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Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Vulkan 1.4 3D graphics and compute API released

Vulkan 1.4 3D graphics and compute API released

Vulkan 1.4

The Khronos Group has just announced the release of Vulkan 1.4 cross-platform 3D graphics and compute API. The new release makes some of the optional extensions and features mandatory, adds streaming transfers, and supports 8K rendering on up to eight targets. Minimum hardware limits have also been increased including at least seven maxBoundDescriptorSets and eight maxColorAttachments. Vulkan 1.4 highlights: Streaming Transfers: new implementation requirements to ensure applications can stream large quantities of data to a device while simultaneously rendering at full performance. Previously optional extensions and features critical to emerging high-performance applications are now mandatory in Vulkan 1.4, ensuring availability across multiple platforms. These include push descriptors, dynamic rendering local reads, and scalar block layouts. Maintenance extensions up to and including VK_KHR_maintenance6 are now part of the core Vulkan 1.4 specification. 8K rendering with up to eight separate render targets is now guaranteed to be supported, along with several other […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 4 Comments on AMD Versal Premium Gen2 SoC FPGA family features Arm Cortex-A72/R5F cores, high-end FPGA fabric, PCIe Gen6, CXL 3.1 interfaces

AMD Versal Premium Gen2 SoC FPGA family features Arm Cortex-A72/R5F cores, high-end FPGA fabric, PCIe Gen6, CXL 3.1 interfaces

AMD Versal Premium Series Gen 2 SoC FPGA combines dual-core Cortex-A72 and dual-core Cortex-R5F processors with high-end FPGA fabric with up to 3.2 million logic cells and CXL 3.1 (Compute Express Link), PCIe Gen6, and DDR5/LPDDR5X high-bandwidth interfaces for data center, communication equipment, test & measurement, and aerospace & defense data-intensive applications. AMD Versal Premium Gen2 specifications: CPU cores Dual-core Arm Cortex-A72 application core, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC Memory – 256MB on-chip with ECC FPGA fabric System Logic Cells – Up to 3,273,480 LUTs – Up to 1,496,448 DSP Engines – Up to 7,616 Interfaces connected to CPU cores 2x Ethernet 2x UART, 2x SPI, 2x I2C 2x CAN-FD 1x USB 2.0 FPGA memory, interfaces, I/Os, and transceivers Up to 327 Mbit memory @ 273 […]

Posted on by Sayantan Nandy - No Comments on Vecow EVS-3000 AI computing systems combine 14th Gen Intel Core CPUs and MXM Graphics for Edge AI applications

Vecow EVS-3000 AI computing systems combine 14th Gen Intel Core CPUs and MXM Graphics for Edge AI applications

EVS 3000

Vecow has introduced the EVS-3000 series, a new line of AI computing systems powered by Intel Core i9/i7/i5/i3 (14th Gen) processors with embedded MXM graphics. These systems deliver high computing power, come with multiple PCIe slots for expansion, and support remote monitoring making them ideal for edge AI applications such as autonomous robotics, public security, and machine vision. The EVS-3000 series includes both fan and fanless models: EVS-3100, EVS-3200, EVS-3300, EVS-3400 without fans, and EVS-3100(F), EVS-3200(F), EVS-3300(F), EVS-3400(F) with fans. All systems are powered by Intel R680E chipsets and feature compact NVIDIA or AMD MXM graphics, with support for 2.5GbE LAN, Out-of-Band (OOB) management, and multiple PCIe Gen 4 slots. These systems deliver high performance for AI computing at the edge for applications such as machine vision and robotics. As you may know, we’ve previously covered several Vecow AI computing systems, including the TGS-1000 Series, SPC-9000 fanless embedded system, ECX-3200, […]

Posted on by Debashis Das - 4 Comments on ASRock IMB-A8000 industrial Ryzen Embedded 8000 mini-ITX motherboard takes up to 96GB DDR5 RAM

ASRock IMB-A8000 industrial Ryzen Embedded 8000 mini-ITX motherboard takes up to 96GB DDR5 RAM

ASRockI MB A8000 Mini ITX Industrial Motherboard

ASRock Industrial recently launched the IMB-A8000, an industrial and embedded motherboard in a mini-ITX form factor. As an embedded motherboard, it is powered by AMD Ryzen Embedded 8000 series APU which features 8 cores and 16 threads, built with 4nm technology, and including a 16 TOPS AI accelerator. The motherboard supports up to 96GB of dual-channel DDR5-5600MHz memory and includes one 2.5GbE LAN port and one GbE LAN port. With a wide temperature range of -20ºC to 70ºC this motherboard can be used in applications like manufacturing, robotics, machine vision, and more. Previously we have seen SolidRun introduce the Bedrock R8000 industrial PC built around the Ryzen Embedded 8000 APU family. Other than that we have written about other Ryzen Embedded mini-ITX motherboards/SBCs such as the Flex Logic InferX Hawk combining an AMD Ryzen Embedded R2314 SoC with AI accelerators, the DFI RNO171 with Ryzen Embedded V2000 family, or more […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Linux 6.9 release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.9 release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.9 release

Linus Torvalds has just announced the release of Linux 6.9 on LKML: So Thorsten is still reporting a few regression fixes that haven’t made it to me yet, but none of them look big or worrisome enough to delay the release for another week. We’ll have to backport them when they get resolved and hit upstream. So 6.9 is now out, and last week has looked quite stable (and the whole release has felt pretty normal). Below is the shortlog for the last week, with the changes mostly being dominated by some driver updates (gpu and networking being the big ones, but “big” is still pretty small, and there’s various other driver noise in there too). Outside of drivers, it’s some filesystem fixes (bcachefs still stands out, but ksmbd shows up too), some late selftest fixes, and some core networking fixes. And I now have a more powerful arm64 machine […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on AMD Ryzen Embedded 8000 Series processors target industrial AI with 16 TOPS NPU

AMD Ryzen Embedded 8000 Series processors target industrial AI with 16 TOPS NPU

AMD Ryzen Embedded 8000

AMD has recently “announced” the Ryzen Embedded 8000 Series processors in a community post with the latest AMD embedded devices combining a 16 TOPS NPU based on the AMD XDNA architecture with CPU and GPU elements for a total of 39 TOPS designed for industrial artificial intelligence. The Ryzen Embedded 8000 CPUs will be found in machine vision, robotics, and industrial automation applications to enhance the quality control and inspection processes, enable real-time, route-planning decisions on-device for minimal latency, and predictive maintenance, and autonomous control of industrial processes. AMD Ryzen Embedded 8000 key features and shared specifications: CPU – Up to 8 “Zen 4” cores, 16 threads Cache L1 Instruction Cache – 32 KB, L1 Data Cache = 32 KB (per core) L2 Cache – Up to 8 MB (total) L3 Cache-  Up to 16 MB unified Graphics – RDNA 3 graphics with up to 6 WGPs (Work Group processors) […]

Posted on by Debashis Das - 4 Comments on SolidRun’s first COM Express module is powered by the AMD Ryzen V3000 series APU

SolidRun’s first COM Express module is powered by the AMD Ryzen V3000 series APU

AMD Ryzen COM Express with SO DIMM Sideways 1030x687

SolidRun has recently introduced the “Ryzen V3000 CX7” x86-based CoM Express 7 module powered by an AMD Ryzen V3000 Series V3C48 or V3C18I APU. This module is designed with AMD’s 6nm ‘Zen3’ architecture and can reach speeds up to 3.8GHz. It supports up to 96 GB of DDR5  memory, which can be either ECC or non-ECC, offering strong performance for different uses. The module features 20 PCIe Gen4 lanes, dual 10Gbps Ethernet MAC, and two SATA Gen3 6Gbps interfaces (on V3C18I and V3C48 models) all these features make this module useful for high-speed networking, embedded computing, and storage applications. Previously we have seen many similar COM Express & other modules based on the Ryzen V3000 Series of APUs including the ADLINK Express VR7 (COM Express) and another custom CPU module found in SolidRun Bedrock V3000 fanless industrial computer. Feel free to check those out if you are looking for similar […]

Posted on by Debashis Das - 1 Comment on Trenz Electronic TE0950-03-EGBE21A – An AMD Versal AI Edge VE2302 SoC FPGA evaluation board

Trenz Electronic TE0950-03-EGBE21A – An AMD Versal AI Edge VE2302 SoC FPGA evaluation board

AMD Versal AI Edge Evalboard with VE2302 SoC

Trenz Electronic recently announced the TE0950-03-EGBE21A an evaluation board with AMD Versal AI Edge XCVE2302-1LSESFVA784 SoC FPGA. This board features 8 GB of DDR4 SDRAM and 128 MB of SPI Flash (as the primary boot option), a microSD card slot, a 32 GB eMMC flash (secondary boot), and an EEPROM with a MAC address. Additionally, the board supports a range of VE-series devices, such as VE2002, VE2102, VE2202, VE2302, and VM1102, enhancing its application versatility. The AMD Versal is a family of adaptive compute acceleration platforms (ACAPs) designed by AMD. Following its acquisition of Xilinx, it integrates CPU, GPU, and FPGA technologies along with dedicated software support to create a highly flexible development environment. Trenz Electronic VE2302 Evaluation Board Specifications: SoC – AMD Versal AI Edge XCVE2302-1LSESFVA784, A784 package, compatible with multiple VE-series devices RAM – 8 GB DDR4 SDRAM Storage 128 MB SPI Flash (primary boot option) MicroSD card […]

EmbeddedTS embedded systems design