yocto

Posted on by Jean-Luc Aufranc (CNXSoft) - 13 Comments on HaneSOM is a 4 cm2 Arm Linux module powered by Microchip SAMA5D2 SiP

HaneSOM is a 4 cm2 Arm Linux module powered by Microchip SAMA5D2 SiP

HaneSOM

DAB Embedded HaneSOM is a tiny (4 cm2) system-on-module based on Microchip SAMA5D2 Arm Cortex-A5 processor running Linux, which could make it the world’s smallest Linux module. The small size is made possible by the use of a SAMA5D2 system-in-package that also integrates 128MB DDR2, and the only two other chips on the modules are a 4MB flash (GD25Q32) and the PMIC (MIC2800). HaneSOM specifications: SiP – Microchip ATSAMA5D27C-D1G system-in-package with SAMA5D27 Arm Cortex-A5 processor @ 500 MHz with NEON, 128MBytes DDR2 System Memory – 128MBytes DDR2 memory Storage – 4 MBytes of QSPI Flash Castellated holes giving access to signal for: Storage – SD card interface Display – 24-bit RGB LCD TFT interface; capacitive touch controller Camera – Up to 5MP CMOS camera sensor support Audio – SSC, I2S Networking – 10/100M Ethernet USB – USB 2.0 (OTG and host) SPI, I2C, UART, CAN-FD, 12-bit ADC, PWM Misc – […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on TQ unveils i.MX 8M Plus LGA module and evaluation single board computer

TQ unveils i.MX 8M Plus LGA module and evaluation single board computer

i.mx 8m plus LGA module eval kit / sbc

We’ve seen plenty of systems-on-module based on NXP i.MX 8M Plus AI processor announced at Embedded World 2021 either with edge or board-to-board connectors. TQ TQMa8MPxL is a bit different as an i.MX 8M Plus LGA (Land Grid Array) system-on-module meant to be soldered on a carrier board. The company also took the occasion to unveil STKa8MPxL evaluation kit based on TQMa8MxML in single board computer format to demonstrate its new LGA module. TQMa8MPxL i.MX 8M Plus LGA module Specifications: SoC – NXP i.MX 8M Plus “Quad 8 ML/AI”, “Quad 6 Video”, or “Quad 4 Lite” processor with four Cortex-A53 cores, one Cortex-M7 core,  Vivante GPU, video encoder/decoder, HiFi4 audio DSP, and 2.3 TOPS AI accelertor System Memory – Up to 4 GB LPDDR4 Storage – Up to 256 MB (MBytes)Quad SPI NOR flash, up to 256 GB eMMC flash, optional EEPROM up to 64 Kbit 362-pin LGA with Storage […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on SGET OSM (Open Standard Module) compliant SoM features NXP i.MX 8M Mini SoC

SGET OSM (Open Standard Module) compliant SoM features NXP i.MX 8M Mini SoC

Open Standard Module (OSM) i.MX 8M Mini

The SGET (Standardization Group for Embedded Technologies) non-profit organization ratified another system-on-module standard last November, with the “Open Standard Module” (OSM) standard that instead of relying on edge or board-to-board connectors is meant to be soldered on the carrier board as a solder-on module LGA package. F&S Elektronik has unveiled one of the first SGET OSM compliant SoM with “FS 8MM OSM-SF” equipped with an NXP i.MX 8M Mini processor, up to 8GB DDR4, 32GB eMMC flash or 512MB NAND flash on a 30x30mm “Size-S OSM” form factor. FS 8MM OSM-SF system-on-module FS 8MM OSM-SF module specifications: SoC – NXP i.MX 8M Mini single, dual, or quad-core Arm Cortex-53 processor @ 1.8 GHz with real-time Cortex-M4 core @ 400 MHz,  Vivante 2D & 3D GPU, 1080p60 H.265, VP9, H.264, VP8 video decoder System Memory –  Up to 8GB LPDDR4 Storage – Up to max. 512MB SLC NAND flash or up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 3 Comments on MYS-8MMX i.MX 8M Mini SBC runs Yocto 3.0 Linux or Ubuntu 18.04

MYS-8MMX i.MX 8M Mini SBC runs Yocto 3.0 Linux or Ubuntu 18.04

i.MX 8M Mini SBC

MYiR Tech has just launched MYS-8MMX single board computer powered by NXP i.MX 8M Mini Cortex-A53/Cortex-A4 processor with 2GB RAM, 8GB eMMC flash, and designed for embedded applications in areas of consumer electronics, industrial automation, smart healthcare, security monitoring, etc… thanks to its video and graphics capabilities. MYS-8MMX SBC specifications: SoC  – NXP i.MX 8M Mini Quad quad-core Cortex-A53 processor @ 1.6 GHz (industrial temp.) or 1.8 GHz (commercial temp.), Arm Cortex-M4F realt-time core @ 400 MHz, Vivante 2D and 3D GPU’s, and 1080p VPU System Memory – 2GB DDR4 (supports up to 4GB) Storage – 8GB eMMC flash (supports up to 128GB), 32MB QSPI flash, MicroSD card slot, M.2 NVMe SSD support Video Output 40-pin FPC connector for LVDS & capacitive touchscreen interface 1x HDMI output up to 1080p60 Camera I/F – 24-pin FPC connector with MIPI-CSI Connectivity Gigabit Ethernet RJ45 port 2.4GHz/5GHz dual-band WiFi 5 and Bluetooth 5.0 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 9 Comments on reTerminal – A Raspberry Pi CM4 based 5-inch HMI Terminal

reTerminal – A Raspberry Pi CM4 based 5-inch HMI Terminal

reTerminal Raspberry Pi CM4 console

Seeed Studio has just unveiled reTerminal HMI terminal that reminds me of the company’s Wio Terminal based on Microchip SAMD51 Arm Cortex-M4F microcontroller with a 2.4-inch display. But as we’ll look into the details, reTerminal is quite a different beast as a Linux-capable device powered by a Raspberry Pi CM4 module with up to 8GB RAM, equipped with a 5-inch capacitive touchscreen display, and supporting plenty of connectivity options from GIgabit Ethernet to WiFi to LoRaWAN. reTerminal specifications: SoM – Raspberry Pi Computer Module 4 with Broadcom BCM2711 quad-core Cortex-A72 processor @ 1.5 GHz, up to 8GB RAM, up to 32GB flash Display – 5-inch capacitive touchscreen display with 1280×720 resolution Video Output – Micro HDMI port up to 4Kp60 Camera I/F – 2-lane MIPI CSI inteface Connectivity Gigabit Ethernet with optional PoE support 802.11 b/g/n/ac WiFi and Bluetooth 5.0 BLE (on Raspberry Pi CM4 module) Optional 5G, 4G LTE, […]

Posted on by Sponsored Post - Comments Off on AMD Ryzen Embedded V2000 series on COM Express Compact (Sponsored)

AMD Ryzen Embedded V2000 series on COM Express Compact (Sponsored)

conga-TCV2 AMD Ryzen Embedded V2000 COM Express

8 cores for heterogeneous edge computing Tasks at the embedded edge are getting more and more complex. Supporting up to 8 cores and 16 threads, the recently-launched AMD Ryzen Embedded V2000 processors are paving the way for x86-based embedded designs with unprecedented compute density and performance per watt. congatec is offering the new Zen 2 based processor generation, which complements V1000 processor technology with 6- and 8-core versions, on COM Express Compact modules. As the trend towards more IIoT connectivity and digitization continues, embedded systems must handle a growing number of tasks. Additional tasks include the collection of application data that needs to be transcoded, and sometimes analyzed locally using artificial intelligence (AI). In parallel, data must be exchanged with customers’ enterprise clouds and other OEM apps, and this communication must be highly secure, because new pay-per-use models turn the devices, machines, and systems into an OEM revenue source that […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Ryzen Embedded V2000 COM Express Module supports up to 1TB NVMe SSD, 64GB DDR4

Ryzen Embedded V2000 COM Express Module supports up to 1TB NVMe SSD, 64GB DDR4

Kontron COMe-BV26

We’ve already covered some COM Express modules based on AMD Ryzen Embedded V2000 processors with products like ADLINK cExpress-AR COM Express Type 6 Compact computer-on-module, but Kontron COMe-bV26 is the first we’ve seen that follow COM Express Basic Type 6 standard. The module supports up to 64GB DDR4 via two SO-DIMM connectors, up to 1TB NVMe onboard SSD, exposes 8x PCIe lanes, and with an 8-core/16-thread Ryzen Embedded V2000 processor is well-suited to IoT edge devices that must perform parallel processing tasks. Kontron COMe-bV26 specifications: AMD Embedded V2000 SoC AMD V2748 octa-core/16-thread processor @ 2.9 GHz / 4.15 GHz (Turbo) with 4MB L2 cache, 7CUs Radeon RX Vega 7 GPU @ 1.6 GHz; TDP: 35-54W AMD V2718 octa-core/16-thread processor @ 1.7 GHz / 4.15 GHz (Turbo) with 4MB L2 cache, 7CUs Radeon RX Vega 7 GPU @ 1.6 GHz; TDP: 10-25W AMD V2546 hexa-core/12-thread processor @ 3.0 GHz / 3.95 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on ADLINK launches SMARC Short Size Module, Devkit with NXP i.MX 8M Plus

ADLINK launches SMARC Short Size Module, Devkit with NXP i.MX 8M Plus

I-PI SMARC IMX8M Plus development kit

We had seen many i.MX 8M Plus modules with built-in AI accelerator announced at Embedded World 2021, including two SMARC modules from Congatec and iWave Systems. ADLINK has added another of i.MX 8M Plus module compliant with SMARC 2.1 “short” standard with LEC-IMX8MP system-on-module equipped with up to 8GB RAM, 128 GB eMMC flash, as well as a development kit called I-Pi SMARC IMX8M Plus prototyping platform. LEC-IMX8MP module specifications Specifications: SoC – NXP i.MX8M Plus with quad-core ARM Cortex-A53 processor, Vivante GC380 2D GPU and GC7000UL 3D GPU, 1080p60 video decoder & encoder, optional 2.3 TOPS Neural Processing Unit (NPU) System Memory – 2/4/8GB LPDDR4L-4266 Storage – 16, 32, 64, or 128GB eMMC flash (build option) Wireless – Optional 802.11 ac/a/b/g/n WiFi 5 2X2 MIMO and Bluetooth 5.0 module 314-pin MXM 3.0 edge connector Storage – 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 Display – […]

Exit mobile version