Debashis Das, Author at CNX Software - Embedded Systems News

January 12, 2026January 13, 2026 by Debashis Das - 10 Comments

LILYGO T-Beam 1W – An ESP32-S3 + SX1262 high-power LoRa dev board with 32 dBm output, GNSS support

The LILYGO T-Beam-1W is an ESP32-S3-based high-power LoRa development board featuring an SX1262 RF transceiver, an onboard 1W power amplifier (32 dBm), a L76K GNSS module, a 1.3-inch SH1106 OLED, a microSD slot, USB-C, Qwiic connectors, and an AXP2101 PMU. The board runs on a 7.4V battery and includes a cooling fan for high-power RF operation. We first wrote about the original LILYGO T-Beam (then branded as TTGO) in 2018, and since then, the company introduced various revisions of the T-Beam as it became popular. The T-Beam 1W is the most powerful version so far, with a built-in 1 Watt amplifier that allows the board to transmit data over longer distances without needing to buy separate, bulky amplifiers. LilyGO T-Beam-1W Specifications: Core module – Espressif Systems ESP32-S3-WROOM-1 SoC – ESP32-S3 CPU – Dual-core LX7 processor with up to 240MHz Memory – 512KB SRAM, 8MB PSRAM Storage – 384KB ROM Wireless – […]

January 11, 2026 by Debashis Das - 1 Comment

AMD Embedded+ mini-ITX Board features Ryzen AI Embedded P132 CPU, Versal AI Edge Gen2 VE3558 SoC FPGA

SAPPHIRE EDGE+ VPR 7P132, a Mini ITX AMD Embedded+

At CES 2026, Sapphire Technology introduced the EDGE+VPR-7P132, an “AMD Embedded+” Mini-ITX motherboard built around AMD’s newly announced Ryzen AI Embedded P100 series of SoCs, namely the hexa-core Ryzen P132 (V4526iX) CPU, and an AMD Versal AI Edge Gen 2 VE3558 SoC FPGA, which features octa-core Arm Cortex-A78AE + ten Cortex-R52 real-time cores beyond FPGA fabric. It’s the first AMD Ryzen AI Embedded motherboard we’ve seen. It represents a massive update from last year’s Edge+ VPR-5050 motherboard, which relied on Zen 2-based Ryzen Embedded V2000 series and first-generation Versal silicon. The new VPR-7P132 skips multiple generations, jumping straight to Zen 5 CPU cores and RDNA 3.5 graphics, with an upgraded Versal Gen 2 adaptive Edge AI SoC for real-time inference, along with faster LPDDR5 (4266MHz) memory and 40 Gbps USB4 connectivity. SapphireTech EDGE+ VPR-7P132-MB specifications: AMD Embedded+ Architecture Adaptive SoC Subsystem Adaptive SoC – AMD Versal AI Edge Gen 2 […]

January 9, 2026 by Debashis Das - 8 Comments

Home Assistant-compatible Makerfabs ESP32-S3-based energy meter features BL0942 energy metering IC

The Energy Meter for Home Assistant is an ESP32-S3-based single-phase energy monitoring and control module designed to work with Home Assistant via ESPHome. It measures real-time power and energy consumption and also has a remote on/off control. The device is built around the BL0942 calibration-free energy metering IC, which supports voltage, current, power, and energy measurements with less than 1% error. It operates directly from AC 100–240V, includes an onboard 15A relay for switching loads, and provides electrical isolation for safety. Connectivity is done through USB and Wi-Fi using ESPHome for easy firmware flashing, API encryption, and automatic discovery in Home Assistant. These features make it suitable for smart homes, DIY energy monitoring, smart sockets, home energy dashboards, and automation projects. Energy Meter for Home Assistant specifications: Core module – Espressif Systems ESP32-S3-WROOM-1 SoC – ESP32-S3 CPU – Dual-core Tensilica LX7 up to 240 MHz with vector extension for AI/ML workloads […]

January 9, 2026January 9, 2026 by Debashis Das - No Comments

SECO’s COM Express Type 6 module features Intel Core Ultra Series 3 Panther Lake-H processor with up to 180 TOPS

SECO SOM COMe BT6 PTL COM Express Type 6 module

We have just covered Vecow’s new TGS-2000 series of Edge AI computers built around Intel’s new Panther Lake-H SoCs, and now SECO has announced the SOM-COMe-BT6-PTL, a COM Express Type 6 Basic module which supports the higher-end 16-core Core Ultra X9 series processors and can deliver up to 180 TOPS of AI performance. The module follows the COM Express Release 3.1 Type 6 Basic form factor (125 × 95 mm), supports up to 128GB DDR5 memory via dual SO-DIMM slots, offers high-speed expansion through PCIe Gen4/Gen5, USB 4.0/Thunderbolt, and 2.5Gbps Ethernet, and provides multiple display interfaces including eDP, DP++, and HDMI. It is available with an optional industrial temperature range and is designed for rugged and mission-critical applications. SECO SOM-COMe-BT6-PTL Specifications: Panther Lake SoC (one or the other) Intel Core Ultra X9 388H – 16-core (4P + 8E + 4LPE) processor up to 1.6 GHz / 5.1 GHz (Turbo), 18MB cache, […]

January 9, 2026January 9, 2026 by Debashis Das - No Comments

Quectel SRG091X and SRG093X NXP i.MX 9 industrial AIoT modules integrates Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios

Quectel SRG091X and SRG093X NXP i.MX Smart AIoT module

After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT modules based on NXP’s i.MX 9 series SoCs. The module integrates Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios through the IW610G chipset, so it can simply be dropped into a PCB to create a fully compliant Matter Border Router without any RF design or coexistence concerns. While both modules share the same 46 x 41.5 mm form factor and wireless capabilities, they are different in terms of CPU power as the SRG091X is an entry-level solution built around a single-core NXP i.MX 91 processor, while the SRG093X features dual-core NXP i.MX 93 SoC, which includes a Cortex-M33 real-time core and a neural processing unit (NPU) for edge AI workloads. The module supports LPDDR4/LPDDR4X memory, eMMC storage, and various I/O options, including dual Gigabit Ethernet, USB 2.0, CAN-FD, SPI, UART, I²C/I³C, ADC, […]

January 8, 2026January 26, 2026 by Debashis Das - No Comments

Reolink Floodlight 4K Smart PoE and WiFi 6 security cameras add on-device LLM for natural language video search

Reolink has introduced the Elite Floodlight WiFi and Elite Pro Floodlight PoE, two new 4K security cameras with high-resolution video, integrated floodlights, PoE support (on the Pro model), and an on-device Large Language Model (LLM), which enables natural-language video search instead of basic object detection. We have reviewed various Reolink cameras over the years, such as the Argus PT Ultra, Reolink TrackMix PoE, and the RLC-810A, which features “Smart Detection” to the edge, allowing the camera to distinguish between people, vehicles, and pets without sending data to the cloud. However, they are limited to those fixed categories, and if you wanted to find something specific, like a “red shirt” or a “delivery truck,” you still had to scroll through the timeline manually, or rely on a networked video recorder (NVR). Reolink is now trying to solve that by integrating a Large Language Model (LLM) directly into their new Elite Floodlight […]

January 8, 2026January 9, 2026 by Debashis Das - No Comments

Intel Core Ultra Series 3 Panther Lake-H CPU powers TGS-2000 series stackable Edge AI computers

Vecow TGS 2000 Series Panther Lake Edge AI computers

At CES 2026, Intel unveiled the Core Ultra Series 3 processors, codenamed Panther Lake-H, built on the Intel 18A (1.8-nanometer class) process, and targeting both consumer and industrial applications. Vecow introduced one of the first industrial Panther Lake-H platforms with the TGS-2000 series, a new family of ultra-compact, stackable Edge AI computers designed for high-performance space-constrained applications and based on either the 16-core Intel Core Ultra 9 386H or 12-core Intel Core Ultra 5 336H SoC. This new 2000 series is an upgrade of the previous TGS-1000 series, which was launched in 2024 with Intel Meteor Lake processors. While the overall design stays mostly the same, the transition to Core Ultra Series 3 enhances AI performance, reaching up to 100 TOPS combined performance with the selected SKUs (note: the top-end Panther Lake-H CPU can deliver up to 180 TOPS). The TGS-2000 Series is available in three variants, including the fanless […]

January 7, 2026January 8, 2026 by Debashis Das - No Comments

Quectel SP895BD-AP AIoT module features Qualcomm Dragonwing Q-8750 SoC with 80 TOPS NPU

Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the SP895BD-AP smart AIoT module based on the Dragonwing Q-8750. It is designed for high-performance IoT applications, including video conferencing, 8K computing power boards, and smart retail terminals, running on Android 15 or Linux. Earlier in November, we saw Qualcomm introduce the Dragonwing IQ-X series of SoCs for industrial PCs running Windows. The Q-8750 in the Quectel SP895BD-AP seems to be a variant of the high-end version, with an 8-core Oryon CPU (up to 2x 4.32 GHz + 6x 3.53 GHz) and an Adreno Series 8 GPU. It supports 8K video encoding and decoding with three ISPs for up to 3×48MP camera inputs, or a single camera input of 108MP. The module comes in a compact LGA package and supports standard interfaces like MIPI DSI/CSI, PCIe, USB, I2S, UART, I²C, […]