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March 10, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP i.MX 93W wireless MPU SiP pairs dual-core Arm Cortex-A55 processor with NXP iW610 WiFi 6, Bluetooth LE, and 805.15.4 radio

NXP i.MX 93W is the company’s first integrated wireless MPU System-in-Package (SiP) and combines a dual-core Cortex-A55 processor (NXP i.MX 93) with an iW610 WiFi 6, Bluetooth LE, and 802.15.4 tri-radio into a single chip. The 14.2 x 12 mm package also includes all the external radio components needed for wireless connectivity, replacing up to 60 discrete components on the PCB. NXP says it reduces the PCB area, simplifies PCB design and regulatory approval, and speeds up time-to-market. NXP i.MX 93W specifications: CPU Dual-Core Arm Cortex-A55 at up to 1.7 GHz Arm Cortex-M33 core at 250 MHz for real-time control GPU – 2D graphics accelerator AI accelerator – Arm Ethos-U65 microNPU Memory I/F – Up to 3.7GT/s 16-bit LPDDR4/LPDDR4X with inline ECC Storage I/F – 2x SD 3.0/SDIO 3.0/eMMC 5.1 Display Interfaces MIPI DSI up to 1080p60 LVDS up to 720p60 24-bit parallel RGB Camera Interface – 2-lane MIPI CSI up […]

March 9, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Nordic Semi unveils nRF54LS05A and nRF54LS05B entry-level, ultra-low-power Bluetooth LE SoCs

Nordic Semiconductor’s nRF54LS05A and nRF54LS05B are entry-level, ultra-low-power Bluetooth Low Energy (LE) Arm Cortex-M33 microcontrollers designed to be used as the main wireless SoC in simple applications such as sensors, tags, beacons, remotes, and PC peripherals, or operate as a Bluetooth LE companion device in more advanced products. Both SoCs are clocked at 128 MHz, feature Nordic’s 4th-generation Bluetooth LE radio, analog/digital interfaces, and advanced security. They also come with 0.5 MB of Non-Volatile Memory (NVM), and the only difference is that the nRF54LS05A is equipped with 64 KB of RAM, while the nRF54LS05B offers 96 KB. Nordic Semi nRF54LS05A/B specifications: CPU Arm Cortex-M33 core @ 128 MHz Performance – 250 CoreMark/mA @ 3V, 500 CoreMark Memory nRF54LS05A – 64 KB RAM nRF54LS05B – 96 KB RAM Storage – 508 KB NVM Wireless Bluetooth LE – 1 Mbps, 2 Mbps 2.4 GHz proprietary – GFSK: 4 Mbps, 2 Mbps, 1 […]

March 6, 2026 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

WiFi and Bluetooth LE can now be used simultaneously on Arduino boards with NINA-W102 (ESP32) module

Arduino Nano RP2040 Connect WiFi and Bluetooth

Today I learned that WiFi and Bluetooth LE could NOT be used simultaneously on Arduino boards featuring the ESP32-based u-blox NINA-W102 wireless module, impacting the Arduino Nano RP2040 Connect, Arduino MKR WiFi 1010, and Arduino Nano 33 IoT boards. It’s a long-running problem since the first Arduino board with NINA-W10 was introduced in 2018, and meant you could use WiFi or Bluetooth LE, but not both simultaneously. The good news is that the issue has finally been fixed, thanks to a new firmware for the module and new WiFi and BLE libraries. More specifically, you’ll need the following libraries and firmware: WiFiNINA library version 2.0.0 or later ArduinoBLE library version 2.0.0 or later NINA-W102 firmware version 3.0.1 or later The libraries can easily be updated in the Library Manager in the Arduino IDE, and the firmware needs to be updated with the Firmware Updater Tool in Tools > WiFi101 / […]

March 4, 2026 by Debashis Das - No Comments

Upgraded FGH200M Wi-Fi HaLow module features Morse Micro MM8108 SoC, handles up to 8,191 IoT devices

Introduced at MWC 2026, Quectel FGH200M Wi-Fi HaLow module, based on Morse Micro MM8108 SoC, is an upgraded version of the previous MM6108-based FGH100M module designed for long-range, low-power IoT connectivity. It operates in the sub-1-GHz band (850–950 MHz), with a range of up to 1 km, and is designed for applications such as smart homes, industrial automation, smart agriculture, smart cities, building automation, warehouses, campuses, and large-area IoT networks. The module operates on 1/2/4/8 MHz channels, with a maximum physical data rate of 43.3 Mbps and a transmit power of 26 dBm, allowing a single access point to theoretically connect up to 8,191 IoT devices. It connects to the host through USB 2.0, SDIO 2.0, or SPI interfaces. The ultra-compact (11.0 × 10.0 × 2.0 mm) LGA package operates in industrial environments with a temperature range of –40°C to +85°C. Quectel FGH200M Specifications: SoC – Morse Micro MM8108 32-bit […]

March 3, 2026March 3, 2026 by Jean-Luc Aufranc (CNXSoft) - 15 Comments

pureLiFi Bridge XC Flex delivers gigabit broadband internet through windows (made of glass)

pureLiFi Bridge XC Flex is a consumer-installable solution designed to be installed on windows (the ones made of glass, not Windows operating system!) in order to provide up to 1 Gbps broadband internet to the home. The solution leverages LiFi data transmission using invisible infrared light combined with up to 25W wireless power transfer for fast, cost-effective broadband deployment that does not require any cabling. It is comprised of indoor and outdoor units compatible with a wide range of window types, including single, double, and triple-glazed panes, as well as energy-efficient Low-E coatings. pureLiFi Bridge XC Flex highlights: Data Rates – Up to 1 Gbps, full-duplex, symmetrical Power – Up to 25W delivered from indoors to outdoors Installation – Self-install in minutes using weather-proof Gecko tape; high tolerance to misalignment CPE Compatibility – Accepts any Ethernet input from CPE: 4G/5G/mmWave FWA, fibre ONTs, private 5G, satellite, and more Security – […]

March 3, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Nordic Semi nRF93M1 IoT modules offer LTE Cat 1bis cellular connectivity, Wi-Fi location capabilities

Nordic Semiconductors introduced the nRF93M1 LTE Cat 1bis IoT modules at Mobile World Congress 2026 with up to 10 Mbps downlink and 5 Mbps uplink, as well as built-in Wi-Fi location capabilities. Two variants will be offered: the nRF93M1-LABA supporting LTE bands for Europe, Asia, the Middle East, and Africa, and the nRF93M1-LACA supporting a wider range of LTE bands and certifications for worldwide deployments. Nordic Semi nRF93M1 specifications : LTE Cat-1bis modem with 3GPP Rel. 14 support 617-2690 MHz LTE FDD and TDD band support Power Class 3 (23 dBm) Support for (e)UICC/eSIM (SGP.32 IoT) and Software SIM (SoftSIM) framework Data rates – Up to 10 Mbps downlink and 5 Mbps uplink Peripherals – High-speed USB, UART, IOs, coexistence interface, etc… Secure firmware updates via nRF Cloud Location services using Wi-Fi scanning and cellular eCID location Power-saving features – eDRX, PSM, and Nordic proprietary optimizations Certified for global and regional operation (GCF, […]

February 25, 2026February 25, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Telink ML9118A – A 32-bit RISC-V IoT module with Wi-Fi 6, Bluetooth 5.4, and 802.15.4 connectivity

Telink ML9118A is a wireless IoT module with Wi-Fi 6, Bluetooth 5.4, and 802.15.4 (Zigbee/Thread/Matter) connectivity designed for smart home, smart lighting, and smart remote control applications. The module also features a 32-bit RISC-V microcontroller clocked at 160 MHz with 576KB SRAM, 4MB flash, and various peripheral interfaces such as SDIO 3.0, 19x GPIOs, I2C, SPI, UART, as well as I2S for audio. Telink ML9118A module (ML9118A-GAIA-M0-PG12) specifications: MCU – 32-bit dual-core RISC-V MCU @ 160MHz Memory – 576KB SRAM Storage – 4MB embedded ﬂash Wireless 2.4 GHz Wi-Fi 6 IEEE 802.11 b/g/n/ax with support for DL/UL OFDMA, RX STBC, TWT, etc… Bluetooth 5.4 LE up to 2 Mbps bit rate 802.15.4 radio for Matter 1.3, Zigbee 3.0 compatible with ZHA and ZLL, Thread 2.4GHz proprietary – Supports Matter over Wi-Fi and Thread Tx Power – 15dBm @ Bluetooth LE mode Rx Sensitivity -88dBm @ 11B CCK 11Mbps -76dBm @ […]

February 23, 2026February 23, 2026 by Debashis Das - 1 Comment

Silex SX-SDMAX6E tri-band Wi-Fi 6E + Bluetooth LE module features NXP IW623 SoC, comes in M.2 or LGA package

Silex SX SDMAX6E tri band Wi Fi 6E + Bluetooth LE module LGA(Right) M.2(Left)

Back in August last year, we wrote about NXP’s IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. Now, NXP has partnered with Silex Technology to launch the SX-SDMAX6E module, available in a surface-mount LGA package or an M.2 2230 Key-E card. The module supports Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO. It operates from a 3.3V supply with 1.8V support on the LGA version. It has an industrial operating temperature range of -40°C to +85°C and is designed for both high-throughput applications, such as video streaming, and low-power, battery-operated devices in harsh environments. It also supports various antenna options, fast roaming, and long-term lifecycle backing through Silex and NXP. Silex SX-SDMAX6E specifications: Wireless chipset – NXP IW623 tri-band SoC Connectivity Wi-Fi Tri-band Wi-Fi 6E (2.4 GHz, 5 GHz, 6 GHz) IEEE 802.11a/b/g/n/ac/ax […]