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March 10, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP i.MX 93W wireless MPU SiP pairs dual-core Arm Cortex-A55 processor with NXP iW610 WiFi 6, Bluetooth LE, and 805.15.4 radio

NXP i.MX 93W is the company’s first integrated wireless MPU System-in-Package (SiP) and combines a dual-core Cortex-A55 processor (NXP i.MX 93) with an iW610 WiFi 6, Bluetooth LE, and 802.15.4 tri-radio into a single chip. The 14.2 x 12 mm package also includes all the external radio components needed for wireless connectivity, replacing up to 60 discrete components on the PCB. NXP says it reduces the PCB area, simplifies PCB design and regulatory approval, and speeds up time-to-market. NXP i.MX 93W specifications: CPU Dual-Core Arm Cortex-A55 at up to 1.7 GHz Arm Cortex-M33 core at 250 MHz for real-time control GPU – 2D graphics accelerator AI accelerator – Arm Ethos-U65 microNPU Memory I/F – Up to 3.7GT/s 16-bit LPDDR4/LPDDR4X with inline ECC Storage I/F – 2x SD 3.0/SDIO 3.0/eMMC 5.1 Display Interfaces MIPI DSI up to 1080p60 LVDS up to 720p60 24-bit parallel RGB Camera Interface – 2-lane MIPI CSI up […]

February 25, 2026February 25, 2026 by Debashis Das - No Comments

NXP TJA1410 and TJF1410 PMD transceivers enable “CAN-like” Single Pair Ethernet (SPE) connectivity

We’ve reported on 10BASE-T1S and 10BASE-T1L Single Pair Ethernet (SPE) chips from Microchip and Analog Devices in the past, which support Ethernet communication over a single twisted-pair cable. But those chips integrate a full Ethernet PHY or MAC-PHY inside the device. NXP takes a different approach with their TJA1410 (automotive) and TJF1410 (industrial) Physical Medium Dependent (PMD) transceivers. These new PMDs separate the analog physical layer from the digital Ethernet logic. By integrating the digital portion of the PHY into the host microcontroller or switch, the TJA1410 and TJF1410 only need to handle the essential analog functions for transmitting and receiving signals over the physical medium. They communicate with the host via a 3-pin OPEN Alliance (OA) interface. TJA1410 and TJF1410 PMD transceivers specifications: Networking – 10BASE-T1S (Compliant with IEEE 802.3cg and OPEN Alliance TC14,TC10 specifications) Host Interface – 3-pin OA interface (requires host MCU/switch with a 10BASE-T1S digital PHY) […]

February 18, 2026February 21, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

NXP S32N79 octa-core Arm Cortex-A78E/12-core Cortex-R52 “Super-Integration Processor” targets Software-Defined Vehicles (SDV)

NXP recently introduced the S32N79 “Super-Integration” automotive processor, part of the S32N7 series, equipped with up to eight Arm Cortex-A78E application cores and twelve Arm Cortex-R52 cores for real-time processing. Building on the earlier 5 nm S32N55 16-core Cortex-R52 + 2x Lockstep Cortex-M7 automotive processor, the S32N79 automotive processor is still designed for software-defined vehicles (SDV), but its Cortex-A78E applications cores further enable features such as ADAS sensor fusion and data AI services, as well as improved vehicle gateway/processing functions. NXP S32N79 key features and specifications: CPU Up to 8x split-lock Arm Cortex-A78AE cores operating at up to 1.8 GHz Up to 12x split-lock Arm Cortex-R52 cores operating at up to 1.4 GHz RISC-V-based accelerator for networking, math, and data-intensive workloads AI accelerator – eIQ Neutron neural processing unit (NPU) for vehicle core NeuroNetwork offload Memory Up to 2x LPDDR4X/5/5X DRAM interfaces Up to 36 MB platform SRAM Storage 2x […]

October 28, 2025October 30, 2025 by Debashis Das - 3 Comments

NXP i.MX 952 processor supports local dimming for AI-enhanced automotive and industrial HMIs

NXP i.MX 952 automotive industrial AI processor

NXP has recently introduced the i.MX 952 applications processor, a new member of the i.MX 95 series, designed for AI-powered automotive and industrial applications, including driver monitoring, child presence detection, and in-cabin HMIs. The i.MX 952 features up to four Arm Cortex-A55 cores with Cortex-M7 and M33 microcontroller cores, and is compliant with ISO 26262 ASIL B and SIL2/SIL3 standards. It integrates an eIQ Neutron NPU for AI-based sensor fusion, a 500 Mpixel/s ISP with RGB-IR support, and is the first processor with built-in local dimming for better display efficiency. Security features include EdgeLock Secure Enclave with post-quantum cryptography, meeting ISO 21434 and IEC 62443 standards. It can be interfaced with NXP’s PF09 PMIC, PF53 regulator, Trimension UWB, and IW693/AW693 Wi-Fi 6/6E SoCs, and is pin-to-pin compatible with other members of the i.MX 95 family. NXP i.MX 952 specifications: CPU Up to 4 Arm Cortex-A55 cores with 32KB + 32KB L1-cache, 64KB L2 […]

September 25, 2025September 25, 2025 by Sponsored Post - 2 Comments

5 Ways Embedded AI Processors are Revolutionizing Device Performance (Sponsored)

Artificial intelligence (AI) is moving from cloud-first architectures to edge-first designs, so more processing now runs on phones, cameras, and embedded controllers. Running inference on-device cuts latency and keeps sensitive data local. This momentum is reshaping product roadmaps, all due to different revolutions driven by edge AI. The Core Revolutions Driven by Edge AI Instead of routing every model and signal to the cloud, devices are processing more data locally to act faster and protect sensitive information. Because edge AI is changing where intelligence runs, IDC estimates global spending on edge computing reached about $261 billion in 2025. This rapid enterprise investment is due to several reasons. 1. Enabling Real-Time, On-Device Decisions Eliminating the cloud round-trip lets devices turn sensor input into action in milliseconds. This capability is essential for industrial automation and control loops because embedded AI processors run optimized models on-device, so decisions happen continuously. 2. Strengthening Privacy […]

August 29, 2025August 29, 2025 by Debashis Das - No Comments

NXP MCX A34 mixed-signal Cortex-M33 MCU delivers 17x faster math acceleration for motor control and HVAC systems

NXP has launched the MCX A34 mixed-signal Arm Cortex-M33 industrial MCU, an upgrade of the MCX A14x and MCX A15x MCUs, which were introduced in 2024. While the A14x/A15x offered Cortex-M33 cores up to 96 MHz, 128 KB Flash, 32 KB SRAM, a 12-bit ADC, the A34 scales up with a 180 MHz core, up to 1 MB Flash, 256 KB SRAM, four 16-bit ADCs (3.2 Msps), four OpAmps, a 12-bit DAC, and FlexPWM with enhanced quadrature decoding. It also features a dedicated Math Acceleration Unit (MAU) that executes trigonometric, reciprocal, and square root operations up to 17x faster than CMSIS-DSP, a SmartDMA coprocessor for offloading data transfers, and advanced security features with tamper detection and secure boot. Connectivity is also richer, with up to six UARTs, four I²C, two SPI, and a CAN FD interface. MCX A34 specifications: MCU core – Arm Cortex-M33 core clocked at up to 180 […]

August 25, 2025August 24, 2025 by Debashis Das - No Comments

NXP IW623 SoC supports 2×2 tri-band Wi-Fi 6E, Bluetooth LE audio

NXP has recently launched the IW623, a Tri-band Wi-Fi 6E and Bluetooth LE Audio SoC, which can be considered as the 4th member of the IW62x family, as back in 2020, NXP launched the IW620, with Wi-Fi 6 and Bluetooth 5.1 connectivity. After that, in January 2022, they released the IW612 tri-radio SoC, adding 802.15.4 support for Matter-enabled smart home gateways, and later in September 2025, they launched the IW693 Wi-Fi 6E SoC with concurrent dual-Wi-Fi and Bluetooth for industrial IoT and automotive markets. The IW623 Wi-Fi 6E Bluetooth SoC also includes features like 2×2 MU-MIMO, OFDMA, Target Wake Time (TWT), wireless multi-streaming, adaptive scheduling, and agile channel switching for congested environments. A dedicated Wi-Fi/Bluetooth coexistence engine with hardware and software arbitration ensures smooth operation when both radios are active, while the integrated PA/LNA/Switch reduces external RF components and improves range. Host connectivity is available over PCIe and SDIO for […]

July 10, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP introduces IW693 Wi-Fi 6E SoC with 2×2 MIMO for industrial IoT and Smart Home applications

NXP has unveiled the IW693 Wi-Fi 6E (and Bluetooth) SoC with 2×2 MIMO for industrial IoT and Smart Home applications, offering a higher-end option to the company’s IW612 tri-radio solution, but which omits an 802.15.4 radio. The IW693 supports concurrent dual Wi-Fi (CDW) and Bluetooth/Bluetooth Low Energy operation in four modes: Mode 1: CDW 2×2 Wi-Fi 6/6E 5-7 GHz (802.11ax) + 1×1 Wi-Fi 6 2.4 GHz (802.11ax) Mode 2: CDW 1×1 Wi-Fi 6/6E 5-7 GHz (802.11ax) + 1×1 Wi-Fi 6 2.4 GHz (802.11ax) Mode 3: 2×2 Wi-Fi 6 2.4 GHz (802.11ax) Mode 4: 2×2 Wi-Fi 6/6E 5-7 GHz (802.11ax) NXP IW693 specifications: Wi-Fi features 2×2 Wi-Fi 6/6E and 1×1 Wi-Fi 2.4 GHz concurrent dual wireless mode (mode 1) 2×2 radio 40 MHz channel for 2.4 GHz (RF paths 2A/2B) 1024 QAM (MCS11), up to 80 MHz channel for 5-7 GHz (RF paths 5A/5B) 1×1 radio 20 MHz channel for 2.4 […]