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OnLogic Elkhart Lake fanless mini PC’s are made for IIoT applications

Onlogic Karbon 410 Elkhart-Lake fanless rugged mini pc

Intel Atom x6000E Series, Celeron and Pentium Elkhart Lake IoT Edge processors were introduced in September 2020, and we covered several Elkhart Lake modules and SBC’s. We’ve seen fewer full systems such as the Atom x6425RE based Vecow SPC-6000 Elkhart Lake mini PC for embedded & IoT applications. But OnLogic is more offering four more choices with Helix 300 and Karbon K400 Series of rugged fanless mini PCs, all equipped with Atom, Celeron, or Pentium Elkhart Lake processors, and designed for industrial IoT (IIoT) or Industry 4.0 applications Helix 300 Series Specifications The Helix 300 family is comprised of two models with Helix 310 and Helix 330 share most of the same specifications: SoC – Intel Celeron N6211 dual-core processor or Pentium J6425 quad-core processor System Memory – Up to 32 GB DDR4 RAM Storage – M.2 Storage Video Output – 3x DisplayPort for triple independent display setups Audio – […]

Rockchip RV1109 SBC’s provide access control solutions with optional 4G LTE connectivity

RV1109 SBC 4G Mini PCIe Slot

We’ve been writing about Rockchip RV1109 and RV1126 AI camera SoC’s in recent days, as well as evaluation boards and modules, plus some complete solutions such as Firefly dual-lens AI camera modules. Shenzhen-based JWIPC, a company specifically in embedded PCs and motherboards, has designed three SBC’s powered by Rockchip RV1109 processor especially designed for access control, leverage the face detection capabilities of the Rockchip processor. The three access control boards are: R19S – Standard 100x72mm Pico-ITX board with industrial grade materials, support for wide temperature, hardware watchdog, and “rich peripheral interface”. R19F- Same as R19S, but with a mini PCIe socket for a 4G LTE module, plus a SIM card slot R19N – Similar to R19S with a narrower 100x60mm design JWIPC R19 boards share most of the same hardware key features and specifications: SoC – Rockchip RV1109 dual-core Arm Cortex-A7 @ 1.5 GHz, plus RISC-V MCU @ 400 MHz, […]

4K AV1 Android TV dongles surface with Amlogic S905Y4 Cortex-A35 processor

S905Y4 Android TV Dongle

Amlogic S905X4 is a quad-core Cortex-A55 SoC for 4K TV boxes and set-top boxes with H.265, H.264, VP9, and AV1 hardware video decoding. The silicon vendor usually provides a lower cost version of the processor for dongles without Ethernet, but keeping most of the same features, as we’ve seen in the past with S905X2 and S905Y2 processors for instance. S905X4 has now its own cost-down version with S905Y4 for Android TV (certified) dongles relying on WiFi for connectivity, but instead of keeping Cortex-A55 cores, the processor features four low-power Cortex-A35 cores. We do not have the full details about S905Y4 processor just yet, but it has start to show in dongles from SEI Robotics and SDMC that appears idendical. SDMC DV6071Z / SEI Robotics  SEI450 TV dongle specifications: SoC – Amlogic S905Y4 quad-core 64-bit Arm Cortex-A35 processor with Mali-G31 MP2 GPU System Memory – 2GB DDR (4GB optional) Storage – […]

Firefly dual-lens AI camera module comes with Rockchip RV1109 or RV1126 processor

RV1126 dual-lens AI camera module

We’ve very recently written about Rockchip RV1126 quad-core Cortex-A7 processor designed AI cameras thanks to a 2.0 TOPS AI accelerator together with its little dual-core brother: RV1109. We’ve also found some RV1109 and RV1126 evaluation boards, but prices were in the hundreds of dollars. It was then brought to our attention than the upcoming MAIX-III board would feature RV1126 at a more affordable cost, but it turns out there’s no need to wait as Firefly has just launched a dual-lens AI camera module based on either Rockchip RV1109 or RV1126 for under $100 with respectively CAM-C1109S2U and CAM-C1126S2U models. Both version of the modules have the same specifications except for the processor: SoC (one or the other) RV1109 SoC with CPU – Dual-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz GPU – 2D graphics engine NPU – 1.2 TOPS with support for INT8/ INT16 VPU Encoder […]

Pipo W12 Arm Windows 10 Laptop finally launched for $422 and up

Pipo W12 Arm Windows 10 Laptop

Pipo showcased a Snadragon 850 powered 2-in-1 laptop in fall 2019, and said it expected it to sell for around $400. But it appears it took quite longer than expected to launch the Arm Windows 10 laptop, and only now can we see PiPo W12 laptop sold on Aliexpress for around $422 and up plus shipping. The 2-in-1 laptop comes with a 12.3-inch touchscreen display, 4GB or 8GB RAM, 256GB storage, as well as WiFi 5, Bluetooth 5.0, and 4G LTE connectivity. Pipo W12 specifications have changed a little bit since the first announcement, notably the display resolution, and we’ve got a few more details: SoC – Qualcomm Snapdragon 850 octa-core Kryo 385 Arm cores clocked @ up to 2.96 GHz with Adreno 630 Visual Processing Subsystem, Hexagon 685 DSP System Memory – 4GB or 8GB DDR4 RAM Storage – 256GB flash storage, MicroSD card slot Display – 12.3″ IPS […]

Rockchip RV1126 AI Camera SoC features 2.0 TOPS NPU, promises 250ms fast boot

RV1126 Block Diagram

The Rockchip Developer Conference that took place at the end of November 2020 allowed us to learn more about RK3588, RK3566, and RK3568 64-bit Arm processors for AIoT applications. But the company also presented additional details about camera SoC’s, namely the dual-core RV1109 and quad-core RV1126, equipped with a 1.2 TOPS and 2.0 TOPS respectively, and both capable of delivering a 250ms fast boot. Rockchip RV1109 and RV1126 share many of the same specifications: CPU RV1109 – Dual-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz RV1126 – Quad-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz GPU – 2D graphics engine NPU RV1109 – 1.2 TOPS with support for INT8/ INT16 RV1126 – 2.0 TOPS with support for INT8/ INT16 Memory – 32-bit DDR3/DDR3L/LPDDR2/LPDDR3/DDR4/LPDDR4 up to 4GB RAM Storage – eMMC 4.51, Serial SPI NOR Flash or NAND flash with fast booting support, […]

Android 10 ported to RISC-V board powered by Alibaba T-Head XuanTie C910 Processor

Android 10 RISC-V

RISC-V has made a lot of progress in just a few years, but for anything requiring 3D graphics acceleration, it’s not quite there yet. and we only expect RISC-V SoC with Imagination Technologies GPU to come out later this year on hardware such as BeagleV SBC. An OS that will definitely require 3D graphics acceleration is Android, and work has already started since T-Head, a business entity of Alibaba Group specializing in semiconductor chips, has already ported Android 10 (AOSP) on RISC-V architecture with support for graphics and the touchscreen display. The demo above runs on ICE EVB powered by a XuanTie C910 based high-performance SoC board developed by T-Head. Specifically, the ICE SoC integrates two XuanTie C910 cores (RV64) @ 1.2 GHz, one other XuanTie C910V core @ 1.2 GHz with vector extensions, a single-core 3D GPU core [Update: it’s a Vivante GC8000UL GPU], DDR4 memory support, a GMAC […]

Zora P1 Amlogic A311D Development Board interfaces with Orbbec 3D Cameras

Zora P1 Development Board

We have already seen the powerful Amlogic A311D powered Khadas VIM3 SBC, and Orbbec announced the Zora P1 development board for Orbbec 3D cameras, supporting robotics, gaming, smart homes, etc. Some of the other products showcased at the CES 2021 by Orbbec include its first 3D sensor with time-of-flight (TOF) technology, the latest Astra+ camera, and a real-time industrial 3D camera. “Innovations in 3D imaging, combined with broader advances like 5G, artificial intelligence, and ultra-fast processors, are transforming the application landscape for designers and engineers,” said David Chen, co-founder, and director of engineering at Orbbec. “Our new camera with time-of-flight (TOF) technology is a great example. Its high resolution and tracking capabilities make it perfect for all kinds of products including fall detection, security, even at-home yoga and exercise products.”  Orbbec’s Zora P1 Development Board Zora P1 is a processing board for developers and enthusiasts to integrate 3D imaging and associated computing tasks for demanding industrial applications. Orbbec has specially designed this long-lasting solution to work with its 3D […]

UP 7000 x86 SBC