Posted on by Ayo Ayibiowu - 6 Comments on STMicro STM32WL is the World’s First LoRa SoC

STMicro STM32WL is the World’s First LoRa SoC

There is no denying that the Internet of Things is going to disrupt a lot of markets and it’s already happening to some extent. The question being asked is: “What IoT connectivity technology will lead this disruption era?”. One major technology in this connectivity race is LoRa. LoRa’s long-range, low-power, small footprint, simplicity, and the amazing community backing it, have allowed it to find its way into various applications while gaining for the top LPWAN IoT connectivity technology. STMicroelectronics, one of the biggest semiconductor manufacturer, also believes in the potential of LoRa with the launch of STM32WL, making it the World’s first die-integrated LoRa System-on-Chip. Traditional LoRa embedded platforms usually involve the need for a separate MCU chip and different LoRa transceiver chips either coupled together in one single package or separately. This undoubtedly adds extra design complexity, size, and even cost. STMicro hopes to address this with their STM32WL SoC. […]

Posted on by Stephen Vicinanza - 4 Comments on Lattice Introduces CrossLink-NX FPGA for Edge AI & Embedded Vision

Lattice Introduces CrossLink-NX FPGA for Edge AI & Embedded Vision

Lattice CrossLink-NX FPGA Lattice Semiconductor has announced the first product associated with its Nexus Platform, the CrossLink-NX FPGA designed for embedded vision and Edge AI applications. There are two offerings at this time, the CrossLink-NX FPGA 17, and the CrossLink-NX FPGA 40. Recent Announcements The Nexus Platform was introduced at the beginning of December 2019, and now CrossLink-NX has been developed and is being manufactured. The first announcements of Lattice Nexus Platform and The CrossLink-NX  Product Family came as the company’s moved to capture the embedded vision systems market. The Standout Features The low-power consumption, low soft error immunity, and 10Gbps MIPI are highlights of the CrossLink-NX FPGA. Other features include Instant On, with IO configured in 3 ms, and a total of 8 ms for the device. The Cross-Platform FPGAs The trends in technology are leading to devices that can cross function in a number of different tech environments. […]

ArmSoM RK3588 AIModule7 NVIDIA Jetson Nano-compatible SOM
Posted on by Ayo Ayibiowu - 6 Comments on ONiO.zero offers a RISC-V Microcontroller that runs without battery

ONiO.zero offers a RISC-V Microcontroller that runs without battery

ONiO.zero

Energy harvesting has been an exciting area people have tried to venture into mostly because of the possible applications that can arise from it. Newly invented energy-harvesting technologies accompanying low-power computing systems have pushed the boundaries of where embedded systems can be deployed. The demand for an increase in connected applications which require an underlying embedded system, and as we know, all electronic devices require a power source of some sort. This power source, batteries in most cases, comes with an accompanying buck regulator of some sort that will tend to increase the BOM. Aside from the BOM rise from the usage of batteries, there is also the shelf life and environmental aspects. The Norwegian specialist ONiO has introduced the ONiO.zero to address those issues. Having no battery means fewer components and a smaller design, which can easily be integrated into a wide range of solutions – be it fabrics, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on LivingPackets THE BOX Reusable Packaging Comes with an E-ink Display, Removes the Need for Filling Materials

LivingPackets THE BOX Reusable Packaging Comes with an E-ink Display, Removes the Need for Filling Materials

LivingPackets THE BOX

E-commerce and online shopping have flourished over the years whether you shop on Amazon and from sites in China. But that also means lots of carton board packages are being used and often thrown away after use, although personally I like to reuse them if I need to send packages myself. So it would be good if there was a way to reduce carton board package waste, and that’s exactly what LivingPackets is attempting to do with “THE BOX” which features an E-Ink display to display the recipient address and other information, and is meant to be re-used up to 1000 times. Here are some of the key features of THE BOX: E-Ink Display – Replaces the usual printed address label. It can be updated easily and does not consume power when not updated. Button to allow easy returns Integrated Holding Mechanism –  Patented a holding system to replace bubble […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on OmniVision OA805 4K Video Camera SoC Supports 100 ms Boot Time, 4K HEVC Encoding

OmniVision OA805 4K Video Camera SoC Supports 100 ms Boot Time, 4K HEVC Encoding

OmniVision OA805 4K Video Processor

OmniVision OA805 Arm Cortex-A5 4K video camera processor is specifically designed for battery operated security and surveillance cameras, including video doorbells, with the ability to encode 4K30p video streams with HEVC/H.265 video codec at very low power consumption. The processor also has a very short boot-up time of just 100ms, meaning it can go from completely powered off to fully functional upon trigger by a motion detection sensor. That short boot time removes the need for standby or sleep mode further lowering the power consumption and allowing the camera to have up to two years of battery life (albeit no mention of battery capacity was made…). OmniVision OA805 specifications: CPU Main CPU – Arm Cortex-A5 processor with NEON, 32KB I-cache, 32KB D-cache Secondary CPU (SPU) – Arm Cortex-A5 processor with NEON, 32KB I-cache, 32KB D-cache Media Processing Unit (MPU) – 32-bit RISC MCU with 8KB I-cache, 8KB D-cache System Memory […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 3 Comments on Silicon Labs BG22 Secure Bluetooth 5.2 SoC Promises 10-Year Coin-Cell Battery Life

Silicon Labs BG22 Secure Bluetooth 5.2 SoC Promises 10-Year Coin-Cell Battery Life

Silicon Labs BG22 Bluetooth 5.2 SoC

Yesterday, we wrote about the new Bluetooth LE Audio standard which promises smaller Bluetooth audio devices, or longer battery life, as well as support for multi-stream and broadcast audio. But there has been some other Bluetooth developments with the release of Bluetooth 5.2 specification on December 31st, and the announcement of the first Bluetooth 5.2 SoC courtesy of Silicon Labs. Bluetooth 5.2 Main Changes Bluetooth 5.2 builds upon Bluetooth 5.1 with the following key changes: Enhanced Attribute Protocol (EATT) – Improved version of the Attribute Protocol (ATT), which supports concurrent transactions, allows the interleaving of L2CAP packets relating to ATT packets from different applications and allows the ATT Maximum Transmission Unit (MTU) to be changed during a connection. This can reduce latency and improves the responsiveness of Bluetooth LE applications. LE Power Control – Devices can dynamically optimize the transmission power used in communication between connected devices with BLE receivers […]

Rockchip RK3568, RK3588 and Intel x86 SBCs and SoMs in 2025
Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Arduino Portenta H7 STM32H7 Cortex- M7/M4 Industrial Board Runs Arduino Code, Python and JavaScript

Arduino Portenta H7 STM32H7 Cortex- M7/M4 Industrial Board Runs Arduino Code, Python and JavaScript

Arduino Portenta H7

Arduino is now at CES 2020 promoting its Arduino Pro all-in-all IoT solution for professionals with the Arduino Pro IDE, Arm Pelion IoT platform for device management, and a new Portenta industry-grade board family starting with Arduino Portenta H7 board powered by STMicro STM32H7 dual-core Arm Cortex-M7/M4 microcontroller. Arduino Portenta H7 Specifications: Microcontroller – STMicro STM32H747XI Cortex-M7 @ 480 MHz + M4 @ 200 MHz MCU  with 2MB dual-bank Flash memory, 1 MB RAM, Chrom-ART graphical hardware accelerator System Memory – 2MB SDRAM (upgradeable up to 64MB) Storage – 16MB QSPI NOR Flash (Upgradeable up to 128MB) Connectivity 2.4GHz WiFi 802.11b/g/n up to 65 Mbps and Bluetooth 5.1 BR/EDR/LE via Murata 1DX module On-board 10/100M PHY Video I/F – MIPI DSI & 8-bit camera interfaces via 80-pin expansion connector, DisplayPort over USB-C port USB – 1x USB 2.0 Type-C port for power (PD), programming, and DisplayPort output I/Os Arduino MKR […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 8 Comments on Bluetooth LE Audio Supports LC3 Codec, Multi-stream & Broadcast Audio, Nordic Semi Evaluation Kit Unveiled

Bluetooth LE Audio Supports LC3 Codec, Multi-stream & Broadcast Audio, Nordic Semi Evaluation Kit Unveiled

Bluetooth LE Audio Evaluation Platform

I first heard about Bluetooth LE (Low Energy)- part of Bluetooth 4.0- in 2013 with RFDuino board, and it came to prominence once Android 4.3 added support later this year. Bluetooth LE is using to transmit messages using as little as energy as possible for example to synchronize data between a smartphone and a smartwatch. But if you ever had to transmit audio, you had to rely on Bluetooth Classic which, albeit considering low power, consumes more energy. But you should soon have much longer battery life on your Bluetooth headphone or battery-operated speaker, as the Bluetooth SIG has just announced Bluetooth LE Audio which adds a new codec and support for multi-stream and broadcast audio. The new high-quality, low-power audio codec used in the new Bluetooth standard is called the Low Complexity Communications Codec (LC3). The chart above shows the results of listening tests between LC3 and SBC codecs […]

Boardcon CM3588 Rockchip RK3588 System-on-Module designed for AI and IoT applications