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NASA Artemis Watch 2.0 – An ESP32-S3-powered, NASA-inspired wearable kit for education

NASA Artemis Watch 2.0

CircuitMess NASA Artemis Watch 2.0 is a programmable, NASA-themed smartwatch based on an ESP32-S3 WiFi and Bluetooth module and a 1.14-inch monochrome display. The watch also features an accelerometer, a gyroscope, a buzzer, an RTC, a button, several LEDs, and a USB port for programming and charging the built-in 600 mAh battery. NASA Artemis Watch 2.0 specifications: Core module – ESP32-S3-MINI-1-N4R2 SoC – ESP32-S3 dual-core Xtensa LX7 processor with WiFi 4 and Bluetooth 5.0 connectivity Memory – 2MB PSRAM Storage – 4MB QSPI flash PCB antenna Display – Built-in 1.44-inch display USB – 1x USB Type-C port for charging and programming Sensors 6-axis LSM6DS3TR accelerometer and gyroscope Temperature sensor (TBC) Misc Lever button 6x user LEDs, 1x power LED, 1x RGB LED Buzzer RTC  + backup battery Power Supply 5V via USB-C port 600 mAh LiPo battery, good for 2 to 3 hours on a charge Dimensions and Weight – […]

T-Display-P4 smartphone-like devkit features ESP32-P4 MCU, ESP32-C6 wireless SoC, and SX1262/LR2021 LoRa transceiver

LILYGO T-Display-P4

LILYGO T-Display-P4 is a feature-rich ESP32-P4 + ESP32-C6 devkit, but with a smartphone-like design and support for GPS, Ethernet, and LoRaWAN through SX1262 or LR2021 LoRa transceiver, besides the usual WiFi 6, Bluetooth 5.x, and 802.15.4 wireless connectivity. The T-Display-P4 is offered with either a 4.05-inch IPS display and a 2MP front-facing camera or a 4.1-inch AMOLED with a 2MP rear camera. The devkit is equipped with 32MB PSRAM and 16MB NOR flash for the ESP32-P4, a microSD card slot, a built-in microphone and speaker, a 3.5mm audio jack, a few USB ports, and a 9-axis motion sensor, as well as a GPIO port and two Qwiic connectors for expansion. T-Display-P4 specifications: MCU – ESP32-P4 CPU Dual-core RISC-V microcontroller @ 360 MHz with AI instructions extension and single-precision FPU Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz GPU – 2D Pixel Processing Accelerator (PPA) VPU – H.264 and […]

8-inch ESP32-P4 touch display offers WiFi 6, BLE, 802.15.4 connectivity, optional 4G LTE and LoRaWAN

reTerminal D1001

Seeed Studio’s reTerminal D1001 is an 8-inch capacitive touch display powered by an ESP32-P4 RISC-V microcontroller and equipped with an ESP32-C6 wireless module, a camera, a dual-microphone array, and a speaker. The reTerminal D1001 is a fully enclosed solution designed for HMI applications such as control panels, vision-enabled IoT terminals, video intercoms, and smart dashboards. One highlight compared to other ESP32-P4 displays is optional support for 4G LTE cellular connectivity using an mPCIe module and SIM card slot, as well as LoRaWAN using a Stamp module. reTerminal D1001 specifications: SoC – Espressif Systems ESP32-P4NRW32 CPU Dual-core 32-bit RISC-V HP (High-performance) CPU @ up to 400 MHz with AI instructions extension and single-precision FPU Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz Memory 768 KB HP L2MEM (for dual-core CPU), 32 KB LP SRAM, 8 KB TCM (for LP MCU core) 32MB PSRAM Storage – 128 KB HP ROM, 16 […]

SolidRun P100 COM Express Type 6 module features LPCAMM2 memory, up to 12-core AMD Ryzen AI Embedded P185 SoC

Ryzen AI Embedded P100 COM Express module

We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced its new P100 COM Express Type 6 module family. These compact (95 x 95mm) modules are among the first to support the newly released 8- to 12-core Zen 5 SKUs, with up to 50 TOPS from the NPU and 80 TOPS of total system AI. Another fairly unique feature of the new SolidRun computer-on-module is support for LPCAMM2 LPDDR5X memory. The company uses a screw-lock mechanism to deliver high-bandwidth LPDDR5X performance (up to 9600 MT/s) while maintaining the mechanical reliability required for “systems in motion,” such as autonomous mobile robots (AMRs), heavy machinery, and rail systems. A mini-ITX development kit for the module is also available. SolidRun P100 COM Express Type 6 module SolidRun P100 COM Express Type 6 module specifications: AMD Ryzen AI Embedded P100 Series […]

Nordic Semi nRF93M1 IoT modules offer LTE Cat 1bis cellular connectivity, Wi-Fi location capabilities

Nordic Semi nRF93M1 LTE Cat 1bis module

Nordic Semiconductors introduced the nRF93M1 LTE Cat 1bis IoT modules at Mobile World Congress 2026 with up to 10 Mbps downlink and 5 Mbps uplink, as well as built-in Wi-Fi location capabilities. Two variants will be offered: the nRF93M1-LABA supporting LTE bands for Europe, Asia, the Middle East, and Africa, and the nRF93M1-LACA supporting a wider range of LTE bands and certifications for worldwide deployments. Nordic Semi nRF93M1 specifications : LTE Cat-1bis modem with 3GPP Rel. 14 support 617-2690 MHz LTE FDD and TDD band support Power Class 3 (23 dBm) Support for (e)UICC/eSIM (SGP.32 IoT) and Software SIM (SoftSIM) framework Data rates – Up to 10 Mbps downlink and 5 Mbps uplink Peripherals – High-speed USB, UART, IOs, coexistence interface, etc… Secure firmware updates via nRF Cloud Location services using Wi-Fi scanning and cellular eCID location Power-saving features – eDRX, PSM, and Nordic proprietary optimizations Certified for global and regional operation (GCF, […]

Tablet-like, ESP32-P4-based 7, 8, and 10.1-inch HMI displays integrate Wi-Fi 6 connectivity, 5MP camera

ESP32 P4 HMI Display

Waveshare has recently released the ESP32-P4-WIFI6-Touch-LCD, a family of tablet-like, fully enclosed HMI display development boards built around the ESP32-P4 SoC. The company offers 7-inch, 8-inch, or 10.1-inch configurations, all designed for industrial HMI, smart home terminals, and edge AI applications. Since the ESP32-P4 does not include built-in wireless connectivity, Waveshare has integrated an ESP32-C6-MINI module for WiFi 6 and Bluetooth 5 (LE) support. The board also leverages the ESP32-P4’s peripherals for MIPI CSI/DSI interfaces, a 5MP camera, and various I/Os, including USB 2.0 OTG and USB-to-UART Type-C ports, an SDIO 3.0 microSD card slot, dual microphones with echo cancellation, a speaker driven by an onboard audio codec, GPIO expansion headers, and optional battery support. Waveshare ESP32-P4-WIFI6-Touch-LCD specifications: Wireless module – ESP32-P4-Core SoC – Espressif Systems ESP32-P4NRW32 CPU Dual-core 32-bit RISC-V HP (High-performance) CPU @ up to 400 MHz with AI instructions extension and single-precision FPU Single-RISC-V LP (Low-power) MCU core […]

ESP-SensairShuttle ESP32-C5 kit supports Bosch Sensortec’s BME690, BMI270, BMM350 environmental and motion sensors

ESP SensairShuttle

Jointly developed by Espressif Systems and Bosch Sensortec, the ESP-SensairShuttle kit comprises an ESP32-C5 development board that can be interfaced with a choice of two sensor daughterboards. It is designed for motion sensing and large language model human-computer/machine interaction scenarios. More specifically, the ESP-SensairShuttle mainboard relies on an ESP32-C5-WROOM-1-N16R8 module with dual-band Wi-Fi 6, Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) wireless connectivity, and interfaces with the provided Bosch Sensortec Shuttle Boards, a 1.83-inch touch display, a microphone, and a speaker, and can be powered via USB or a LiPo battery. ESP-SensairShuttle kit content and specifications: ESP-SensairShuttle mainboard Main control module – ESP32-C5-WROOM-1-N16R8 SoC – Espressif Systems ESP32-C5 CPU Single-core 32-bit RISC-V processor @ up to 240 MHz Low-power RISC-V core @ 40 MHz acting as the main processor for power-sensitive applications Memory – 384 KB SRAM on-chip Storage – 320 KB ROM Connectivity Dual-band (2.4/5 GHz) 802.11ax WiFi 6, […]

Rockchip RK1820/RK1828 SO-DIMM and M.2 LLM/VLM AI accelerator modules, devkits, and benchmarks

Rockchip RK1820/RK1828 SO-DIMM module development board

Rockchip unveiled two RK182X LLM/VLM accelerators at its developer conference last July, namely the RK1820 with 2.5GB RAM for 3B parameter models, and the RK1828 with 5GB RAM for 7B parameter models. A few months have passed, and we have a few more details since a development kit based on Rockchip RK1820/RK1828 SO-DIMM module is now available, some basic documentation has been released, and the RK1828 has been benchmarked against the Rockchip RK3588’s NPU. I was also told that M.2 modules are coming soon. Firefly RK182X 3D RAM Stacking Development Kit The “RK182X 3D RAM Stacking Development Kit” is based on the AIO-GS1N2 carrier board, previously offered with a Rockchip RK3576 or RK3588(s) and with a NVIDIA Jetson Orin Nano or NX AI module. Specifications: Main module (now only RK3588 variant for sale as part of the RK182x kit) Core-3588JD4  – Rockchip RK3588 with 6 TOPS NPU, 4GB to 32GB […]