked at up to 1.9 GHz (industrial) / 2.0GHz (commercial) 6x Arm Cortex-A55 cores clocked at up to 1.7 GHz (industrial) / 2.0GHz (commercial) GPU – Arm Mali-G57 MC2 at up to 700MHz with support for OpenGL ES 3.2, Vulkan 1.1, OpenCL 2.0 […]

SolidRun P100 COM Express Type 6 module features LPCAMM2 memory, up to 12-core AMD Ryzen AI Embedded P185 SoC

Ryzen AI Embedded P100 COM Express module

We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced its new P100 COM Express Type 6 module family. These compact (95 x 95mm) modules are among the first to support the newly released 8- to 12-core Zen 5 SKUs, with up to 50 TOPS from the NPU and 80 TOPS of total system AI. Another fairly unique feature of the new SolidRun computer-on-module is support for LPCAMM2 LPDDR5X memory. The company uses a screw-lock mechanism to deliver high-bandwidth LPDDR5X performance (up to 9600 MT/s) while maintaining the mechanical reliability required for “systems in motion,” such as autonomous mobile robots (AMRs), heavy machinery, and rail systems. A mini-ITX development kit for the module is also available. SolidRun P100 COM Express Type 6 module SolidRun P100 COM Express Type 6 module specifications: AMD Ryzen AI Embedded P100 Series […]

AMD Ryzen AI Embedded P100 series expands with up to 12 Zen 5 cores, 80 TOPS of AI performance

AMD Ryzen AI Embedded P100 series Embedded World 2026

At CES 2026, we saw AMD launch its new Ryzen AI Embedded P100 series of SoCs, with four- and six-core models designed for Edge AI. At the time of writing, the lineup had six SKUs, with higher-core variants to be announced later. Now at Embedded World 2026, AMD has expanded the Ryzen AI Embedded P100 series with six additional SKUs available in commercial and industrial temperature grades, while the automotive-grade SoCs remain unchanged. The new SOCs integrate 8-12 Zen 5 CPU cores (upgrade from 4-6 cores ), RDNA 3.5 graphics, and an XDNA 2 NPU on a single chip to deliver up to 80 TOPS (upgrade from 50 TOPS) of combined/system AI performance AMD claims up to 39% higher multithreaded CPU performance and 2.1× higher total system TOPS compared to Ryzen Embedded 8000 Series. They support unified CPU-GPU memory, enabling low-latency processing for tasks such as multi-camera machine vision, Visual […]

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