ARM9 in 2020 – Meet Microchip SAM9X60 SoC & Evaluation Kit

SAM9X60-EK Evaluation Kit

In my first job, I wrote code for a MIPS processor for VoIP phones, then I switched to NEC/Renesas MCUs for CD and DVD players, before going back to Linux and my first experience with an Arm processor: Cirrus Logic EP9307 with a single ARM9  (ARM920T) core clocked at 200 MHz. That was in 2005, and according to Wikipedia various ARM9 cores were released between 1998 to 2006, and now such cores are not recommended for new IC designs with most companies now building their chips around Arm Cortex-A/M/R cores. At the end of last year, we wrote about Banana Pi BPI-F2S SBC based on Sunplus SP7021 “Plus1” quad-core Cortex-A7 processor with ARM9 and 8051 co-processor. Odd enough but at least the ARM9 core is not the main processor, however, while looking at the upcoming Linux 5.6 Linux kernel log I read an entry about a new SAM9X60 ARM926-based SoC from Microchip. Microchip SAM9X60 ARM9 Processor Quite surprising to have …

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Arrow Embedded To Go Free Online Conference, and 3,000 Development Boards Giveaway

Arrow Embedded to Go

With the coronavirus outbreak on-going, many events are either canceled or moving online. Arrow Electronics has now announced what appears to be a completely new online event. Embedded To Go virtual technology exhibition for embedded systems will take place on April 1-3, 2020, and offer technical presentations, information on newly launched technology, and access to Arrow’s sales and engineering teams. The event will entirely free to attend, and you can register online today with a company’s email address. The event will start in about 10 days by so far the virtual “booth map”, “supplier guide” and “lecture area” are inaccessible. We only know what the event should consist of thanks to an article on EENew Embedded: Technical presentation webinars will be hosted by leading suppliers covering AI, IoT and Edge computing, precision measurement, high-performance computing, intelligent condition-based monitoring, and other technological subjects. Information will also be available in the form of videos and white papers on boards and applications. A …

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FriendlyELEC SOM-RK3399V2 CPU Module Gets 4GB LPDDR4 RAM Upgrade

SOM-RK3399V2 vs SOM-RK3399

Last year, FriendlyELEC launched SOM-RK3399 system-on-module (SoM) powered by Rockchip RK3399 hexa-core processor combined with 2GB DDR3 memory, 16to 64GB flash, and a built-in WiFi 5 module. Contrary to most SoM’s on the market, SOM-RK3399 could work in standalone mode thanks to two USB-C ports, although it could also be integrated into a carrier board to create a complete development board with more ports and interfaces. The company has now introduced an update with SOM-RK3399V2 CPU module with 4GB LPDDR4 RAM, as well as a small change in the layout for the LED’s and buttons, but the rest of the features remain the same. The company also appears to have changed the way they handle cooling with SOM-RK3399V2 shipping with a heatsink, while SOM-RK3399 cooling was handled by a heatsink + cooling connected to the carrier board. SOM-RK3399V2 specifications: SoC – Rockchip RK3399 big.LITTLE hexa-core processor with 2x Cortex-A72 cores up to 2.0GHz, 4x Cortex-A53 cores up to 1.5GHz, Mali-T864 …

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Lantronix Snapdragon 865 Development Kit to Support Android 11

Snapdragon 865 development kit

If you ever wanted to develop applications for the latest Qualcomm Snapdragon processor, Intrinsyc is always the first company to provide Snapdragon hardware development kits and we’ve covered many over the years including Open-Q 845 HDK and Open-Q 855 HDK. The company has recently been bought by Lantronix, a provider of solutions for the Internet of Things (IoT) and Out of Band Management (OOBM), and we covered one of their products – an RJ45 connector running Linux – over 6 years ago. Lantronix Snapdragon 865 Mobile Hardware Development Kit is the first devkit announced since the acquisition. The board is powered by the latest Snapdragon 865 (SM8250) processor combined with 6GB LPDDR5 RAM,  128GB UFS 3.0 storage. The development kit currently supports Android 10, but it will be one of the first hardware to officially run Android 11 just previewed by Google. Snapdragon 865 Mobile HDK specifications: SoC – Qualcomm Snapdragon 865 (SM8250) mobile platform with CPU – Octa-core Kryo …

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Variscite Introduces i.MX 8M Mini and Nano SoM’s, Symphony Carrier Board

NXP i.MX 8M MINI/NANO Development Kit

NXP i.MX 8M Mini and i.MX 8M Nano are lower cost and lower power variants of NXP i.M 8M processors manufactured using a 14nm FinFET process, and cutting some features such as HDMI and embedded DisplayPort, or hardware video decoder. NXP i.MX 8M Mini has been announced for over two years, so we’ve already written about many boards and systems-on-module (SoM) including Boardcon EM-IMX8M-MINI SBC, TechNexion XORE LGA SoM, or Congatec conga-SMX8-Mini SMARC 2.0 module among others. NXP i.MX 8M Nano is more recent, and we only covered a few announcements so far namely iWave Systems iW-RainboW-G34M-SM SoM and Conga-SMX8-Nano SMARC 2.0 computer-on-module. There’s now at least a third company working on a “Nano” module with Variscite announcing VAR-SOM-MX8M-NANO SoM together with a “Mini” version called VAR-SOM-MX8M-MINI, and Symphony carrier board and development kits. VAR-SOM-MX8M-MINI & VAR-SOM-MX8M-NANO Modules Both modules are part of Variscite VAR-SOM Pin2Pin family, and share the following key features & specifications: SoC MINI – NXP i.MX8M …

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Trion T20 BGA256 FPGA Development Kit Supports “PulseRain Reindeer” RISC-V RV32IM soft CPU

Trion T20 BGA256 Development Kit

A few months ago I wrote about FireAnt low-cost FPGA development board powered by Efinix Trion T8 FPGA, and it was the first time I personally heard about the company. Trion FPGA family range from the T4 with 3,888 logic elements up to the Trion T200 with 192,000 LE’s. A board more powerful than FireAnt, but not quite high-end, recently showed up on Digikey with Trion T20 BGA256 development kit going for $150. Trion T20 BGA256 Development Kit specifications: FPGA – Efinix Trion T20 FPGA with 19,728 LE’s, 1,044 Kbit embedded RAM, 36 18×18 multipliers, 7 PPL’s, up to 220 GPIO’s; 256-ball FBGA (13×13 mm) System Memory – 256 Mbit SDR SDRAM Storage – NOR flash USB – 1x Micro-USB port for programming Debug / Configuration – SPI and JTAG headers to facilitate configuration Expansion 3x I/O headers to connect to external devices LVDS TX header, LVDS RX & clock header Misc – 8x user LED’s, 3x user push-buttons, 3x …

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RISC-V based PolarFire SoC FPGA and Devkit Coming in Q3 2020

Microsemi unveiled PolarFire FPGA + RISC-V SoC about one year ago, but at the time, development was done on a $3,000 platform with SiFive U54 powered HiFive Unleashed board combined with an FPGA add-on board from Microsemi. I’ve now been informed that Microchip has announced its Linux-capable PolarFire FPGA+RISC-V SoC would start shipping in Q3 2020 at the RISC-V summit and that a development kit will be sold for a few hundred dollars. PolarFire SoC FPGA   PolarFire SoC FPGA key features and specifications: Mid-Range FPGA optimized for Low Power High-speed serial connectivity with built-in multi-gigabit/multi-protocol transceivers from 250 Mbps to 12.7 Gbps Up to 461k logic elements consisting of a 4-input Look-Up Table (LUT) with a fracture-able D-type flip-flop Up to 31.6 Mb of RAM Power optimized transceivers Up to 1420 18 × 18 multiply-accumulate blocks with hardened pre-adders Integrated dual PCIe for up to ×4 Gen 2 Endpoint (EP) and Root Port (RP) designs High-Speed I/O (HSIO) supporting …

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Lenovo Enters the SBC Market with Leez LP710 RK3399 Board

Lenovo Leez P710 SBC

It’s always interesting to look into mainline Linux changelog either to find out about new software features, but also new hardware platform. And earlier today, I wrote about Linux 5.4 release, I noticed comments about “Leez RK3399 P710 SBC“. After searching a bit, it turns out it’s a single board computer by Lenovo, which the company apparently showcased at World Mobile Congress in Spain last February. Leez is apparently a team part of Lenovo. Lenovo Leez P710 board specifications: SoC – Rockchip RK3399 hexa-core processor with 2x Cortex-A72 cores @ up to 2.0 GHz, 4x Cortex-A53 cores, and an Arm Mali-T860MP4 GPU System Memory – 2 or 4GB LPDDR4 Storage – 16GB eMMC flash, MicroSD card slot Video Output – HDMI 2.0a up to 4K @ 60 Hz, 4-lane MIPI DSI, DisplayPort via USB-C port Audio – Audio jack + digital audio output via HDMI Camera I/F -2x 4-Lane MIPI-CSI Connectivity – Gigabit Ethernet, 802.11b/g/n/ac WiFi + Bluetooth 5.0 via …

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