renesas News - CNX Software - Embedded Systems News

December 12, 2025 by Debashis Das - 3 Comments

Renesas RA6W1/RA6W2 Cortex-M33 wireless MCUs offer dual-band Wi-Fi 6, BLE, Matter, 15-year availability

Renesas RA6W1 and RA6W2 dual band Wi Fi 6, BLE, Matter Cortex M33 Wireless MCU

Renesas has added the RA6W1 (Wi-Fi 6) and the RA6W2 (Wi-Fi 6 + BLE) MCUs to its high-performance RA6 family, adding dual-band Wi-Fi 6 and Bluetooth LE, as well as Matter connectivity to the series. Both models feature a 160 MHz Arm Cortex-M33 core, dual-band Wi-Fi 6 with WPA3 security, on-chip PA/LNA/RF switch, and a full TCP/IP stack for fast connectivity. They integrate up to 704 KB SRAM, 256 KB ROM, and support eMMC/SD, O-QSPI, and QSPI for external flash and/or PSRAM. The series also includes generic peripherals like SPI, I²C, I²S/PDM, SDIO, 12-bit ADCs, PWM timers, and up to 28 GPIOs. Offered in compact QFN/WLCSP packages, the RA6W1/2 MCUs target smart home, wearables, industrial, and consumer IoT markets where long battery life and wireless connectivity are essential. Renesas RA6W1 specifications: MCU core – Arm Cortex-M33 @ up to 160 MHz, Armv8-M architecture with MPU and SysTick Memory & Storage […]

October 27, 2025October 26, 2025 by Debashis Das - No Comments

1GHz Renesas RA8D2 and RA8M2 Cortex-M85 MCUs feature up to 1MB MRAM, 2MB SRAM

Renesas RA8M2 and RA8D2 dual core Cortex M85, M33 MCU with MRAM storage

After introducing the 1 GHz RA8T2 MCU earlier this month, Renesas has recently expanded its RA8 lineup with the RA8D2 and RA8M2 groups of MCUs, where the RA8D2 is designed for graphics, HMI, and AI applications with support for display, camera, and audio interfaces, while the RA8M2 targets general-purpose, high-performance IoT and industrial control systems with networking and compute capabilities. Both MCU groups deliver a performance of up to 7,300 Coremarks, offer up to 1MB of MRAM and 2MB of SRAM, and support SiP options with up to 8MB flash. The RA8D2 adds HMI capabilities, including a 1280×800 graphics LCD controller, a 2D drawing engine, MIPI DSI and CSI-2 interfaces, and audio input support for voice and vision AI. Common features include dual Gigabit Ethernet with TSN, USB 2.0, CAN FD, I3C, and various analog peripherals. Integrated RSIP-E50D security, Helium acceleration for DSP/ML with various software support. Renesas RA8D2 and […]

October 6, 2025November 19, 2025 by Debashis Das - No Comments

1GHz Renesas RA8T2 Cortex-M85 MCUs feature MRAM and EtherCAT for industrial motor control

Renesas has recently introduced the new RA8T2, an AI-powered motor control Cortex-M85 MCU that can be considered a direct upgrade to the RA8T1, which launched last year. The RA8T2 offers higher performance along with networking options for industrial, robotics, and other motor control systems. The RA8T2 features a 1GHz Arm Cortex-M85 core, an optional 250MHz Cortex-M33 core, up to 1MB MRAM and 2MB SRAM, a 300MHz PWM timer, dual 16-bit ADCs with simultaneous sampling, high-speed comparators, fast PWM shutdown, and more. Connectivity options include dual Gigabit Ethernet, EtherCAT slave, USB, CAN FD, I3C, and SPI, while security features include TrustZone and a cryptographic engine. Renesas RA8T2 key features and specifications: MCU core Arm Cortex-M85 up to 1 GHz (Armv8.1-M, TrustZone, FPU, MVE, ETM) Arm Cortex-M33 up to 250 MHz (Armv8-M, DSP, TrustZone, ETM) Memory & Storage Up to 1 MB MRAM 2 MB SRAM (with ECC) 256 KB TCM for […]

October 1, 2025September 30, 2025 by Debashis Das - 1 Comment

ARIES MSRZG3E OSM-compliant SiP with Renesas RZ/G3E MPU targets industrial HMI and Edge AI

ARIES Embedded MSRZG3E OSM compliant SiP

ARIES Embedded MSRZG3E is an OSM-compliant system-in-package (SiP) built around the Renesas RZ/G3E MPU, designed for HMI, industrial, medical, and edge AI applications. The Renesas RZ/G3E SoC integrates a quad-core Arm Cortex-A55 CPU, a Cortex-M33 real-time core, and an Ethos-U55 NPU delivering up to 512 GOPS for AI power. Other features include PCIe Gen3, USB 3.2, dual Gigabit LAN, plus CAN FD, UART, I2C, SPI, and ADC. Multimedia support includes dual displays, MIPI-CSI camera input, and H.264/H.265 video codec. The SiP ships with 512 MB to 8 GB LPDDR4 RAM and 4 GB to 64 GB eMMC flash, with commercial and industrial-grade temperature support. MSRZG3E MSRZG3E SiP specifications: SoC – Renesas RZ/G3E dual or quad Arm Cortex-A55, Arm Cortex-M33 core MCU Memory – 512 MB to 8 GB LPDDR4 RAM Storage 4 GB to 64 GB eMMC NAND flash 2 Mbit to 512 Mbit SPI NOR flash 476-pad land grid […]

September 24, 2025September 23, 2025 by Debashis Das - No Comments

Renesas RA0L1 low-cost Cortex-M23 MCUs adds capacitive, EMI-resistant touch

Renesas RA0 Capacitive Touch Ultra Low Power MCUs

Renesas has expanded its low-cost RA0 series of low-cost, low-power Cortex-M23 MCUs with the new RA0L1, the first in the lineup to feature integrated capacitive touch. Designed for low-cost battery-powered applications with responsive touch control, ultra-low current consumption, and fast wake-up. The RA0L1 combines up to 64KB flash, 16KB SRAM, and a 1.6V–5.5V operating range with peripherals such as a 12-bit ADC, temperature sensor, multiple UART/I2C/SPI interfaces, timers, RTC, and a random number generator. It supports up to 24 capacitive touch channels using Renesas’ self-capacitance technology, a high-accuracy ±1% on-chip oscillator, safety functions, and security features including TRNG and unique ID. Renesas RA0L1 MCU specifications: MCU Core – Arm Cortex-M23 Armv8-M Core up to 32MHz Memory and Storage 16KB SRAM with parity Code Flash – Up to 64KB Data Flash – 1KB(1M program/erase cycles) Flash read protection (FRP) 128-bit unique ID Human-Machine Interface Capacitive Touch Sensing Unit – up to […]

September 11, 2025 by Debashis Das - No Comments

Renesas RL78/L23 16-bit MCU features segment LCD interface, SMS for low-power HMI systems

Renesas’ RL78/L23 is a low-power 16-bit MCU with built-in segment LCD, capacitive touch, dual-bank flash for FOTA, and a wide 1.6–5.5 V operating voltage range. It targets HMI appliances, metering, and low-cost IoT products with support up to 2037. Key features include up to 512 KB dual-bank flash, 32 KB SRAM, 8 KB data flash, with ~1 µs wake-up, and SMS (Snooze Mode Sequencer) to run LCD/touch tasks without waking the CPU. It integrates a segment LCD controller with a new VL4 reference mode that cuts LCD current by ~30% compared to the RL78/L1x. Connectivity and sensing options include UART/I²C/CSI, a temperature sensor, and an internal oscillator. With an industrial operating temperature range and a wide supply range, this MCU is suitable for induction cooktops, HVAC panels, utility meters, and battery-powered HMI devices. Renesas RL78/L23 MCU Specifications: CPU core – Renesas RL78 16-bit CISC core, 3-stage pipeline, 0.03125 µs/instruction at […]

August 22, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Renesas RA4C1 Arm Cortex-M33 MCU targets Smart Meters and energy-efficient IoT applications

Renasas RA4C1 microcontroller (MCU) group is based on an 80-MHz Arm Cortex M33 core and designed for utility meters and battery-powered IoT applications. It’s especially suited to devices that require advanced security and segment LCD support, such as smart locks, thermostats, building controls, and industrial user interfaces. The RA4C1 is very similar to the Renesas RA4L1 MCU designed for HMI applications, but it comes with more RAM (96KB vs 64KB), and being optimized for Smart Meters lacks features like capacitive touch and audio output. The new MCU group still comes with up to 512KB code flash, 8KB data flash, plenty of I/Os, and a low-power consumption down to 168 µA/MHz in active mode, and a standby current of less than 1.79 µA with all SRAM retained. Renesas RA4C1 specifications: MCU core – Arm Cortex-M33 Armv8-M core up to 80 MHz Memory – 96 KB SRAM Storage 256 KB or 512 KB […]

August 4, 2025August 4, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Renesas RZ/G3E Arm Cortex-A55/M33 MPU targets mid-range HMI systems requiring AI acceleration

Renesas RZ/G3E is a new member of the company’s RZ/G SoCs with a quad-core Cortex-A53 application processor, a Cortex-M33 real-time core, and an Ethos-U55 NPU for mid-range, AI-enhanced HMI (Human Machine Interface) systems with up to two 1920 x 1080 resolution displays. The industrial-grade processor features MIPI-DSI, dual-link LVDS, and Parallel RGB display interfaces, 2D and 3D graphics accelerators, H.264/H.265 video decoding, a 4-lane MIPI CSI interface, two gigabit Ethernet interfaces, 2-lane PCIe Gen3, USB 3.0/2.0, and a range of analog and digital I/Os. Renesas RZ/G3E specifications: CPU Dual- or quad-core Arm Cortex-A55 processor clocked at up to 1.8 GHz Arm Cortex-M33 system management processor clocked at up to 200 MHz GPU – Arm Mali-G52 3D GPU, Image Scaling Unit (ISC), Frame Data Processor (FDP) VPU – H.264/H.265 Video codec unit (VCD) NPU – Optional Arm Ethos-U55 NPU clocked at up to 1 GHz (512 GOPS) Memory 512KB on-chip SRAM […]