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January 11, 2026 by Debashis Das - 1 Comment

AMD Embedded+ mini-ITX Board features Ryzen AI Embedded P132 CPU, Versal AI Edge Gen2 VE3558 SoC FPGA

SAPPHIRE EDGE+ VPR 7P132, a Mini ITX AMD Embedded+

At CES 2026, Sapphire Technology introduced the EDGE+VPR-7P132, an “AMD Embedded+” Mini-ITX motherboard built around AMD’s newly announced Ryzen AI Embedded P100 series of SoCs, namely the hexa-core Ryzen P132 (V4526iX) CPU, and an AMD Versal AI Edge Gen 2 VE3558 SoC FPGA, which features octa-core Arm Cortex-A78AE + ten Cortex-R52 real-time cores beyond FPGA fabric. It’s the first AMD Ryzen AI Embedded motherboard we’ve seen. It represents a massive update from last year’s Edge+ VPR-5050 motherboard, which relied on Zen 2-based Ryzen Embedded V2000 series and first-generation Versal silicon. The new VPR-7P132 skips multiple generations, jumping straight to Zen 5 CPU cores and RDNA 3.5 graphics, with an upgraded Versal Gen 2 adaptive Edge AI SoC for real-time inference, along with faster LPDDR5 (4266MHz) memory and 40 Gbps USB4 connectivity. SapphireTech EDGE+ VPR-7P132-MB specifications: AMD Embedded+ Architecture Adaptive SoC Subsystem Adaptive SoC – AMD Versal AI Edge Gen 2 […]

November 12, 2024 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

NXP i.MX 94 octa-core Cortex-A55/M33/M7 processor targets Edge AI industrial and automotive applications

NXP i.MX 94 is an octa-core Arm SoC with up to four Cortex-A55 application cores, two Arm Cortex-M33 real-time/functional safety cores, two Arm Cortex-M7 real-time/functional safety cores, and an NXP eIQ Neutron NPU designed for Edge AI industrial and automotive applications I initially thought it would be a cost-down version of the NXP i.MX 95, and while it shares many of the same features, it’s more an application-specific processor designed specifically for industrial and automotive applications, lacking a 3D GPU, camera input interfaces, a MIPI DSI display interface, and 10GbE networking, but increasing the number of real-time cores (at the cost of application cores) and adding several networking features such as an Ethernet time-sensitive networking (TSN) switch, 2.5GbE interface, an Ethercat controller, and support for industrial protocols like Profinet or OPC-UA FX. NXP i.MX 94 specifications: CPU Up to 4x Arm Cortex-A55 cores 2x Arm Corex-M7 cores, one for functional […]

July 10, 2024July 10, 2024 by Jean-Luc Aufranc (CNXSoft) - 11 Comments

Microchip PIC64GX is a quad-core 64-bit RISC-V microprocessor for real-time processing

Microchip has introduced its first 64-bit RISC-V microprocessor family with the PIC64GX pin-to-pin compatible with the company’s PolarFire SoC FPGA devices and designed for edge designs for the industrial, automotive, communications, IoT, aerospace, and defense segments. The PIC6GX MPU supports asymmetric multiprocessing (AMP) to run Linux, real-time operating systems, and bare metal in a single processor cluster with secure boot capabilities. The company further claims the PIC64GX MPU is “the first RISC-V multi-core solution that is AMP capable for mixed-criticality systems”. The first member of the PIC64GX RISC-V family is the PIC64GX1000 microprocessor. Microchip PIC64GX1000 specifications: CPU Quad-core SiFive U54 64-bit five-stage, single-issue, in-order pipeline RISC-V (RV64GC) processor at up to 625 MHz with AMP and deterministic latencies, PMP and MMU units Single-core SiFive E51 64-bit RISC-V (RV64IMAC) monitor processor core at up to 625 MHZ with PMP unit Cache L1 memory subsystem with Single-Error Correct, Double-Error Detect (SECDED) Flexible […]

May 15, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP i.MX 95 SMARC 2.1 system-on-modules – ADLINK LEC-IMX95 and iWave iW-RainboW-G61M

Several companies have unveiled SMARC 2.1 compliant system-on-modules powered by the NXP i.MX 95 AI SoC, and today we’ll look at the ADLINK LEC-IMX95 and iWave Systems iW-RainboW-G61M and related development/evaluation kits. The NXP i.MX 95 SoC was first unveiled at CES 2023 with up to six Cortex-A55 application cores, a Cortex-M33 real-time core, and a low-power Cortex-M7 core, as well as an eIQ Neutron NPU for machine learning applications. Since then a few companies have unveiled evaluation kits and system-on-modules such as the Toradex Titan evaluation kit or the Variscite DART-MX95 SoM, but none of those were compliant with a SoM standard, but at least two SMARC 2.1 system-on-modules equipped with the NXP i.MX 95 processor have been introduced. ADLINK LEC-IMX95 Specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 2.0 GHz with 32K I-cache and D-cache, 64KB L2 cache, and 512KB […]

April 12, 2024November 13, 2024 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

ADLINK unveils Intel Atom x7000RE & x7000C Amston Lake COM Express and SMARC 2.1 modules

ADLINK has released two Intel Atom X7000RE & x7000C Amston Lake-powered modules with the cExpress-ASL COM Express Type 6 Compact module and the LEC-ASL SMARC 2.1 system-on-module both offered with up to 16GB LPDDR5 soldered-down memory and 2.5GbE networking. The modules are designed for high-performance, low-power, and ruggedized edge solutions running 24/7, and with support for Intel TCC and Time Sensitive Networking (TSN), the modules are also suitable for hard-real-time computing workloads required by use cases such as industrial automation, AI robots, smart retail, transportation, network communication, and more. Intel Atom x7000RE and x7000C Amston Lake processors The announcement came as a surprise because I had never heard about Intel Amston Lake processors so far. It might be because they were just announced and all seven SKUs are embedded parts with two to eight cores, and as a result, they may not quite get as much coverage as consumer processors. […]

December 15, 2023December 20, 2023 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

COM Express Type 6 Compact module features 14th gen Intel Core Ultra “Meteor Lake” processor

ADLINK cExpress-MTL is a COM Express Type 6 Compact module based on the just-announced 14th gen Intel Core Ultra “Meteor Lake” processor family with up to fourteen CPU cores in 6P+8E configuration, eight Xe-cores (128 EUs), and an NPU (11pTOPS/8.2eTOPS) in a 15 or 28W TDP thermal configuration delivering up to 1.9x the GPU performance of the previous generation (Raptor Lake). The power consumption will also be lower thanks to Intel Core Ultra’s new Low-Power E-cores that are 30 to 50% more efficient than the E-cores in 13th gen Intel Core processors, and the faster GPU and built-in NPU will enable hardware-accelerated AV1 encoding/decoding and various devices leveraging AI such as portable medical ultrasound devices, industrial automation, autonomous driving, AI robots, and more. cExpress-MTL specifications: Meteor Lake-H/U SoC (one of the other) Intel Core Ultra 7 MS3 165H 16-core (6P+8E+2LPE) processor @ 1.4 / 5.0 GHz with 24MB cache, Intel […]

March 28, 2023 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

conga-STDA4 SMARC 2.1 module features TI TDA4VM/DRA829J Jacinto 7 processor

conga-STDA4 SMARC Module TI Jacinto 7 TDA4VM DRA829J

congatec conga-STDA4 is a SMARC Computer-on-Module (CoM) based on Texas Instruments TDA4VM or DRA829J Jacinto 7 processor with two Cortex-A72 cores, six real-time Cortex-R5 cores for functional safety, accelerated vision and AI processing capabilities, and plenty of interfaces. The first Texas Instruments-powered CoM from the company is designed for industrial mobile machinery requiring near-field analytics, such as automated guided vehicles and autonomous mobile robots, construction and agricultural machinery, as well as any industrial or medical solutions requiring energy-efficient computer vision at the edge. conga-STDA4 specifications: SoC – Texas Instruments Jacinto 7 TDA4VM/DRA829J with Dual-core Arm Cortex-A72 up to 2.0 GHz 6x Arm Cortex-R5F cores @ 1.0 GHz up to 8 MB of on-chip L3 RAM 1x C7x DSP up to 80 GFLOPs 2x C66 DSPs up to 40 GFLOPs Up to 8 TOPS MMA AI accelerator PowerVR Rogue 8XE GE8430 3D GPU with support for OpenGL ES 3.1, OpenVX, OpenCL […]

March 23, 2023 by Jean-Luc Aufranc (CNXSoft) - No Comments

Half-size mini PCIe card adds up to 4 CAN FD interfaces to embedded systems

esd electronics CAN-PCIeMiniHS/402 is a half-size mini PCIe card with four CAN FD Interfaces designed for embedded systems with one model adding extended temperature range support from -40C to 85°C. The company also introduced the CAN-Mini/402-4-DSUB9-150mm adapter to more easily connect the four CAN network interfaces via DSUB9 connectors. It comes with four individual small adapter boards, each equipped with a DSUB9 plug and a jumper for selectable onboard CAN termination, as well as 150 mm long wires. CAN-PCIeMiniHS/402 highlights: 4x CAN FD interfaces according to ISO 11898-2, no galvanic isolation, bit rates from 10 Kbit/s up to 8 Mbit/s Bus mastering and local data management by FPGA (Intel Cyclone IV EP4CGX) PCIe Mini interface according to Mini Card Electromechanical Spec. R1.2 Supports MSI (Message Signaled Interrupts) HW-Timestamp capable Dimensions – 30 mm x 27 mm (Half-size mini PCIe form factor) Temperature Range Standard – 0°C … +75°C Extended range: […]