PHYTEC phyCORE-AM65x SoM Features TI Sitara AM654x Processor

phyCore-AM654x SoM

We already knew Texas Instruments was working on AM654 processor, the first 64-bit Arm SoC from the company, featuring four Cortex A53 cores, a PowerVR SGX544 GPU, dual lock-step capable Cortex R5F cores, and interfaces targeting industrial applications. Now at least one company has announced a system-on-module based on the solution. PHYTEC phyCORE-AM65x is equipped with AM654x processor,  DDR4 and ECC DDR4 memory, up to 32GB eMMC flash, as well as built-in Ethernet, WiFi, and Bluetooth connectivity.  phyCORE-AM65x specifications: SoC – Texas Instruments Sitara AM65x with 4x Arm Cortex-A53 cores, dual-core Arm Cortex-R5F MCU subsystem, PowerVR SGX544 GPU, 6x PRU-ICSSG System Memory – DDR4 with support for discrete DDR4 ECC Storage – Up to 32GB eMMC Connectivity Optional 2.4 or 5GHz Certified WiFi Solution 10/100/1000 Mbit/s Ethernet PHY on SOM Board-to-board connectors – 2x “high-density PCB interconnects” Dimensions – 65 x 55 mm The company provides Linux (Yocto Project), Android, and TI-RTOS BSP’s for the SoM. phyCORE-AM654x Rapid Development Kit …

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Intrinsyc Open-Q 605 SBC is Powered by Qualcomm QCS605 IoT Processor

Qualcomm QCS605 Development Board

Qualcomm QCS603 / QCS605 “Internet of Things” processors were announced last spring as the first “Qualcomm Vision Intelligence Platforms” from the company and designed for artificial intelligence and computer vision applications. Both SoCs are octa-core processor with two performance Kryo 300 Gold cores, and six efficiency Kryo 300 Silver cores, but QCS605’s big cores are clocked at a higher 2.5 GHz frequency, and the processor comes with better 802.11ac Wave2 WiFi, support for up to 32MB camera, and 4K video capture. However so far, there was no development platform publicly available, and this has just changed with Intrinsyc announcing Open-Q 605 single board computer (SBC) and development kit featuring Qualcomm QCS605 vision intelligence platform. Open-Q™ 605 SBC Specifications SoC – Qualcomm QCS605 octa-core processor with 2x high-performance Kryo 300 Gold cores up to 2.5 GHz, 6x low-power Kryo 300 Silver cores up to 1.7 GHz, Hexagon 685 DSP with Hexagon vector extensions (HVX), Adreno 615 GPU Neural Processing – Qualcomm AI …

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Intrinsyc Open-Q 670 HDK Development Kit Features Snapdragon 670 Processor

Qualcomm introduced the Snapdragon 670 this August with improved camera capabilities and improved performance, including a near doubling of the performance of the AI Engine over the one in Snapdragon 660. Intrinsyc is normally the first company to launch mobile development platform for Qualcomm processor, and this time is no exception, as the company has just introduced Open-Q 670 HDK Development Kit with Snapdragon 670 Mobile Platform. Open-Q 670 HDK specifications: SoC – Qualcomm Snapdragon SDA670 Octa-core 64-bit Kryo 360 processor with 2x high-performance Gold cores @ 2.016 GHz, 6x low-power Silver cores @  1.708 GHz, Qualcomm Adreno 615 GPU @ 430 MHz, and Qualcomm Hexagon 685 DSP dedicated for Computer Vision and Video Post Processing System Memory – 6GB LPDDR4x RAM Storage – 64GB eMMC 5.1 Flash Storage (non-PoP memory) + uSD card socket Display MIPI DSI connector with 1x 4-lane DSI port + Touch for included LCD panel accessory (5.65″ FHD+ 2160×1080 resolution) HDMI Video output via DSI …

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Neutis N5 Allwinner H5 CPU Module and Development Kit are now up for pre-order

Emlid Neutis N5 system-on-module (SoM) powered by Allwinner H5 processor was unveiled right before Embedded World 2018 in February with an expected launch date scheduled for April. There have been some delays but the Allwinner H5 CPU module and corresponding development kit are now up for pre-order with delivery slate for the end of August. Neutis N5 SoM Neutis N5 specifications: SoC – Allwinner H5 quad core  Arm Cortex-A53 processor @ up to 1.3 GHz with Arm Mali-450MP4 GPU System Memory – 512 MB DDR3 RAM Storage – 8 GB eMMC flash Connectivity – Wi-Fi 802.11 b/g/n. Bluetooth 4.0 dual-mode BLE with on-board antenna and u.FL connector for optional external antenna HW Security – Tamper-resistant dedicated crypto chip (secure element) for storing cryptographic keys, unique ID, random number generation and more 2x DF40 80-pin board to board X1 and X2 connectors with 38x GPIOs 4x UART, 3x I2C, 2x SPI, 2x PWM 3x USB 2.0, 1x USB OTG 1x IR …

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GAPUINO GAP8 is a $229 RISC-V MCU Developer Kit for A.I. Applications

GAPuino Board

GreenWaves GAP8 is a low power RISC-V “MCU class” processor with eight compute cores optimized for artificial intelligence applications, and its main selling point is the ability to do tasks like computer vision or audio processing at very low power, even good enough to run on batteries. When we first covered GAP8 RISC-V processor at the beginning of the year, the company also mentioned a development kit comprised of GAPDUINO Arduino compatible board, a sensor board, and a QVGA camera module to experiment with the solution.  The board and development kit are now easier to purchase as the devkit is sold on SeeedStudio for $229. GAPuino board specifications: SoC – GAP8 IoT Application Processor with 8x RISC-V  compute cores, 1x RISC-V fabric controller core delivering up to 200 MOPS at 1mW and  >8 GOPS at a few tens of mW Memory / Storage –  HyperBus combo DRAM/Flash with 512 Mbit Flash + 64 Mbit DRAM; 256 Mbit Quad SPI flash …

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KidBright32 Board is Thailand’s BBC Micro:Bit Equivalent

BBC Micro:Bit board was first announced in July 2015. Designed for STEM education, the board was then offered to UK schools in March 2016, and a few months later UK store would start selling it worldwide. It’s now available pretty much anywhere, and you can likely find it in a local store or online. The Thai government must have seen this, and thought to themselves “If the British can do it, we can do it too!”, as the National Electronics and Computer Technology Center (NECTEC) part of Thailand’s Ministry of Science and Technology designed KidBright32 board and courses to teach STEM to Thai students. The board is based on Espressif Systems ESP32-WROOM-32 WiFI and Bluetooth module, and comes with large holes for power (5V/GND) and 6 digital inputs/outputs,  smaller through holes for I2C and more I/Os, as well as an I2C header. We’ll also find some LEDs, two dot matrix LED displays, three buttons, a buzzer, an RTC, a light …

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SECO Q7-C25 / Q7-C26 QSeven SoMs Feature NXP i.MX 8M / i.MX 8Quad Processor

We’ve previously covered SECO’s SM-C12 SMARC 2.0 i.MX 8M system-on-module, but the company has just unveiled two new module families which are compliant with Qseven – another SoM standard – and powered by NXP i.MX 8M dual/quad core Cortex A53 processor and NXP i.MX 8Quad Cortex A53 or A72/A53 SoC with respectively Q7-C25 and Q7-C26 systems-on-module. SECO Qseven i.MX 8/8M System-on-Module Q7-C25 / Q7-C26 specifications: SoC Q7-C25 (one or the other) NXP i.MX 8M Quad 4x Cortex-A53 cores up to 1.5GHz, 1x Cortex-M4 F real-time core, Vivante GC7000Lite GPU, VPU NXP i.MX 8M Dual 2x Cortex-A53 cores up to 1.5GHz, 1x Cortex-M4 F real-time core, Vivante GC7000Lite GPU, VPU NXP i.MX 8M QuadLite 4x Cortex-A53 cores up to 1.5GHz, , 1x Cortex-M4 F real-time core, Vivante GC7000Lite GPU no VPU Q7-C26 (one or the other) NXP i.MX 8QuadMax 2x Cortex-A72 cores + 4x Cortex-A53 cores + 2x Cortex-M4F cores, 2x Vivante GC7000XSVX GPUs NXP i.MX 8QuadPlus 1x Cortex-A72 cores + 4x …

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Snapdragon Wear 2500 Launched for the 4G LTE Kid Watch Market

Snapdragon Wear 2500

Qualcomm has made several announcements at Mobile World Congress Shanghai 2018. We’ve already covered Snapdragon 632, 639, and 629 processors for mid- and high-tier smartphones, but the company has also finally announced a new SoC for wearables succeeding Snapdragon Wear 2100. Meet Snapdragon Wear 2500, specifically targeting 4G children watches. Qualcomm is usually not the best company when it comes to releasing technical details about their processors, but here what Snapdragon Wear 2500 specifications should look like: Processor – 4x Arm Cortex A7 GPU – Adreno-class GPU Connectivity – Fifth generation 4G LTE modem with RF front-end (RFFE), location engine, “Bluetooth streaming architecture”, NXP NFC solution Camera I/F – 5MP Ultra-low power sensor hub working with InvenSense sensors Power  – Wearable PMIC reducing Rock Bottom Sleep Current (RBSC) by percent, charger, fuel gauge Compact package Snapdragon Wear 2500 is designed for low power with up to 14 percent longer battery life for both active and standby modes of operation compared …

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