MediaTek unveils Genio 1200 premium AIoT processor with 4.8 TOPS NPU

MediaTek Genio 1200

MediaTek has introduced the Genio platform for AIoT devices, and unveiled the first chip of the Genio family with the Genio 1200 Octa-core Cortex-A78/A55 processor with a 4.8 TOPS NPU, 4K video support, and designed for premium AIoT products. The chip is manufactured with a 6nm processor, is said to consume less than 8W, supports dual 4Kp60 video output and up to 48MP @ 30 fps video capture, and  WiFi 6, Bluetooth 5.2 and 5G connectivity can be added through add-in chips. Targets applications include Smart Home appliances, HMI, industrial IoT, robotics, and more. MediaTek Genio 1200 key features and specifications: CPU – Octa-core processor with four Cortex-A78 cores @ up to 2.2 GHz, four Cortex-A55 cores GPU – Arm Mali-G57 MC5 GPU VPU Encoding up to 4Kp60 with H.265/HEVC Decoding up to 4Kp90, AV1, VP9, HEVC, H.264 codecs supported AI accelerator – Dual-core Mediatek AI processor (APU) with INT8, INT16, […]

NXP i.MX RT1180 Cortex-M7/M33 crossover MCU integrates GbE TSN for industrial IoT communication

NXP i.MX RT1180 is the latest member of the company’s i.MX RT Series crossover MCUss with application processor-like performance. The 800 MHz dual-core Arm Cortex-M7/M33 microcontroller is specifically designed for industrial IoT communication with a Gigabit Ethernet port supporting time-sensitive networking (TSN). NXP also highlights that it is the first crossover MCU to include an EdgeLock secure enclave that “eases the complexity of implementing robust, system-wide security intelligence for industrial IoT applications”, and the new processor aims to bridge the gap between existing industrial systems and Industry 4.0 system. NXP i.MX RT1180 key features and specifications: CPUs – Arm Cortex-M7 @ 800 MHz + Arm Cortex-M33 @ 240 MHz (Optional: single-core Arm Cortex-M33) On-chip Memory – Up to 1.5 MB SRAM (ECC protected) with 512 KB of TCM for Cortex-M7 and 256 KB of TCM for Cortex-M33 Memory & Storage I/F – 2x FlexSPI for HyperRAM or HyperFlash 8/16/32-bit SDRAM/LPSDRAM […]

Orbbec Persee+ 3D AI camera runs Ubuntu or Android on Amlogic A311D processor

Orbbec Persee+ is a 3D depth camera running Linux with AI capabilities thanks to Amlogic A311D hexa-core processor equipped with a 5 TOPS NPU (Neural-network Processing Unit). The Persee+ is designed to help researchers, engineers, and hobbyists implement advanced uses for 3D imaging. Orbbec has been around for several years with the first product we covered here being the Orbbec Persee 3D depth camera running Ubuntu or Android on Rockchip RK3288 processor and unveiled in 2015. Last year, the company introduced the Zora P1 Amlogic A311D development board for Orbbec 3D cameras, so in a way, the Orbbec Persee+ is born from the work done on the Persee camera and Zora P1 over the years. Orbbec Persee+ 3D AI camera specifications: SoC – Amlogic A311D hexa-core processor with 4x Cortex-A73 cores, 2x Cortex-A53 cores, Arm Mali-G52MP4 GPU, 5 TOPS NPU System Memory – 4GB RAM Storage – 8GB (specs) / […]

RAKwireless adds more Wisduo and Wisblock modules, launches WisToolBox configuration tool for IoT devices

RAKwireless have launched several Wisduo wireless modules, a dozen of Wisblock modules for IoT prototyping, updated WisDM, WisGateOS, and RUI3 software, and introduced WisToolBox mobile/desktop configuration tool for IoT devices as part of their spring launch 2022 even entitled “Empowering the Innovators: Making IoT your own”. Three new Wisduo modules RAK3172-SIP WisDuo SIP based on STM32WLE5 Wireless SoC with LoRa connectivity. Compared to the original RAK3172, it offers more IO pins, integrates a TCXO, and comes in a smaller size. The module supports LoRa P2P and complies with Class A, B, & C of LoRaWAN 1.0.3 specifications. Cost: $5.99. WisDuo RAK3272-SiP – That’s a breakout board for the RAK3172-SiP System-in-a-Package module for LoRaWAN and allows easy access to all pins via 2.54mm pitch headers. RAK4630 WisDuo Stamp Module – This module supports both LoRa/LoRaWAN and BLE 5.0, and comes with RUI V3 (RUI3) firmware. It can be deployed as an […]

Dongshan Nezha STU devkit features Allwinner D1 RISC-V SoM/SBC

Dongshan Nezha STU is a development kit comprised of an Allwinner D1 RISC-V system-on-module (SoM) and a carrier board with three 40-pin headers to access I/Os from the RISC-V processor. While not quite as compact as the Sipeed LicheeRV module, the “Dongshan Nezha STU Core” module also doubles as a standalone single board computer (SBC) with USB-C, Ethernet and HDMI ports, plus a MicroSD card socket for the firmware, which reminds me of the Khadas Edge design. Dongshan Nezha STU specifications: Nezha STU Core SoM SoC – Allwinner D1 single-core XuanTie C906 64-bit RISC-V processor @ 1.0 GHz with HiFi4 DSP, G2D 2D graphics accelerators Memory – 512MB DDR3 memory (option up to 2GB – TBC) Storage – MicroSD card slot, 2Gbit serial NAND flash (MX35LF1GE4AB); Note the SPI NAND flash (U12) is not populated in the photo below. Video – HDMI port up to 1080p60 Networking – Low-profile Gigabit […]

NVIDIA launches Jetson AGX Orin Developer Kit, Orin NX modules, and Isaac Nova Orin AMR platform

NVIDIA Jetson AGX Orin module was first introduced in November 2021, but the company has now officially launched the Jetson AGX Orin Developer Kit, andunveiled the lower cost Orin NX modules still with 70 TOPS or more, and the Isaac Nova Orin AMR (autonomous mobile robot) reference platform. NVIDIA Jetson AGX Orin Developer Kit Jetson Orin AGX developer kit specifications: Jetson AGX Orin module with CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor with 3MB L2 + 6MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores @ 1.3 GHz DL Accelerator – 2x NVDLA v2.0 Vision Accelerator – PVA v2.0 (Programmable Vision Accelerator) AI Performance – Up to 275 TOPS (INT8) @ 60W Video Encode – 2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265) Video Decode – 1x 8K30 | 3x 4K60 | 7x 4K30 | […]

Quadric devkit features q16 hybrid AI, DSP, computer vision accelerator

The Quadric devkit is an M.2 Key M module equipped with the company’s q16 edge processor offering a hybrid data-flow + Von Neumann machine for not only neural networks, but also computer vision, digital signal processing, BLAS (Basic Linear Algebra Subprograms), and other workloads. This architecture allows the Quadric q16 to be more flexible than traditional AI accelerators and can deliver more effective solutions for heterogonous systems that may have multiple accelerators or require a powerful processor. The M.2 form factor enables easy integration into boards with an M.2 Key M socket such as the Gumstix Raspberry Pi 4 development board shown below with the Quadric devkit. Quadric devkit specifications: Accelerator – Quadric q16x4 Processor with 256 Vortex Cores, 8 MB on-chip memory, 4 kB per core memory, multi-precision multiply accumulate; 16 x 16mm package Memory – 4GB LPDDR4, 32-bit, dual-rank up to 3677 MHz Host Interface – 2-lane PCIe […]

Rockchip RK3588 TRM, Android 12 firmware released

Firefly ITX-3588J mini-ITX motherboard powered by Rockchip RK3588 processor was introduced at the beginning of the month, and now the company has started selling samples for the Core-3588J system-on-module and taken the opportunity to release the Rockchip RK3588 TRM (technical reference manual), and Android 12 firmware and SDK. Firefly Core-3588J module Before we check out the new documentation and Android software development kit, let’s have a quick look at Firefly Core-3588J module specifications: SoC – Rockchip RK3588 octa-core processor with  four Arm Cortex-A76 cores @ up to 2.4 GHz, four Arm Cortex-A55 cores, ArmMali-G610 MP4 quad-core GPU with support for OpenGL ES3.2, OpenCL 2.2, Vulkan1.1, 6 TOPS NPU, 48MP ISP, 8Kp60 video decoding, 8Kp30 video encoding System Memory – 4GB, 8GB, 16GB, or 32GB LPDDR4/LPDDR4x/LPDDR5 memory Storage – 16GB, 32GB, 64GB, or 128GB eMMC flash 314-pin MXM 3.0 edge connector for peripherals interfaces including HDMI 2.1 outputs, HDMI 2.0 input, […]