Project Connected Home over IP (CHIP) Working Group is Backed by Google, Apple, Amazon, and the Zigbee Alliance

Project Connected Home over IP

Amazon, Apple, Google, and Zigbee Alliance have partnered to create Project Connected Home over IP (CHIP) working group aiming to develop a royalty-free, Smart Home standard to increase compatibility among products, and with security at the forefront. The new standard will be separate from Zigbee 3.0 / Pro, and Zigbee Alliance board member companies such IKEA, Legrand, NXP Semiconductors, Resideo, Samsung SmartThings, Schneider Electric, Signify (formerly Philips Lighting), Silicon Labs, Somfy, and Wulian will also join the CHIP working group and contribute to the project. The standard specified by Project Connected Home over IP will rely on existing technology from the networking layer including TCP/UDP transport protocol, IPv6 network and various physical & media standards such as WiFi, Ethernet, Bluetooth LE, Cellular, 802.15.4 and others. Instead, it will define what happens at the application layer level with the following points of focus: End-to-end data security and privacy among in-home and mobile devices, and cloud services. A unified and standardized baseline …

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Zidoo M9 is a Rockchip RK3399 TV Box/Mini PC/SBC with Android 7.1 + SDK

Zidoo M9

Zidoo has launched several TV boxes running Android over the years, some of which we reviewed such as Zidoo X9 (2015), or Zidoo H6 Pro. They also have experience launched dual-OS systems with Android and OpenWrt running simultaneously for multimedia and router functions respectively through their Zidoo X9S media center. The company has now contacted CNX Software to review their latest model. Zidoo M9 is a higher-end Rockchip RK3399 powered Android 7.1 TV box or mini PC, and Zidoo will also sell it as a single board computer for custom projects in the field of robotics, automotive control, artificial intelligence and more. Zidoo M9 specifications: SoC – Rockchip RK3399 hexa-core processor with 2x Cortex-A72 cores @  2.0GHz, 4x Cortex-A53 cores. and a Mali-T860MP4 GPU with support for OpenGL ES 1.1/2.0 /3.0, OpenVG1.1, OpenCL, and Directx11 System Memory – Dual-channel 4GB DDR (2GB is optional) Storage – 32GB eMMC5.1 flash  (8GB/16GB/64G/128G are optional), MicroSD card slot Video Output & Display I/F …

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Tuya helps you easily Design & Manufacture your own Smart Home Solutions

I was recently informed about LSC Smart Connect 3 door sensor selling on Action discounter with over 600 stores across the Netherlands, Belgium, France, Germany, Luxembourg, Austria, and Poland. The door sensor is based on ESP8266, and people have bought a few and flashed their own open source firmware converting the device into a multi-purpose sensor device with ESPNOW protocol that enables direct and low-power control of Espressif devices without the need of a router. The module inside the door sensor is called TYWE3S, which one document on the FCC website refers to as “Tuya WiFi module” and further mentions “TYWE3S is a low-power consumption module with built-in Wi-Fi solution designed by Hangzhou Tuya Technology Corporation” that is based on ESP8266 WiSoC with 1MB flash, 50 kB RAM. One person in the LetsControlIt forum thread linked above explains the stock firmware can be updated over-the-air via a Raspberry Pi 3/3+ board using a project named Tuya-Convert. That looks fun already, …

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Sonoff S55 Waterproof WiFi Smart Sockets are Offered in Six Regional Variants

Sonoff S55

When WiFi smart sockets (aka smart plugs) started to appear a few years ago, they were often only available with either US or China plugs, and users from Europe, UK or other locales may have had to use an adapter instead. Since then, products that ship with multiple versions such as Sonoff S26 or Orvibo Wiwo S20 have launched in order to cater to more people around the world. ITEAD has now launched another WiFi smart socket, namely Sonoff S55, that’s designed to work outdoors thanks to IP55 ingress protection rating, and is offered in six different variants for Australia, Germany, France, the United States, South Africa, and the United Kingdom. Sonoff S55 specifications: Input/Output S55TPI(AU) – AC 100-240V 50/60Hz 10A Max S55TPF(DE) – AC 100-240V 50/60Hz 16A Max S55TPE(FR) – AC 100-240V 50/60Hz 16A Max S55TPB(US) – AC 125V 50/60Hz 10A Max S55TPD(ZA)- AC 100-240V 50/60Hz 10A Max S55TPG(UK) – AC 100-240V 50/60Hz 13A Max Connectivity – IEEE 802.11b/g/n …

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Vosen V1 S905X2 Android TV Box Doubles as a Home Gateway with IR Blaster and Z-Wave Support

Vosen V1 4K TV Box & Automation Gateway

At first look, Vosen V1 appears to be like any other 4K HDR Android TV box powered by Amlogic S905X2 quad-core Cortex-A53 processor, but it offers a bit more thanks to a built-in IR blaster allowing you to control other appliances in the room such as air conditioner, television, or A/V receiver. The box can be further enhanced by plugging-in a Z-Wave USB adapter to control & monitor even more compatible devices around the house such as light bulbs or water-leak sensors. Vosen V1 specifications: SoC – Amlogic S905X2 quad core Arm Cortex-A53 with Mali-G31 MP2  GPU System Memory – 2GB LPDDR4 RAM Storage – 16GB eMMC flash, microSD card slot up to 32GB Video & Audio Output – HDMI 2.1 output up to 4K @ 75 Hz with HDR, 3.5mm AV port (composite + stereo audio) Video Codecs –  VP9 Profile-2 up to 4K 60fps, 10-bit H.265/HEVC up to 4K 60fps, AVS2-P2 up to 4K 60fps, H.264/AVC  up to …

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Espressif ESP32-S2 Secure WiFi MCU Comes with an Xtensa LX7 Core @ 240 MHz

ESP32-S2

Espressif Systems has unveiled a new ESP32 WiFi MCU based on Cadence (previously Tensilica) Xtensa LX7 core instead of the usual Xtensa LX6 core(s). ESP32-S2 is powered by a single Xtensa LX7 core clocked at 240 MHz, supports Wi-Fi HT40 @ 2.4 GHz, and provides up to 43 GPIOs. Espressif ESP32-S2 specifications: CPU – Cadence Xtensa single-core 32-bit LX7 microcontroller @ up to 240 MHz, and ultra-low-power co-processor System Memory – 320 kB SRAM, external SPIRAM support up to 128 MB in total, 16 KB RTC memory Storage –  128 kB ROM, up to 1 GB of external flash support Connectivity Wi-Fi 802.11 b/g/n 1×1 transmit and receive with HT40 support with data rate up to 150 Mbps Support for TCP/IP networking, ESP-MESH networking, TLS 1.0, 1.1 and 1.2 and other networking protocols over Wi-Fi Support Time-of-Flight (TOF) measurements with normal Wi-Fi packets I/O & peripherals 43x programmable GPIOs 14x capacitive touch sensing IOs SPI, I2C, I2S, UART, ADC/DAC, and …

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Newyes SyncPen Bluetooth Pen Digitizes Your Handwriting to the Cloud (Crowdfunding)

Neweyes SyncPen

When I first found out about SERVO K07 bluetooth pen last month, I initially hoped it would allow users to digitize their handwriting or drawing and synchronize it to their phone or cloud, but it was not to be the case and instead it was just a 6-in-1 phone/pen/audio player/audio recording/camera/flashlight. But Newyes SyncPen does exactly that: it allows you to write on paper or a writing pad while digitizing your creation on the fly, and storing the result in the cloud. It works thanks to a tiny camera embedded in the pen capturing data at 200 fps. Newyes SyncPen hardware specifications: Connectivity – Bluetooth 4.2 Memory – 32MB, enough to store 800 pages of A5 paper content Pressure levels – 1024 Tiny camera @ 200+ fps Audio – Microphone Battery – 3.4V / 260 mAh Lithium Polymer battery good for about 8 hours; 1.5 hours charging time Dimensions – 16.35 x 1.33 ∅ cm Weight – 22 grams For …

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Allwinner MR133 Processor Targets Robot Vacuum Cleaners

Allwinner MR133

It’s been a while since I’ve seen a new processor from Allwinner, so today I got curious and visited the company website hoping to find maybe some news about the first Cortex-A7x processor from the company. But instead I found something else intriguing with the new Allwinner MR133 processor specifically designed for “SLAM/VSLAM intelligent robot sweeper solutions”. In other words, Allwinner has just launched a processor for robot vacuum cleaners… Allwinner MR133 key features and specifications: CPU – Quad-core Arm Cortex-A7 processor @ 1.8GHz with 32KB L1 I-cache + 32KB L1 D-cache per core, 512KB L2 cache, low-power CoolFlex power management architecture GPU – Arm Mali 400MP2 with support for OpenGL ES 2.0/1.1, Direct3D 11.1, OpenVG 1.1 Memory I/F – 32-bit DDR4/DDR3/DDR3L/LPDDR3/LPDDR4 Storage I/F – eMMC 5.0 flasj, compatible with eMMC 5.1, support Full Disk Encryption(FDE) 8-bit TLC/MLC/SLC/EF NAND flash, supports FDE LDPC/80-bit BCH/1024bytes Video Engine – H264 HP encoder 1080p @ 60fps, JPEG encoder up to 4096 x 4096 …

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