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August 19, 2024August 19, 2024 by Debashis Das - No Comments

Toshiba TCKE9 reusable e-fuse features a fixed over-voltage clamp with adjustable overcurrent limit

Toshiba has recently introduced the Toshiba TCKE9 reusable e-fuse (electronic fuse) series, a new lineup of e-fuse ICs that can be used repeatedly, to protect power supply lines from various electrical faults like overcurrent, overvoltage, overtemperature, and short circuits. These new chips integrate various protection features into a single chip which simplifies circuit design and reduces component count compared to how a traditional protection circuit with multiple components is designed. This new line of products offers different ICs with different voltage ratings and adjustable current settings, alongside two reset modes auto-retry and latching. All these features make this e-fuse useful for applications like laptops, wearables, audio/video equipment, and industrial applications like automation systems, robotics, and many other applications. Toshiba TCKE9 reusable e-fuse Specification Input Voltage – 2.7V to 23V (Maximum – 25V) Output Current – 0 to 4.0A (Adjustable overcurrent limit – 0.5A to 4.0A via external resistor) ON Resistance […]

July 31, 2024July 30, 2024 by Debashis Das - 3 Comments

STMicro EVLDRIVE101-HPD 1.9-inch motor driver board can drive 750W BLDC motors

ST EVLDRIVE101 HPD 750W Brushless DC motors Driver

STMicroelectronics has recently revealed the reference design for “EVLDRIVE101-HPD” their homegrown BLDC motor driver board that can drive up to a 750W BLDC motor. This compact 50 mm (1.9-inch) circular PCB combines STDRIVE101 3-phase, triple half-bridge gate-driver IC with an STM32G0 microcontroller, which is responsible for driving three-phase brushless motors. The driver board supports various motor-control strategies, including trapezoidal and field-oriented control (FOC), with both sensor’ed and sensorless rotor-position detection. Additionally, it has a wide operating voltage range of 5.5V to 75V and includes STL220N6F7 60V STripFET F7 MOSFETs, which have very low Rds(on) for high efficiency. Other features of the board include ultra-low power consumption in sleep mode, a single-wire debug interface, direct firmware update capability, and protection mechanisms such as under-voltage lockout, overtemperature protection, and cross-conduction prevention. All these features make this board suitable for applications like hairdryers, handheld vacuums, power tools, fans, drones, robots, and industrial equipment […]

July 18, 2024July 18, 2024 by Debashis Das - No Comments

STMicro ST4SIM-300 eSIM complies with SGP.32 GSMA eSIM Standard for IoT

STMicroelectronics has recently released the ST4SIM-300 eSIM, the first embedded SIM (eSIM) IC that complies with the new GSMA eSIM IoT Technical Specification (SGP.32). The chip is fully compliant with remote SIM provisioning of the GSMA eSIM IoT standards, so it works with 2G, 3G, 4G (LTE), CDMA, NB-IoT, and Cat-M networks. It is designed for small IoT devices and allows system operators to remotely program device subscriber identities over the air (OTA), making it a plug-and-play solution for seamless integration and management. Previously, we have written about Hologram’s IoT eSIM Chip that provides global connectivity and comes with 2FF, 3FF, 4FF, and Mff2- M2M form factors. We have also written about the Conexio Stratus Pro battery-powered nRF9161 development kit that supports eSIM as an option. ST4SIM-300 eSIM specifications Microcontroller – ST33K1M5M 32-bit Arm Cortex-M35P MCU Designed based on eSIM + eSE (embedded Secure Element) I/O Asynchronous serial I/O port […]

May 24, 2024May 24, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

50W high-power wireless charging boards target industrial, medical, and smart home applications

STMicro has introduced a combo of 50W wireless charging transmitter and receiver boards, namely the STEVAL-WBC2TX50 transmitter board and the STEVAL-WLC98RX receiver board, for the development of high-power wireless charging solutions such as medical and industrial equipment, home appliances, and computer peripherals. The transmitter board, based on the STWBC2-HP transmitter system-in-package (SiP), supports up to 50W of output power using the STMicro’s proprietary Super Charge (STSC) protocol, as well as the Qi 1.3 5W Baseline Power Profile (BPP) and 15W Extended Power Profile (EPP). The receiver board, based on the STWLC98 wireless power receiver IC, can handle up to 50W charging power through STSC, supports Qi BPP and EPP charging, and implements features such as Adaptive Rectifier Configuration (ARC) to extend charging distance by up to 50% and accurate voltage and current measurement for Foreign Object Detection (FOD). STEVAL-WBC2TX50 transmitter board highlights: STWBC2-HP wireless power transmitter chip MCU – STM32G071 […]

April 24, 2024April 24, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

STMicro LSM6DSV32X Edge AI motion sensor aims to extend battery life in wearables, trackers, and activity monitors

STMicro LSM6DSV32X is a new low-power 6-axis inertial module with the company’s machine-learning core (MLC) with AI algorithms based on decision trees, a 3-axis accelerometer with a full-scale range of 32g, and a 4000 degrees-per-second gyroscope designed to measure intensive movements, impacts, and freefall height (estimation). The features of the sensors enable it to lower the power consumption for functions such as gym-activity recognition to under 6µA, while 3D orientation tracking consumes just 30µA when using STMicro’s Sensor Fusion Low-Power (SFLP) algorithm. It will be found in a range of battery-powered devices such as consumer wearables, asset trackers, and impact and fall alarms for workers or the elderly. STMicro LSM6DSV32X specifications: Triple-channel architecture for UI (user interface), EIS, and OIS data processing Data storage – Smart FIFO up to 4.5 KB Sensors Accelerometer – ±4/±8/±16/±32 g full scale Gyroscope – ±125/±250/±500/±1000/±2000/±4000 dps full scale Embedded temperature sensor Host interfaces SPI, […]

March 21, 2024 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

STMicro announces ultra-low-power STM32U0 MCU, unveils 18nm FD-SOI process for STM32 microcontrollers

STMicro has announced the ultra-low-power STM32U0 Arm Cortex-M0+ microcontroller family running up to 56 MHz that reduces energy consumption by up to 50% compared to previous product generations such as STM32C0 or STM32L0 while targetting SESIP Level 3, PSA-Certified Level 1, and NIST certifications. Separately, the company also introduced a new 18nm FD-SOI manufacturing process for STM32 microcontrollers that will replace the 40nm process currently used. STMicro STM32U0 Cortex-M0+ MCU STMicro STM32U0 key features and specifications: MCU Core – Cortex-M0+ up to 54 MHz with ART accelerator Memory / Storage STM32U031x – 12KB SRAM, 16 to 64KB flash STM32U073x – 40 KB SRAM, 16 to 256 KB flash STM32U083x – 40 KB SRAM, 256 KB flash Display – LCD controller for 8×48 or 4×52 segment displays (STM32U073, STM32U083) Peripherals 3x I2C, 2x SPI, 4x USART, 2x low-power UART. Up to 21x capacitive sensing channels USB – 1x USB 2.0 device […]

March 6, 2024March 6, 2024 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

STM32WBA microcontrollers with Bluetooth LE 5.4, Zigbee, Thread, and Matter to comply with US and EU Cybersecurity regulations

STMicro’s new STM32WBA series, starting with the STM32WBA52, STM32WBA54, and STM32WBA55 devices, is a family of Arm Cortex-M33 wireless microcontrollers with Bluetooth LE 5.4, Zigbee, Thread, and Matter connectivity that achieved the SESIP (Security Evaluation Standard for IoT Platforms) Level 3 security certification and should make them compliant with US Cyber Trust Mark and EU Radio Equipment Directive (RED) regulations due to become mandatory in 2025. The 100MHz STM32WBA54 and STM32WBA55 microcontrollers come with up to 1MB of flash memory, support Arm TrustZone architecture isolating secure processes and storage, and incorporate background autonomous mode, flexible power-saving states, and analog and digital peripherals found in STMicro STM32U5 ultra-low-power MCUs. STM32WBA54 and STM32WBA55 specifications: MCU core – Arm Cortex-M33 at 100MHz with FPU and DSP Memory – Up to 128KB SRAM Storage – Up to 1 MB flash Wireless Bluetooth Low Energy 5.4 Long Range (LR) capable Up to 2 Mbps Bluetooth […]

February 28, 2024February 28, 2024 by Tomisin Olujinmi - 5 Comments

STMicro VL53L9 is a high-resolution, direct Time-of-Flight 3D LiDAR sensor module

The STMicro VL53L9 sensor is the latest addition to the company’s FlightSense product family. The direct Time-of-Flight (ToF) 3D LIDAR (light detection and ranging) sensor offers a resolution of up to 2,300 zones. The module is described as all-in-one and easy to integrate. It comes in a small, reflowable package that contains all the necessary components for sensing objects and processing images. The sensor features an array of single photon avalanche diodes (SPADs) for photon detection, a post-processing SoC, and two vertical surface emitting lasers (VCSELs) powered by a dedicated bipolar-CMOS-DMOS (BCD) VCSEL. The VL53L9 is a multi-zone ToF sensor similar to the VL53L7CX and the VL53L8, meaning that it offers multi-zone distance measurements up to 54 x 42 zones with a wide 54° x 42° field-of-view. Unlike most IR sensors, the VL53L9 sensor uses backside illumination direct ToF technology to ensure absolute distance measurement, regardless of the target color […]