solidrun

Posted on by Debashis Das - 4 Comments on SolidRun P100 COM Express Type 6 module features LPCAMM2 memory, up to 12-core AMD Ryzen AI Embedded P185 SoC

SolidRun P100 COM Express Type 6 module features LPCAMM2 memory, up to 12-core AMD Ryzen AI Embedded P185 SoC

Ryzen AI Embedded P100 COM Express module

We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced its new P100 COM Express Type 6 module family. These compact (95 x 95mm) modules are among the first to support the newly released 8- to 12-core Zen 5 SKUs, with up to 50 TOPS from the NPU and 80 TOPS of total system AI. Another fairly unique feature of the new SolidRun computer-on-module is support for LPCAMM2 LPDDR5X memory. The company uses a screw-lock mechanism to deliver high-bandwidth LPDDR5X performance (up to 9600 MT/s) while maintaining the mechanical reliability required for “systems in motion,” such as autonomous mobile robots (AMRs), heavy machinery, and rail systems. A mini-ITX development kit for the module is also available. SolidRun P100 COM Express Type 6 module SolidRun P100 COM Express Type 6 module specifications: AMD Ryzen AI Embedded P100 Series […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 9 Comments on Electronic components price and lead time increases announced across the board, and not only because of RAM

Electronic components price and lead time increases announced across the board, and not only because of RAM

Electronics Price 2026

Most people already know about rapidly rising RAM prices, but I’m receiving more and more emails about price increases for a range of devices, in a way that’s reminiscent of the impact the Coronavirus/COVID-19 had in 2020 to 2022. We’ve already covered the Raspberry Pi Compute Modules price increase in October 2025, followed by the Raspberry Pi 4/5 price adjustment last December. Unsurprisingly, it’s going to spread to other companies as well. A few days ago, I received an email from SolidRun entitled “Customer Notification: Industry‑Wide Component Shortages and Price Increases”: The global semiconductor, and electronic components industry is currently experiencing significant price increases and widespread shortages. What started as memories shortage covering mostly DDR4 and NAND integrated circuits and modules – expanded across multiple categories (including SoCs). As a result, many critical components now face extended lead times, with certain items that were previously available within a few weeks […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 3 Comments on Bedrock RAI300 fanless industrial PC is powered by an AMD Ryzen AI 9 HX 370 mobile AI SoC

Bedrock RAI300 fanless industrial PC is powered by an AMD Ryzen AI 9 HX 370 mobile AI SoC

Soldrun Bedrock RAI300 industrial PC

SolidRun Bedrock RAI300 is the first industrial PC powered by a 12-core/24-thread AMD Ryzen AI 9 HX 370 mobile processor, typically used in premium consumer and commercial AI laptops. The fanless industrial computer supports up to 128GB DDR5 SO-DIMM memory to run AI models on the 50 TOPS NPU (80 TOPS combined) of the AMD processor, up to three M.2 NVMe 2280 PCIe Gen4 x4 storage devices, up to four display through HDMI 2.1 and DP 2.1 video outputs, and features up to four 2.5 Gbps Ethernet ports, a USB4 port, four USB 3.2 ports, and more. It’s available in two models: a thin “Tile” model and a thicker “60W model” to cater to different TDP configurations, ranging from 8W to 54W, and cooling options. Bedrock RAI300 specifications: SoC – AMD Ryzen AI 9 HX 370 “Strix Point” CPU – 12-core/24-thread processor with four Zen 5 cores up to 2.0/5.1 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on AMD Ryzen Embedded 8840U COM Express Type 6 Compact module takes up to 128GB DDR5

AMD Ryzen Embedded 8840U COM Express Type 6 Compact module takes up to 128GB DDR5

SolidRun Ryzen R8000 COM6 Compact Module

SolidRun has unveiled a new COM Express Type 6 Compact module powered by the AMD Ryzen Embedded 8840U Series with up to 39 TOPS of AI performance for industrial, medical, automation, and edge AI applications. The module supports up to 128GB DDR5 of memory via two SO-DIMM sockets, on-module M.2 NVME SSD storage, and features an Intel i226 2.5GbE controller. It exposes I/Os through standard board-to-board connectors, including 16-lane PCIe Gen4, four DisplayPort video outputs, eDP or LVDS display interface, two SATA, various USB ports, and more. Ryzen R8000 CoM6 specifications: SoC – AMD Ryzen Embedded 8840U CPU – 8-core/16-thread Zen4 processor up to 3.3 GHz / 5.1 GHz (Turbo) GPU – AMD Radeon 780M with 12x Compute Units @ 2700 MHz (RDNA3 graphics) AI 16 TOPS NPU (AMD XDNA) Total combined 39 TOPS of AI performance Memory – 2x SODIMM DDR5-5600 with/without ECC up to 128GB RAM Storage – […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on SolidSense AIoT – An IP64-rated AI vision development platform with Renesas RZ/V2M or Hailo-15 System-on-module

SolidSense AIoT – An IP64-rated AI vision development platform with Renesas RZ/V2M or Hailo-15 System-on-module

SolidRun SolidSense AIOT vision AI development platform

SolidRun SolidSense AIoT is an AI vision development platform designed based on the company’s Renesas RZ/V2N or Hailo-15 system-on-module with 15 TOPS and 20 TOPS of AI performance, respectively. The solution comes with up to 8GB RAM, 256GB eMMC flash, WiFi 5, Bluetooth 5.0, and LTE Cat 1bis connectivity, an 8.4MP Sony IMX678 camera, four IR LEDs, and a few sensors all housed in an IP64-rated enclosure for outdoor operation. The SolidSense AIoT platform takes three 18650 rechargeable batteries with USB-C charging and an optional solar panel. There’s limited information about the Renesas model for now, so we’ll focus on the Hailo-15 variant in the rest of the article.   SolidSense AIoT Hailo-15H specifications: System-on-Module – SolidRun Hailo-15 SoM SoC – Hailo-15 CPU – 4 x Cortex A53 @ 1.3GHz; 12 kDMIPS Neural Network Core – 20 TOPS VPU – 4Kp30 H.265/4 video encoder ISP – 12MP System Memory  – […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on HoneyComb Ryzen V3000 – An AMD Ryzen V3C18I mini-ITX motherboard with dual 10Gbps SFP+, 2.5GbE, dual SATA III

HoneyComb Ryzen V3000 – An AMD Ryzen V3C18I mini-ITX motherboard with dual 10Gbps SFP+, 2.5GbE, dual SATA III

HoneyComb Ryzen V3000

SolidRun HoneyComb Ryzen V3000 is a mini-ITX motherboard powered by an AMD Ryzen Embedded V3C18I processor, supporting up to 64GB of DDR5 memory and M.2 PCIe NVMe SSD storage, and equipped with two 10 Gbps Ethernet SFP+ cages, a 2.5GbE RJ45 jack, and two SATA III ports for advanced networking and storage applications. The solution is comprised of a mini-ITX motherboard and a Ryzen V3000 CX7 COM Express module, which the company introduced in 2022. As an industrial motherboard, it’s designed to operate in the -40°C to +85°C temperature range. HoneyComb Ryzen V3000 specifications: Ryzen V3000 CX7 COM Express module SoC – AMD Ryzen Embedded V3C18I octa-core/16-thread processor clocked at 1.9 GHz / 3.8 GHz (Turbo) with 4 MB L2 cache and 16 MB L3 cache; TDP: 15W System Memory – Up to 64GB (2x 32GB), ECC/Non-ECC DDR5 memory up to 4800 MT/s via two SODIMM sockets. Dimensions – 125 […]

Posted on by Debashis Das - No Comments on SolidRun unveils HummingBoard i.MX8M IIOT SBC and the IIOT-200-8M Gateway for Edge AI and industrial IoT applications

SolidRun unveils HummingBoard i.MX8M IIOT SBC and the IIOT-200-8M Gateway for Edge AI and industrial IoT applications

HummingBoard i.MX8M IIOT

SolidRun has recently introduced HummingBoard i.MX8M IIOT SBC and IIOT-200-8M Gateway built around the NXP i.MX 8M Plus Edge AI processor. Designed for IIoT and HMI applications the SBC hosts the NXP i.MX 8M Plus SOM which gives access to various connectivity options, including dual Gigabit Ethernet, Wi-Fi/Bluetooth, CAN-FD, RS232/RS485, and audio. Additionally, it has support for industrial protocols such as Modbus and MQTT, making it suitable for factory automation and smart energy projects. Based on the HummingBoard i.MX8M IIOT SBC, the IIOT-200-8M Gateway features a DIN-rail mountable design, which sacrifices some I/O interfaces to meet the demands of harsh deployment environments. Both products support Industrial temperature ranges, fanless construction, and compact dimensions, making them reliable choices for demanding applications like industrial automation, predictive maintenance, and remote monitoring. HummingBoard i.MX8M IIOT SBC Specifications SoC – NXP i.MX 8M Plus AI SoC CPU Quad-core Arm Cortex-A53 processor @ up to 1.6 GHz […]

Posted on by Tomisin Olujinmi - 1 Comment on SolidRun Bedrock R8000 is the first Industrial PC to feature AMD Ryzen Embedded 8000 series

SolidRun Bedrock R8000 is the first Industrial PC to feature AMD Ryzen Embedded 8000 series

Bedrock 8000 AMD Ryzen Embedded 8000 industrial PC

Israeli embedded systems manufacturer, SolidRun, has recently introduced the Bedrock R8000, a new fanless, Industrial PC targeted at edge AI applications. The Bedrock R8000 integrates the newly-announced AMD Ryzen Embedded 8000 series processors with 8 Zen 4 cores and 16 threads clocked at up to 5.1 GHz. The Ryzen Embedded 8000 Series has a 16 TOPS NPU for AI workloads and offers up to 10 years of guaranteed availability. Also, up to 3 AI accelerators (either Hailo-10 or Hailo 8) can be combined with the onboard NPU to achieve over 100 TOPS for generative or inferencing AI workloads. Apart from the Ryzen Embedded 8000 series, the Bedrock R8000 series also supports other Accelerated Processing Units (APU) in the “Hawk Point” family. The CPU power limit can be adjusted in the BIOS within a range of 8W to 54W. Memory goes up to 96GB DDR5 ECC/non-ECC and three NVME PCIe Gen4 […]

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