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March 15, 2025March 15, 2025 by Jean-Luc Aufranc (CNXSoft) - 18 Comments

10-cent WCH CH570/CH572 RISC-V MCU features 2.4GHz wireless, Bluetooth LE 5.0, USB 2.0

Patrick Yang, CTO at WCH, has recently unveiled the CH570 RISC-V SoC with 2.4GHz wireless and USB 2.0 (host & device) as an upgrade to the popular CH32V003 general-purpose RISC-V MCU with more features at the same low price (10 cents). CH570 also comes with 12KB SRAM and 256KB flash (vs 2KB SRAM and 16KB flash for the CH32V003), offers up to twelve GPIO, six PWM, I2C, UART, SPI, and a 20-channel key detection module. There’s also the CH572 with the same features, except it also supports Bluetooth LE 5.0. As a side note, I wrote about the CH572 RISC-V MCU with BLE in 2019, but I guess it was scraped likely because it had OTP instead of flash…, and the new CH572 (2025) is different. WCH CH570/CH572 specifications: CPU core QingKe 32-bit RISC-V3C core @ up to 100 MHz (RV32IMBC instruction set and custom instructions) Low-power 3-stage pipeline High-speed […]

March 14, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

UNIHIKER K10 low-cost TinyML education platform supports image detection and voice recognition

UNIHIKER K10 is a low-cost STEM education platform for TinyML applications that leverages the ESP32-S3 wireless microcontroller with vector extensions for workloads such as image detection or voice recognition. The UNIHIKER K10 also features a built-in 2.8-inch color display, a camera, a speaker, a 2-microphone array, a few sensors, a microSD card, and a BBC Micro:bit-like edge connector for power signals and GPIOs. It’s a cost-optimized version of its Linux-based big brother – the UNIHIKER M10 – first unveiled in 2022. Arnon also reviewed the UNIHIKER in 2023, showing how to configure it, use the SIoT platform with MQTT message, and program it with Jupyter Notebook, Python, or Visual Studio Code. Let’s have a closer look at the new ESP32-S3 variant. UNIHIKER K10 specifications: Core module – ESP32-S3-WROOM-1 MCU – ESP32-S3N16R8 dual-core Tensilica LX7 up to 240 MHz with 512KB SRAM, 8MB PSRAM, 16MB flash Wireless – WiFi 4 and […]

March 13, 2025March 13, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

Tiny Silicon Labs BG29 Bluetooth LE SoC measures just 2.8 x 2.6mm for wearables and sensors

Yesterday, we wrote about the world’s smallest microcontroller (TI MSPM0C1104), which measures just 1.38mm2 in its smallest package. However, it is designed for general-purpose applications without built-in wireless connectivity. If you need Bluetooth LE in a tiny form factor, Silicon Labs BG29 wireless SoC, with a 2.8x 2.6mm package, is worth a look. The BG29 features a Cortex-M33 core clocked at up to 76.8 MHz, up to 256KB SRAM, up to 1MB flash, various digital and analog peripherals, and security features that make it suitable for Bluetooth LE applications such as wearable health and medical devices, asset trackers, and battery-powered sensors. Silicon Labs BG29 (EFR32BG29) specifications: CPU core – Arm Cortex-M33 @ 76.8 MHz with DSP instruction and floating-point unit Memory – Up to 256 kB RAM data memory Storage – Up to 1 MB flash program memory Wireless – 2.4 GHz radio Protocols – Bluetooth 5.4 Low Energy (LE) […]

March 6, 2025 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

STMicro STM32WBA6 2.4 GHz wireless MCU gets up to 2MB flash, 512KB SRAM, USB OTG, and more

STMicro had two announcements yesterday. I’ve already covered the launch of the ultra-low-power STM32U3 microcontroller family, so today, I’ll check the new 100 MHz STM32WBA6 Cortex-M33 wireless MCU family with 2.4GHz radios for Bluetooth LE 6.0, Zigbee, Thread, and Matter designed for wearables, smart home devices, remote weather sensors, and more. The STM32WBA6 is an evolution of the STM32WBA family introduced last year, especially of the STM32WBA54 and STM32WBA55 with many of the same features SESIP (Security Evaluation Standard for IoT Platforms) Level 3 security certification, but gets more memory and flash with up to 512KB of SRAM and up to 2MB of flash. The new STM32WBA6 family also gains a High-Speed USB OTG interface and extra digital interfaces such as three SPI ports, four I2C ports, three USARTs, and one LPUART. STMicro STM32WBA6 key features and specifications: MCU core – Arm Cortex-M33 at 100MHz with FPU and DSP Memory […]

March 5, 2025March 5, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

LILYGO T-Connect Pro industrial IoT controller offers Ethernet, WiFi, Bluetooth, LoRa, RS232, RS485, and CAN Bus

LILYGO T-Connect-Pro ESP32-S3 LoRa Industrial Controller

LILYGO T-Connect Pro is a DIN rail-mountable, ESP32-S3-based industrial IoT controller with Ethernet, WiFi 4, Bluetooth 5.0 LE, and LoRa connectivity, as well as CAN Bus, RS232, and RS485 interfaces. The controller also features a 2.33-inch touchscreen display, a 10A relay, a 12V to 24V DC screw terminal for power, 5V USB-C port for programming, a Qwiic connector for expansion, and BOOT and Reset buttons. LILYGO T-Connect Pro specifications: SoC – Espressif ESP32-S3R8 CPU – Dual-core Tensilica LX7 microcontroller up to 240 MHz with vector instructions for AI acceleration Memory – 8MB PSRAM Wireless – WiFi 4 and Bluetooth 5.0 LE + Mesh connectivity Storage – 16MB SPI flash Display – 2.33-inch RGB display with 480×222 resolution via ST7796 SPI display controller with touchscreen using CST226SE chip Networking 10/100Mbps Ethernet RJ45 port via W5500 4-wire SPI controller WiFi 4 and Bluetooth 5.0 LE via ESP32-S3 LoRa via HPD16A Semtech SX1262 […]

February 5, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

Ceva-Waves Links200 IP supports Bluetooth LE High Data Throughput (HDT) up to 7.5 Mbps, 802.15.4 for Zigbee, Thread and Matter

Ceva has recently unveiled the Ceva-Waves Links200 multi-protocol platform IP with support for Bluetooth LE High Data Throughput (HDT) technology up to 7.5 Mbps and IEEE 802.15.4 for Zigbee, Thread, and Matter designed for TSMC’s low-power 12nm process. Released in 2016, Bluetooth 5 upgraded Low Energy implementation with four times the range and twice the speed of Bluetooth 4.0 LE transmission which meant up to 2 Mbps over BLE, and even the latest Bluetooth 6.0 specification does not change that. There’s just a new LE 2M 2BT physical layer for Bluetooth Channel Sounding. So I was intrigued when the press release of the Links200 further read: Addressing the rising market demand for faster, more efficient Bluetooth connectivity, particularly for low-power audio and latency-sensitive IoT applications, the breakthrough High Data Throughput mode more than doubles the speed of traditional Bluetooth, delivering a data rate of up to 7.5 Mbps. For this […]

January 31, 2025January 31, 2025 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Silicon Labs unveils low-cost BG22L BLE 5.4 and BG24L BLE 6.0 SoCs

Silicon Labs has unveiled the BG22L and BG24L SoCs for low-cost, ultra-low-power Bluetooth LE connectivity. These are Lite versions of the company’s BG22 and BG24 SoC families introduced in 2020 and 2022 respectively. The 38.4 MHz Silabs BG22L Arm Cortex-M33 SoC targets high-volume, cost-sensitive Bluetooth 5.4 applications like asset tracking tags and small appliances. In comparison, the 78 MHz BG24L Cortex-M33 SoC offers an affordable entry-level solution with AI/ML acceleration and Bluetooth 6.0 Channel Sounding to locate items or implement access control in crowded areas such as warehouses and multi-family housing. Since the specs for the BG22L and BG24L are similar to the ones for the BG22 and BG24 chips I won’t reproduce those here, and instead highlights the main features and cost-saving measures. Silicon Labs BG22L Bluetooth LE 5.4 SoC Silicon Labs BG22L highlights: MCU – Arm Cortex-M33 @ 38.4 MHz with DSP and FPU (BG22 is clocked at […]

January 13, 2025January 13, 2025 by Debashis Das - 3 Comments

Seeed Studio XIAO Plus series adds more GPIOs through castellated holes

In response to community feedback for more I/O options, Seeed Studio has recently launched the Seeed Studio XIAO Plus series with 23 castellated mounting pins (20 GPIOs, 3 power pins) and improved back solder points, improving compatibility with carrier boards for complex projects. The new series includes the XIAO ESP32S3 Plus, XIAO nRF52840 Plus, and XIAO nRF52840 Sense Plus which are direct upgrades of the XIAO ESP32S3, XIAO nRF52840 BLE, and XIAO nRF52840 Sense boards. The new design allows for easier assembly and scalable production, with double the I/O options. XIAO ESP32S3 Plus The Seeed Studio XIAO ESP32S3 Plus is a compact development board with a total of 23 pins on the board out of which 11 are through-hole GPIO pins 9 additional SMD castellations GPIO pins and 3 through-hole are power pins. The board is built around an ESP32-S3 MCU so it has 2.4GHz WiFi and BLE 5.0 connectivity. Other […]