Orbbec Femto Bolt is a 3D depth and RGB USB-C camera developed in collaboration with Microsoft and integrating the same ToF (Time-of-Flight) technology as found in the Microsoft Azure Kinect camera module and HoloLens 2 mixed reality head-mounted display. The new model follows the launch of the fully integrated Femto Mega featuring an NVIDIA Jetson Nano module introduced in January with the same ToF technology, so the new USB-C camera simply allows a wider selection of hosts. Orbbec has also launched the Femto Mega I variant with an IP65 metal enclosure. Orbbec Femto Bolt specifications: Cameras Depth camera 1 Mega Pixel ToF sensor 850nm wavelength 0.25 to 5.45m range depending on the depth mode Up to 1024×1024 @ 15 fps (WFoV) or 640×579 @ 30 fps (NFoV) FoV Wide – H: 120°; V: 120° Narrow – H: 75°; V: 65° RGB camera 4K resolution up to 3840×2160 @ 25 fps […]
Orbbec Femto Mega 3D depth and 4K RGB camera features NVIDIA Jetson Nano, Microsoft ToF technology
Orbbec Femto Mega is a programmable multi-mode 3D depth and RGB camera based on NVIDIA Jetson Nano system-on-module and based on Microsoft ToF technology found in Hololens and Azure Kinect DevKit. As an upgrade of the earlier Orbbec Femto, the camera is equipped with a 1MP depth camera with a 120 degrees field of view and a range of 0.25m to 5.5m as well as a 4K RGB camera, and enables real-time streaming of processed images over Ethernet or USB. Orbbec Femto Mega specifications: SoM – NVIDIA Jetson Nano system-on-module Cameras 1MP depth camera Precision: ≤17mm Accuracy: < 11 mm + 0.1% distance NFoV unbinned & binned:H 75°V 65° WFoV unbinned & binned:H 120°V 120° Resolutions & framerates NFoV unbinned: 640×576 @ 5/15/25/30fps NFoV binned: 320×288 @ 5/15/25/30fps WFoV unbinned: 1024×1024 @ 5/15fps NFoV binned: 512×512 @ 5/15/25/30fps 4K RGB camera FOV – H: 80°, V: 51°b D: 89°±2° Resolutions […]
Orbbec Femto ToF camera enables accurate 3D object and scene capture
We’ve written a couple of articles about Time-of-Flight (ToF) technology in recent weeks notably about ranging sensors such as VL53L8 dToF sensor and Toppan hybrid ToF sensor, but Orbbec has used the technology in their Femto camera line designed to capture 3D objects and scenes. The Femto 3D cameras support a depth-of-field (DoF) from 0.2 to 5 meters, multi-camera synchronization, can be used in complete darkness, and are equipped with a 6-Axis IMU tracking sensor for motion tracking. The ToF cameras should find their way into applications for healthcare, warehousing/shipping, autonomous robotics, augmented reality, and other sectors. Three models are available with the following highlights: Femto – 0.2 to 5 meters optical range with a depth resolution of 640 x 480 @ 30fps, and 5.8W power consumption. 99.4 x 68 x 25mm form factor. Femto W – Wide depth field of view (H90, V74) and color field of view (H98.6, […]
Orbbec Persee+ 3D AI camera runs Ubuntu or Android on Amlogic A311D processor
Orbbec Persee+ is a 3D depth camera running Linux with AI capabilities thanks to Amlogic A311D hexa-core processor equipped with a 5 TOPS NPU (Neural-network Processing Unit). The Persee+ is designed to help researchers, engineers, and hobbyists implement advanced uses for 3D imaging. Orbbec has been around for several years with the first product we covered here being the Orbbec Persee 3D depth camera running Ubuntu or Android on Rockchip RK3288 processor and unveiled in 2015. Last year, the company introduced the Zora P1 Amlogic A311D development board for Orbbec 3D cameras, so in a way, the Orbbec Persee+ is born from the work done on the Persee camera and Zora P1 over the years. Orbbec Persee+ 3D AI camera specifications: SoC – Amlogic A311D hexa-core processor with 4x Cortex-A73 cores, 2x Cortex-A53 cores, Arm Mali-G52MP4 GPU, 5 TOPS NPU System Memory – 4GB RAM Storage – 8GB (specs) / […]
Zora P1 Amlogic A311D Development Board interfaces with Orbbec 3D Cameras
We have already seen the powerful Amlogic A311D powered Khadas VIM3 SBC, and Orbbec announced the Zora P1 development board for Orbbec 3D cameras, supporting robotics, gaming, smart homes, etc. Some of the other products showcased at the CES 2021 by Orbbec include its first 3D sensor with time-of-flight (TOF) technology, the latest Astra+ camera, and a real-time industrial 3D camera. “Innovations in 3D imaging, combined with broader advances like 5G, artificial intelligence, and ultra-fast processors, are transforming the application landscape for designers and engineers,” said David Chen, co-founder, and director of engineering at Orbbec. “Our new camera with time-of-flight (TOF) technology is a great example. Its high resolution and tracking capabilities make it perfect for all kinds of products including fall detection, security, even at-home yoga and exercise products.” Orbbec’s Zora P1 Development Board Zora P1 is a processing board for developers and enthusiasts to integrate 3D imaging and associated computing tasks for demanding industrial applications. Orbbec has specially designed this long-lasting solution to work with its 3D […]