SMARC Modules With NXP i.MX 8M Plus Processor (Sponsored)

congatec smarc NXP i.MX8M Plus

Low-power flagship for artificial intelligence – congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with an application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible. That hasn’t always been so easy. Previously, it was usually much more difficult to use the latest processor technology from the Arm environment as a finished system than to implement the x86 environment. This is because, as a result of the historically large range of individually tailored custom designs used in large quantities, the ecosystem of system platforms is not that extensive. However, with the modular approach based on the SMARC computer-on-modules specification, it is now also possible to obtain standard form factors from the x86 box PC range with ARM processors. For example, the embedded computing specialist congatec […]

Overview and List of System-on-Module and Computer-on-Module Standards – Q7, SMARC, COM HPC, and More

QSeven_vs_SMARC

A System-on-Module (SoM), also known as a Computer-on-Module (CoM), is a small board with the key components of a computer such as SoC, memory, and possibly others components such as PMIC (Power Management IC), an Ethernet PHY, as well as one or more connectors used to connect to a baseboard, also called carrier board, which features standard ports such as Ethernet (RJ45), USB ports, SATA, power jack and so on. The advantages of using of baseboard + SoM design compared to a single board are at least twofold: Most of the PCB design complexity is often around the CPU/SoC and high-speed buses connected to the CPU/SoC. So you could buy an SoM, design your own baseboard and get a complete design relatively in a short amount of time, with reduced development resources and costs. The design is modular, so you could easily upgrade from one SoM to another one. For […]

ADLINK launches SMARC Short Size Module, Devkit with NXP i.MX 8M Plus

I-PI SMARC IMX8M Plus development kit

We had seen many i.MX 8M Plus modules with built-in AI accelerator announced at Embedded World 2021, including two SMARC modules from Congatec and iWave Systems. ADLINK has added another of i.MX 8M Plus module compliant with SMARC 2.1 “short” standard with LEC-IMX8MP system-on-module equipped with up to 8GB RAM, 128 GB eMMC flash, as well as a development kit called I-Pi SMARC IMX8M Plus prototyping platform. LEC-IMX8MP module specifications Specifications: SoC – NXP i.MX8M Plus with quad-core ARM Cortex-A53 processor, Vivante GC380 2D GPU and GC7000UL 3D GPU, 1080p60 video decoder & encoder, optional 2.3 TOPS Neural Processing Unit (NPU) System Memory – 2/4/8GB LPDDR4L-4266 Storage – 16, 32, 64, or 128GB eMMC flash (build option) Wireless – Optional 802.11 ac/a/b/g/n WiFi 5 2X2 MIMO and Bluetooth 5.0 module 314-pin MXM 3.0 edge connector Storage – 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 Display – […]

Kontron unveils RK3399K(Pro) SMARC 2.1 Module with up to 8GB RAM

RK3399K SMARC CPU Module

Embedded systems companies tend to use processors from established firms like NXP Semiconductors or Texas Instruments, we’ve seen few systems-on-module based on processors from Amlogic, Rockchip, or Allwinner which are popular on this blog due to their value proposition. One of the reasons was/is software support, but this has improved over the years, and the other is the lack of wide temperature range parts plus potential concerns about long term supplies. I’m not aware of any industrial/extended temperature range part from Amlogic, but Allwinner provides A40i/A60i industrial temperature range processors, and Rockchip RK3399K supports an extended commercial temperature range between -20 to +85°C. Kontron selected the latter for their first-ever Rockchip powered system-on-module: the SMARC-fA3399 SMARC 2.1 module. SMARC-fA3399 SoM specifications: SoC – Rockchip RK3399K hexa-core processor with two Cortex A72 cores @ 1.8/2.0 GHz (wide temp vs commercial temp), four Cortex-A53 cores @ 1.4/1.6 GHz, Arm Mali-T860MP4 GPU System […]

TQ Embedded Unveils Intel Elkhart Lake COM Express and SMARC 2.1 Computers-on-Module

Elkhart Lake COM

German technology company TQ Embedded has unveiled the TQMxE40 computer-on-module families based on the Intel Atom x6000E series, as well as Intel Pentium and Celeron N and J “Elkhart Lake” processors that comply with COM Express Mini, COM Express Compact, and SMARC computer-on-module standards. The company’s TQMxE40M, TQMxE40S, and TQMxE40C1/C2 embedded modules are offered with all twelve Intel Elkhart Lake processors, up to 64GB RAM, and a -40°C to +85°C industrial temperature range. The computers-on-module are especially suited to industrial automation, medical technology, measurement technology, robotics as well as transport and logistics applications. TQMxE40M COM Express Mini Module Specifications: SoC – Intel Atom x6000E Series or Intel Pentium and Celeron N and J Series  part of Elkhart Lake family with 4.5 W to 12 W TDP System Memory – 4, 8, 16 GB LPDDR4/4x with IBECC (In-band EEC) Storage – 8 to 256 GB eMMC flash, 32kbit EEPROM COM Express […]

Congatec Unveils Atom x6000E Elkhart Lake Powered Pico-ITX SBC, Qseven, SMARC, COM Express Modules

conga-PA7 Atom x6000E SBC

With the announcement of Intel Elkhart Lake IoT-optimized processors, we should expect embedded systems companies to unveil their own Atom x6000E and Celeron/Pentium Elkhart Lake powered products, and one of the first to do so is Congatec with the introduction of four different Elkhart Lake computers-on-module (CoM) following Qseven, SMARC, and COM Express standards, as well as a Pico-ITX SBC. conga-PA7 Atom x6000E SBC (with Celeron/Pentium J optional) Detailed specifications: SoC –  Choice of eight different Elkhart Lake processors from the 6W Atom x6211E dual-core processor to the 10W Intel Pentium J6425 quad-core processor up to 3.0 GHz, all with 10th Gen Intel UHD graphics System Memory – Up to 16GB quad-channel onboard LPDDR4x Storage 32GB or 64GB UFS 2.0 flash (optional up to 512GB) M.2 SATA/PCIe SSD support (see expansion) 32 MB serial flash for AMI Aptio UEFI firmware Video DisplayPort DP++ video output up to 4Kp60 1x USB-C […]

TQ Group Announces NXP i.MX 8X ARM Cortex-A35 Modules as the Processor Finally Becomes Available

TQMa8Xx i.MX 8X Module

TQ Group, headquartered in Germany, has launched two NXP i.MX 8X Cortex-A35 modules with TQMa8Xx and TQMa8XxS SoMs, with the latter being SMARC 2.1 compliant, and both targeting various applications ranging from medical devices, HMIs, industrial controllers and industrial Internet of Things (IIoT) to gateways, building automation, transport, and robotics. The press release explains NXP will officially launch i.MX 8X CPUs on May 14, 2020. We first heard about i.MX 8X in 2016, before an official announcement in 2017, and we wrote about Toradex i.MX 8X SoM in 2018, plus 96Boards AI-ML SBC in 2019, so I naively believed the processor had been around for a couple of years, but the Toradex SoM product is still shown as an “early product announcement” [Update: the page has just been updated since it is now shipping as well],  and AI-ML board has just launched with 26 units available on Arrow website. Some […]

SGET SMARC 2.1 Hardware Specification Allows Up to 4 Cameras, 4 Ethernet Interfaces

SMARC 2.1

There are plenty of standards for systems-on-module that are supposed to allow interoperability between vendors. For example vendor 1 may create a Qseven SoM that works with vendor 2’s Qseven compliant carrier board which should accept any Qseven compatible module, although in practice, there are always some small differences that may cause problems. Many of those standards are managed by SGET (Standardization Groups for Embedded Technologies) including SMARC (“Smart Mobility ARChitecture”), Qseven, and Embedded NUC. A recent post on ADLINK Technology alerted us of the publication of SMARC 2.1 hardware specification (PDF) with the following changes: Incorporated Errata 1.1 Rev. 2 (2/9/2017) Updated signal tables with pin number, power domain, termination information… Added details for eDP[0:1]_HPD Added SERDES as alternative function for PCIeC and PCIeD Added MDIO Interface Updated power domains and power sequencing Added two extra GPIOs PCIe Clock Request signals for PCIeA and PCIeBat at previous locations Changed […]