Sony announces Altair ALT1255 5G-ready NB-IoT chipset with 2G fallback

Sony ALT1255 NB-IoT

Sony Semiconductor Israel, previously known as Altair Semiconductor, has announced the launch of the Altair ALT1255 NB-IoT (NB2) chipset. The 5G-ready chip comes with an integrated SIM, a user MCU, and a GSM/GPRS fallback modem.

Sony Altair ALT1255 NB-IoT chipset specifications:

  • MCU core – Arm Cortex M4 MCU with 192KB RAM for user applications
  • Cellular connectivity
    • CAT-NB1 up to 27.2 Kbps DL, 62.5 Kbps UL
    • CAT-NB2 up to  127 Kbps DL, 158 Kbps UL
    • Carrier-grade integrated SIM (iSIM)
    • 3GPP Release 14 Features – eDRX, PSM, Relaxed monitoring, RAI (Release Assistance Indication), Large TBS, and Dual HARQ processes
    • “OneSKU” frequency range 617 – 960 MHz and 1695– 2200 MHz;
    • Frequency bands
      • HD-FDD bands – 1, 2, 3, 4, 5, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 66, 70, 71 and 85
      • Optional support for 410-467.5 MHz bands: 31, 72, 73, 87, 88
      • 2G quad-band support: GSM-850, E-GSM-900, DCS-1800, PCS-1900
  • Network protocols – IPV4/V6 IP stack, TLS/DTLS, HTTP(s), MQTT, COAP, LWM2M
  • I/Os -3xUART, SPI, PSRAM, USIM, GPIOs, I2C, AUX ADC, and PWM
  • Security – Secure boot architecture and hardware-based security framework
  • Supply Voltage – 2.2 to 4.5V from rechargeable Li-ion batteries
  • Low power consumption – The battery can typically last weeks for smart wearables, up to 3 years for trackers, and up to 15 years for smart meters.
  • Package – WLCSP package
  • Certification – Global Certification Forum (GCF) certification

The chip supports COAP protocol, LWM2M device management, differential firmware over-the-air (FOTA), and is compatible with the company’s earlier ALT1250 SW stack, AT commands, carrier features. 5G-ready simply means the chip will be compatible with 5G LPWA like most/all existing NB-IoT & eMTC solutions after a firmware upgrade.

Sony says Altair ALT1255 is especially well-suited to smart meters, logistics, vehicles, personal tracking devices, wearables, smart cities, utilities, digital signs, etc… Further information may be found on the product page and press release.

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