COM Express & COM-HPC modules features Intel 13th gen Raptor Lake embedded processors

ADLINK has just announced the Express-RLP COM Express Type 6 and COM-HPC-cRLS COM-HPC size C modules based on the new Intel 13th generation Raptor Lake hybrid processors with Embedded and Industrial SKUs.

The Express-RLP comes with an up to 14 cores, 20 threads Raptor Lake-P processor, 64GB DDR5 SO-DIMM, and PCIe Gen4, while the COM-HPC-cRLS offers up to a 24-core Rasptor Lake-S embedded processor, 128GB DDR5 SO-DIMM, PCIe Gen5, and 2x 2.5GbE LAN. Both modules support Intel TCC, and Time Sensitive Networking (TSN), and are suitable for hard real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation.

Express-RLP Raptor Lake-P COM Express module

Express-RLP Raptor Lake-P COM Express

Specifications:

  • Raptor Lake-P SoC (one of the other)
    • Intel Core i7-13800HRE 6P+8E cores/20 threads processor @ up to 2.5 GHz with 24MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W)
    • Intel Core i7-1370PRE 6P+8E cores/20 threads processor @ up to 1.9 GHz with 24MB cache, Intel Iris Xe graphics; TDP: 28W
    • Intel Core i5-13600HRE 4P+8E cores/16 threads processor @ up to 2.7 GHz with 18MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W)
    • Intel Core i5-1350PRE 4P+8E cores/16 threads processor @ up to 1.8 GHz with 18MB cache, Intel Iris Xe graphics; TDP: 28W
    • Intel Core i3-13300HRE 4P+4E cores/12 threads processor @ up to 2.1 GHz with 12MB cache, Intel UHD graphics; TDP: 45W (cTDP: 35W)
    • Intel Core i3-1320PRE 4P+4E cores/12 threads processor @ up to 1.7 GHz with 12MB cache, Intel UHD graphics; TDP: 28W
    • Intel Core i7-1365URE 10-core processor @ up to 1.7 GHz with 12MB cache, Intel UHD graphics; TDP: 15W
    • Intel Core i5-1345URE 10-core processor @ up to 1.5 GHz with 12MB cache, Intel UHD graphics; TDP: 15W
    • Intel Core i3-1315URE 6-core processor @ up to 1.2 GHz with 10MB cache, Intel UHD graphics; TDP: 15W
  • System Memory – Up to 64GB (2x 32GB) DDR5, IBECC (select SKUs), SO-DIMM memory, max. 4800MT/s
  • Storage – 2x SATA 6Gb/s ports; optional NVMe SSD storage (BGA) in place of PCIe lanes 28-31 (See expansion busses section)
  • Display Interfaces
    • 3x DDI supporting DisplayPort 1.4a, HDMI 2.1, and DVI
    • 1x LVDS (optional eDP, VGA)
    • Up to 2x USB4/TBT4 in place of DDI 1/2
    • Up to 4x independent displays
  • Audio – ALC888 audio codec on carrier board
  • Ethernet
    • Intel i226 series controllers (I226-IT supports TSN by build option)
    • 2.5GbE and Gigabit Ethernet
  • USB – 4x USB 3.2, 4x USB 2.0, up to 2x USB4 interfaces (Thunderbolt 4 capable)
  • Expansion Busses
    • PCIe x8 Gen4, lanes 16-23, available for 45W(35W cTDP SKUs)
    • PCIe x4 Gen4, lanes 24-27
    • PCIe x4 Gen4, lanes 28-31
    • 8 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and 4 PCIe x1 Gen3: Lanes 4/5/6/7
    • LPC bus (via ESPI-to-LPC bridge IC), SMBus (system), I2C (user), GP_SPI
    • 2x UART ports with console redirection
    • 8x GPIO (GPI with interrupt)
  • SEMA Board Controller – Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, general purpose I2C, UART, GPIO, watchdog timer, fan control
  • Debugging – 30-pin multipurpose flat cable connector for use with DB30-x86 debug module
  • Security – Infineon TPM 2.0
  • Power Supply – 8.5V to 20V wide voltage input; AT/ATX
  • Dimensions – 125 x 95 mm (PICMG COM.0: Rev 3.1 Type 6 basic size)
  • Temperature Range
    • Standard – Operating: 0°C to 60°C; storage: -20°C to 80°C
    • Extreme Rugged – Operating:  -40°C to 85°C; storage: -40°C to 85°C (TBD, depends on SKU)
  • Humidity
    • Operating – 5-90% RH operating, non-condensing
    • Storage – 5-95% RH storage (and operating with conformal coating)
  • Shock and Vibration
    • IEC 60068-2-64 and IEC-60068-2-27
    • MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC)
  • HALT  – Thermal Stress, Vibration Stress, Thermal Shock, and Combined Test
Raptor Lake-P COM Express Block Diagram
Express-RLP Block Diagram

Raptor Lake-P processors support the following features: Intel VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel HT Technology, Intel SSE4.2, Intel 64 Architecture, Intel Turbo Boost Technology 2.0, Intel AVX512-VNNI, Intel DL Boost, Intel TXT, Execute Disable Bit, Intel Data Protection Technology with Intel Secure Key, and Intel AES-NI.

The Raptor Lake-P module will support Windows 10 IoT Enterprise LTSC and Ubuntu 64-bit, and Yocto project-based Linux 64-bit and VxWorks may also be supported, but this will have to be confirmed.

COM Express Base board

ADLINK can also provide the Express-BASE6 R3.1 ATX carrier board for the Express-RLP module for evaluation and early software development.

COM-HPC-cRLS Raptor Lake-S module

COM-HPC-cRLS Raptor Lake-P COM-HPC modulePreliminary specifications:

  • Raptor Lake-S SoC (one or the other)
    • Intel Core i9-13900E 24 cores; TDP: 65W
    • Intel Core i7-13700E 16 cores; TDP: 65W
    • Intel Core i5-13500E 14 cores; TDP: 65W
    • Intel Core i5-13400E 10 cores; TDP: 65W
    • Intel Core i3-13300E 4 cores; TDP: 65W
    • 35W SKUs supported upon request
  • System Memory – 4x DIMM DDR5 sockets for up to 128GB RAM, up to 3200MT/s
  • Storage – 2x SATA 6Gb/s ports
  • Ethernet
    • Intel i226 series controllers (I226-IT supports TSN by build option)
    • 2x 2.5GbE and Gigabit Ethernet
  • USB – 4x USB 3.2, 8x USB 2.0
  • Expansion Busses
    • 16x PCIe Gen5 lanes – lanes 16-31 (J2): configurable to x16, x8, x4, x2
    • 8x PCIe Gen4 lanes
      • 4x PCIe lanes 32-35 (J2): configurable to x4, x2
      • 4x PCIe lanes 36-39 (J1): configurable to x4, x2
    • 6x PCIe Gen3 lanes – lanes 0-5 (J1): configurable to x4, x2
    • Note: PCIe lanes 0-5, USB 3.0, SATA, NBASE-T and PCIe_BMC source from HSIO.
    • The available total raw bandwidth is equivalent to PCIe x16 Gen3
    • SMBus (system), 2x I2C (user)
    • 2x UART ports with console redirection
    • 12x GPIO (GPI with interrupt)
  • SEMA Board Controller – Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, general purpose I2C, UART, GPIO, watchdog timer, fan control
  • Module Management Controller – IPMB (in conjunction with carrier BMC for remote management applications) by build option
  • Debugging – 40-pin multipurpose flat cable connector for use with DB40-x86 debug module
  • Security – Infineon TPM 2.0
  • Power Supply – AT: 12V; ATX: 12V / 5V; ACPI 5.0 compliant
  • Dimensions – 160 x 120 mm (PICMG COM-HPC: Rev 1.1 Client Type)
  • Temperature Range
    • Standard – Operating: 0°C to 60°C; storage: -20°C to 80°C
    • Extreme Rugged – Operating:  -40°C to 85°C; storage: -40°C to 85°C (TBD, depends on SKU)
  • Humidity
    • Operating – 5-90% RH operating, non-condensing
    • Storage – 5-95% RH storage (and operating with conformal coating)
  • Shock and Vibration
    • IEC 60068-2-64 and IEC-60068-2-27
    • MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC)
  • HALT  – Thermal Stress, Vibration Stress, Thermal Shock, and Combined Test

Raptor Lake-S processors support Intel VT (including VT-x / VT-d), Intel Turbo Boost Technology 2.0, Intel VNNI, Intel TCC and Time-Sensitive Networking (TSN), Intel Hardware Shield, Intel TXT, Intel System Security Report, Intel APIC-v, Intel PTT, Intel TDT, Intel CET, Intel AMT, Intel UPID, Intel PMT, and Intel Thermal Velocity Boost (TVB). Note that some of the features may only be supported on specific SKUs.

ADLINK COM-HPC-cRLS module will support Windows 10 IoT Enterprise LTSC, and Ubuntu 64-bit and VxWorks may also be, but they are shown as TBC in the datasheet. We are not shown any carrier board, but the company says it is working on COM-HPC and COM Express development kits based on Express-RLP and COM-HPC-cRLS modules, with carriers supporting USB4 and PCIe Gen5.

Both modules are preliminary, and we don’t have availability information. The specifications for the Express-RLP module are more complete, and we even get a block diagram, so it’s quite possible the COM Express Raptor Lake-P modules are closer to launch than the COM-HPC Raptor Lake-S models. More details can be found on the Express-RLP and COM-HPC-cRLS product pages.

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