Mediatek Helio P60 Cortex A73/A53 Mobile Processor Includes NeuroPilot AI technology

Neural Network Accelerators (NNA) may have become a must-have block in high-end mobile processors. Huawei Kirin 970, Samsung Exynos 9810, and Qualcomm Snapdragon 845 (via its Hexagon DSP) processors all come with NNA or NPU (Neural Processing Unit) to speed up tasks and comsume less power for tasks related to artificial intelligence / machine learning. Mediatek has also jumped on the bandwagon with Helio P60 chipset featuring four Cortex A73 cores, four Cortex A53 cores, an Arm Mali-G72MP3 GPU and a multi-core mobile APU (AI Processing Unit) leveraging the company’s NeuroPilot AI technology. Mediatek P60 key specifications: CPU – big.LITTLE Octa-core with four Arm Cortex-A73 up 2.0 GHz and four Arm Cortex-A53 up to 2.0 GHz GPU – Arm Mali-G72 MP3 at 800MHz Multi-core AI processing unit (Mobile APU) – 280 GMAC/s; offers deep learning facial recognition, object and scene identification, user behavior-informed performance and other AI and AR application […]

HiKey 960 Android Development Board Gets a 4GB RAM Version for $250

Hikey 960 development board is one of the most powerful Arm boards on the market thanks to Huawei/Hisilicon Kirin 960 octa-core processor with four ARM Cortex A73 cores, four Cortex A53 cores, and a Mali-G71 MP8 GPU, fast storage with 32GB UFS 2.1 flash, and 3GB LPDDR3 memory. Like the earlier Hikey (620) board, the board is also an official reference board for AOSP, so you should be able to run the latest Android version, and also play with sensors using Neonkey SensorHub 96Boards mezzanine board. If you are somehow limited by the 3GB RAM on the board, you can rejoice as Seeed Studio has just launched a 4GB RAM version selling for $249, or about $10 extra. Note that shipping is only scheduled for February 2, 2018, so those are pre-orders. The rest of the specifications for Hikey 960 4GB RAM version are unchanged: SoC – Huawei Kirin 960 […]

UFS 3.0 Embedded Flash to Support Full-Duplex 2.4GB/s Transfer Speeds

All my devices still rely on eMMC flash for storage, but premium smartphones, for example, make use of UFS 2.0/UFS 2.1 flash storage with performance similar to SSD, with Samsung UFS 2.0 storage achieving up to 850MB/s read speed, 260 MB/s write speed, and 50K/30K R/W IOPS. UFS 3.0 promises to roughly double the performance of UFS 2.0/2.1 with transfer rates of up to 2.4 GB/s, and separately, the UFS Card v2.0 standard should deliver UFS 2.1 performance on removable storage. Several Chinese and Taiwanese websites, including CTimes and Benchlife, have reported that companies have started getting UFS 3.0 & UFS Card v2.0 licenses from JEDEC, and Phison is working on a controller to support both new standards, and scheduled to launch in 2018. Premium smartphone SoC are only expect to support UFS 3.0 in 2019 and beyond, and hopefully by that time eMMC will have been replaced by UFS 2.0/2.1 […]

Embedded Linux Conference & Open Source Summit Europe 2017 Schedule

The Embedded Linux Conference & IoT summit 2017 took place in the US earlier this year in February, but there will soon be a similar event with the Embedded Linux Conference *& Open Source Summit Europe 2017 to take up in Europe on October 23 – 25 in Prague, Czech Republic, and the Linux Foundation has just published the schedule. It’s always useful to find out what is being discussed during such events, even if you are not going to attend, so I went through the different sessions, and compose my own virtual schedule with some of the ones I find the most interesting. Monday, October 23 11:15 – 11:55 – An Introduction to SPI-NOR Subsystem – Vignesh Raghavendra, Texas Instruments India Modern day embedded systems have dedicated SPI controllers to support NOR flashes. They have many hardware level features to increase the ease and efficiency of accessing SPI NOR […]

Intrinsyc Open-Q 835 Development Kit Features Qualcomm Snapdragon 835 Processor, Support Android 7 and Windows 10

Intrinsyc has just launched one of the first development boards powered by Qualcomm Snapdragon 835 processor with their Open-Q 835 devkit equipped with 4GB LPDDR4x, 128GB UFS 2.1 flash, 802.11ad WiFi, dual camera support and more. Open-Q 835 development kit is comprised of a “processor board” and a baseboard with the following specifications: Processor Board SoC – Qualcomm Snapdragon 835 (APQ8098) octa-core processor with four high performance Kryo 280 cores @ 2.20 GHz/ 2.30 GHz (single core operation), four low power Kryo cores @ 1.9 GHz, Adreno 540 GPUwith  OpenGL ES 3.2, OpenCL 2.0 Full support, and Hexagon 682 DSP with Hexagon Vector eXtensions (dual-HVX512) System Memory – 4GB LPDDR4x RAM Storage – 128GB UFS2.1 Gear3 2 lane Flash Connectivity Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 Bluetooth 5.0 + BLE WiGig60 802.11ad with on-board antenna Dimensions – 70 x 60 mm Carrier Board Display – 1x HDMI 2.0 out up to 4K Ultra […]

96Boards Compliant HiKey 960 ARM Cortex A73 Development Board is Now Available for $239

The most powerful 96boards development board – HiKey 960 – has finally been launched, and can be purchased for $239 on Aliexpress, Amazon US, Switch Sense (Japan), Seeed Studio, or All Net (Germany). HiKey 960 specifications have not changed much since we found out about the board: SoC – Kirin 960 octa-core big.LITTLE processor with 4x ARM Cortex A73 cores @ up to 2.4 GHz, 4x Cortex A53 cores @ up to 1.8 GHz, and a Mali-G71 MP8 GPU System Memory – 3GB LPDDR4 SDRAM (PoP) Storage – 32GB UFS 2.1 flash storage + micro SD card slot Video Output / Display Interface – 1 x HDMI 1.2a up to 1080p, 1x 4-lane MIPI DSI connector Connectivity – Dual band 802.11 b/g/n/ac WiFi and Bluetooth 4.1 with on-board antennas USB – 2x USB 3.0 type A host ports, 1x USB 2.0 type C OTG port Camera – 1x 4-lane MIPI […]

Samsung Galaxy S8 & S8+ Smartphones Launched with Infinity Screen, Samsung DeX Desktop Mode, Bixby Assistant

Samsung has finally launched their latest Galaxy S8 and S8+ smartphones powered by Qualcomm Snapdragon 835 or Exynos 8895 processor, 5.8″ and 6.2″ screens , and some of the most interesting features include the “infinity screen” with ultra thin bezels, Samsung DeX allowing for a desktop experience on a large monitor when the phone is docked, as well as Bixby assistant. Samsung Galaxy S8/S8+ specifications: SoC (one or the other depending on markets) Qualcomm Snapdragon 835 octa-core processor with four Kryo 280 cores @ 2.3 GHz, four Kryo 280 cores @ 1.7 Ghz;; Adreno 540 GPU; 10nm process Samsung Exynos 8895 octa-core processor with four M2+ cores @ 2.35 GHz, four Cortex A53 cores @ 1.9 GHz, ARM Mali-G71 GPU; 10nm process System Memory – 4GB LPDDR4 Storage – 64GB UFS 2.0 flash; micro SD up to 256 GB Display Galaxy S8 – 5.8” quad HD+ (2960×1440), (570ppi) Galaxy S8+ […]

HiKey 960 Development Board Powered by Hisilicon Kirin 960 Cortex A73/A53 Processor To Sell for $239

LeMaker is about to launch a successor to Hikey board with a new 96Boards compliant development board with HiKey 960 featuring the powerful Hisilicon Kirin 960 processor found in Huawei Mate 9 smartphone, as well as 3GB LPDDR4 memory, 32GB UFS storage, HDMI, USB 3.0 ports and so on. Hikey 960 board specifications: SoC – Kirin 960 octa-core big.LITTLE processor with 4x ARM Cortex A73 cores @ up to 2.4 GHz, 4x Cortex A53 cores @ up to 1.8 GHz, and a Mali-G71 MP8 GPU System Memory – 3GB LPDDR4 SDRAM Storage – 32GB UFS flash storage + micro SD card slot Video Output / Display Interface – 1 x HDMI 1.4 up to 1080p, 1x 4-lane MIPI DSI connector Connectivity – Dual band 802.11 b/g/n/ac? WiFi and Bluetooth 4.1 with two antennas USB – 2 x USB 3.0 type A host ports, 1x USB 2.0 type C OTG port […]