BOOTPRINT X2 96Boards AIoT Development Kit Features Sunrise 2.0 AI Processor

Horizon Robotics BOOTPRINT X2 is an AIoT / AI computing development kit providing a complete reference solution from device to cloud integration. The board is powered by the company’s Sunrise 2.0 AI edge processor based on the second-generation BPU (“Brain Processing Unit”) architecture that  delivers up to 4 TOPS at low power consumption and is said to follow 96Boards specification, although from the photo below they’ve taken some liberties with the option (e.g. added a Gigabit Ethernet port). The board has now launched yet, and we have limited information about BOOTPRINT X2 kit specifications: SoC – Horizon Sunrise 2.0 AI edge processor with 4 TOPS equivalent AI processing power (no mention of architecture) System Memory – 1GB LPDDR4 RAM Storage – 4GB eMMC flash, MicroSD card socket Connectivity – Gigabit Ethernet Camera I/F – Dual 1080p camera inputs for symmetric binocular camera,  combination of infrared and visible light. Audio – Support for 6-array microphones USB – 1x MicroUSB port Expansion …

Support CNX Software – Donate via PayPal or become a Patron on Patreon

Nordic Semi nRF52833 WiSoC Supports Bluetooth 5.1 Direction Finding, Works up to 105ºC

nRF52833-DK

Nordic Semiconductors had added a new member to their RF52 multi-protocol wireless SoCs with nRF52833 that supports Bluetooth 5.1 direction finding and can operate in a wider temperature range between -40ºC and +105°C. The company also introduced nRF52833 DK development kit for Bluetooth Low Energy, Bluetooth mesh, Thread, Zigbee (802.15.4), and 2.4GHz proprietary applications, and some companies have already announced nRF52833 modules. Nordic Semi nRF52833 Bluetooth 5.1 SoC Key features and specifications: MCU Core – Arm Cortex-M4F @ 64 MHz Memory – 128 KB RAM Storage – 512 KB Flash Connectivity Bluetooth 5.1 @ 2 Mbps/1 Mbps/500 kbps/125 kbps 802.15.4 (Thread/Zigbee) @ 250 kbps 2.4 GHz proprietary @ 2 Mbps / 1 Mbps NFC-A tag TX power – Programmable from +8 dBm to -20 dBm in 4 dB steps Sensitivity Bluetooth 5: -103 dBm at 125 kbps; -98 dB at 500 kbps; -95 dBm at 1 Mbps; -92 dBm at 2 Mbps 802.15.4: -99 dBm at 250 kbps 2.4 GHz: …

Support CNX Software – Donate via PayPal or become a Patron on Patreon

Olimex Launches NB-IoT DevKit Based on Quectel BC66 Module for 19 Euros

Olimex NB-IoT Devkit BC66

There are three LPWAN standards currently dominating the space LoRaWAN, NB-IoT, and Sigfox. In a recent presentation, Olimex explains NB-IoT (aka LTE Cat NB1) offers several advantages over LoRaWAN and Sigfox which include: Higher speeds of up to 25.5 kbps (UL/DL) Single GSM base station can handle up to 100 000 NB-IoT nodes Single GSM base station can cover up to 10-100km range in rural environments, and 1 to 10km in urban settings Lasts up to 10 years on a Lithium 3V battery if less than 200 bytes are sent per day The main disadvantage they listed was operator dependence, as you rely on the operator for coverage, and anything related to connectivity. In Bulgaria in particular, they found out it was not easy to get an NB-IoT SIM card activated, and the operator may shut you off without notice. For reference here in Thailand, last time I checked I could not buy a SIM card for evaluation with my …

Support CNX Software – Donate via PayPal or become a Patron on Patreon

Nordic Thingy:91 Cellular IoT Prototyping Platform Comes with 16 Sensors

Nordic Thingy:91

Nordic Semiconductor launched the Nordic Thingy:52 back in mid-2017 in the hopes of bringing app and web developers into the hardware ecosystem as fast and easy as possible.  The Nordic Thingy:52 was a Bluetooth 5 IoT sensor development kit based on the company’s nRF52832 WiSoC. Although the Nordic Thingy:52 kit is still very much available for purchase and support always available, Nordic Semiconductor has gone further launching a new development kit called the Nordic Thingy:91 targeting cellular IoT applications. The Nordic Thingy:91 is a cellular IoT prototyping platform with support for LTE-M, NB-IoT plus GPS option. Even though IoT connectivity standards like LoRaWAN, BLE, WiFi, ZigBee, and others are very much growing and expanding, Nordic Semi is fully backing cellular technology, something that has very much been available and most likely will still keep been available, and the adoption of 5G is another testimony to that. Cellular is here, and it is not going away anytime soon. The Nordic Thingy:91 …

Support CNX Software – Donate via PayPal or become a Patron on Patreon

Variscite VAR-SOM-6UL System-on-Module Supports NXP i.MX 6UltraLite, i.MX 6ULL, or i.MX 6ULZ ARM Cortex-A7 Processor

VAR-SOM-6UL Development Kit

Variscite has just announced the launch of the VAR-SOM-6UL System-on-Module (SoM) powered by a choice of NXP’s i.MX 6UltraLite / 6ULL / 6ULZ Arm Cortex-A7 processor clocked at up to 900MHz CPU clock and based on the company earlier DART-6UL module while integrating an additional LVDS bridge option, all packed in SO-DIMM200 form factor to fit the VAR-SOM Pin2Pin family. The module is optimized for power, size, and cost, and supports dual Ethernet, dual USB, audio, CAN Bus, camera, optional single or dual-band WiFi, Bluetooth BLE, Touch, ADC, PWM, as well as support for industrial temperature grades with -40 to 85°C range. Variscite VAR-SOM-6UL specifications & key features:  SoC – NXP i.MX 6UltraLite / 6ULL / 6ULZ ARM Cortex-A7 with optional security features up to 900MHz CPU Clock with 2D Pixel acceleration engine System Memory – Up to 1024 MB DDR3L Storage – 512 MB NAND / 64 GB eMMC Connectivity – Certified Wi-Fi single-band 802.11b/g/n or dual-band Wi-Fi 802.11ac/a/b/g/n;  …

Support CNX Software – Donate via PayPal or become a Patron on Patreon

NXP i.MX 7ULP Enters Mass-Production, EVK and Systems-on-Module Announced

Last year, we wrote about F&S Elektronik Systeme PicoCORE MX7 system-on-module (SoM) powered by NXP i.MX 7ULP processor manufactured with a 28nm FD-SOI process, and that was announced a year earlier. The official launch of the module was planned for Q3 2018, but there have been some delays as LinuxGizmos reports NXP has only started mass production of their i.MX7 ULP this June. With the official launch of i.MX 7ULP, the company also introduced the official i.MX 7ULP Evaluation Board (MCIMX7ULP-EVK) as showcased on Element14’s community and several other companies announced i.MX 7ULP systems-on-modules. Benefits of NXP i.MX 7ULP Processor The i.MX7 ULP family of processors is an extremely power-efficient series, that is utilizing lower power for more functions. The SoC is being touted as the most power-efficient processor that can be obtained that also houses a 3D GPU.  Although like the i.MX7, the i.MX 7ULP combines both Cortex-A7 and Cortex-M4 cores but can effectively bring the power states even …

Support CNX Software – Donate via PayPal or become a Patron on Patreon

Inforce Introduces Snapdragon 660 & 845 Modules with On-Device AI

ACC-1C20 Carrier Board

Inforce Computing has just launched two new pin-compatible system-on-modules, namely Inforce 6502 and Inforce 6701, powered by Qualcomm Snapdragon 660 & Snapdragon 845 SoC respectively. In their newsletter, the company claims those are their first modules with on-device AI capabilities with the Snapdragon 660 enabling “advanced visual computing, enhanced graphics and on-device machine learning capabilities”, while the more powerful Snapdragon 845 is better suited for “immersive multimedia experiences including optimized AI performance for a more responsive, power-efficient user- experience and capture of cinema-grade videos in [email protected] resolution. Inforce 6502 Snapdragon 660 SoM Specifications: SoC – Qualcomm Snapdragon 660 with 8-core Kryo 260 processor, Adreno 512 GPU, Qualcomm Hexagon 680 DSP with Hexagon Vector eXtensions (HVX) for Caffe2 and Tensorflow System Memory & Storage – 3GB LPDDR4, Dual-Channel + 32GB eMMC flash in single eMCP package Connectivity Bluetooth 5.0 + Wi-Fi 5 802.11ac 2×2 with MU-MIMO and Dual Band Simultaneous (DBS) via WCN3990 + 2x MHF4 connectors GPS/ GLONASS location via …

Support CNX Software – Donate via PayPal or become a Patron on Patreon

MYiR Launches MYC-JX8MX CPU Module & MYD-JX8MX Devkit Powered by NXP i.MX 8M Processor

MYD-JX8MX Development Board

MYiR Tech Limited (aka MYiR) has launched a new NXP i.MX 8 CPU module – MYC-JX8MX – powered by NXP i.MX 8M processor, as well as the corresponding MYD-JX8MX development kit. The module integrates up to 2GB LPDDR4 RAM, 8GB eMMC flash, 256Mbit QSPI Flash, Gigabit Ethernet PHY & PMIC onboard, and I/O signals are accessible from a 314-pin MXM 3.0 expansion connector. Typical applications for the company’s latest system-on-module include scanning/imaging solutions, building automation and smart home, human-machine interface (HMI), machine vision or other consumer and industrial applications requiring multimedia capabilities. MYC-JX8MX CPU Module Specifications: SoC – NXP i.MX 8M quad-core Arm Cortex-A53 processor @ 1.3GHz,  Arm Cortex-M4 real-time core @ 266MHz, 2D and 3D GPU System Memory – 1GB or 2 GB LPDDR4 (supports up to 4GB LPDDR4) Storage – 8GB eMMC Flash (supports up to 64GB), 256Mbit QSPI Flash 314-pin MXM 3.0 edge connector with: 1x Gigabit Ethernet 3x Serial ports 3 x I2C, 2x SPI, 4x …

Support CNX Software – Donate via PayPal or become a Patron on Patreon