ICP Germany has recently introduced the MiTAC ME1-8MD series family of compact, fanless Linux embedded systems powered by NXP i.MX 8M processor and designed to be used as IoT gateways, data acquisition and processing systems, and mini servers. Three models have been launched with a choice of dual or quad-core processors, up to 4GB LPDDR4 RAM, and 32GB eMMC flash storage. The embedded computers also come with up to two Ethernet ports, support up to two displays, and include an internal Raspberry Pi compatible 40 pin GPIO header. MiTAC ME1-8MD specifications and key features: SoC – NXP i.MX 8M Dual or Quad with two or four Cortex-A53 @ 1.3GHz, Cortex-M4 MCU, Vivante GC7000 Lite GPU, and 4K video processing unit System Memory – 1 to 4GB LPDDR4 800 Mhz RAM Storage – 8, 16, or 32GB eMMC flash, 1x MicroSD card slot up to 256GB Video Output HDMI 2.0 Optional DisplayPort 1.2 Audio – Realtek ALC5660 audio codec, but no […]
AMD Ryzen Embedded V2000 processors with up to eight Zen2 cores and faster Radeon graphics have been officially announced, and one of the first hardware platforms to take advantage of the new processor is ADLINK cExpress-AR COM Express Type 6 Compact computer-on-module suitable for demanding graphics-based applications such as medical ultrasound, image processing, 4K high-speed video encoding and streaming for broadcasting, embedded gaming, and infotainment. ADLINK cExpress-AR specifications: SoC AMD Ryzen Embedded V2516 hexa-core/12-thread processor @ 2.1 GHz / 3.95 GHz (Turbo) with 3MB L2 cache L2, 6 CUs Radeon RX Vega 6 GPU @ 1.5 GHz; TDP: 10-25 W AMD Ryzen Embedded V2546 hexa-core/12-thread processor @ 3.0 GHz / 3.95 GHz (turbo) with 3 MB L2 cache, 6 CUs Radeon RX Vega 6 GPU @ 1.5 GHz; TDP: 35-54 W AMD Ryzen Embedded V2718 octa-core/16-thread processor @ 1.7 GHz / 4.15 GHz (Turbo) with 4MB cache, 7CUs Radeon RX Vega 7 GPU @ 1.6 GHz; TDP: 10-25 W AMD […]
I’ve been interviewing Ed White, Manager of NXP’s Professional Support and Engineering Services, and Akshay Bhat, Director of Engineering, Security Solutions at Timesys by email to find out more about NXP Linux BSP development process, and how Timesys can help to keep it updated and secure with its Vigiles service. Q1. CNX Software readers recently discussed NXP Linux BSP update status. One person specifically noted Linux 4.14.98 used in the BSP was well over a year old, and there were various opinions about the topic, including one person suggesting NXP only provides a stable BSP and it was the ultimate responsibility of the customer to merge Linux security patchsets. Could you explain the typical development process for NXP Linux BSP, and why the company chose not to update the patchsets regularly? Answer: The kernel strategy for NXP’s i.MX family BSPs closely follows the annual cadence of kernel.org’s LTS kernel selection. As soon as kernel.org establishes the next official LTS kernel […]
We wrote about IoT devroom call for proposals for FOSDEM 2020 a little while ago, and as the free open-source developer meetup is getting closer, FOSDEM 2020 organizers released the schedule. So I’ll look at some of the talks in the relevant devrooms such as the Internet of Things, hardware enablement, Embedded, Mobile and Automotive, as well as RISC-V and others to compose my own little virtual schedule for the 2-day event. Saturday, February 1 10:30 – 10:50 – How lowRISC made its Ibex RISC-V CPU core faster – Using open source tools to improve an open-source core – by Greg Chadwick Ibex implements RISC-V 32-bit I/E MC M-Mode, U-Mode, and PMP. It uses an in-order 2 stage pipe and is best suited for area and power-sensitive rather than high-performance applications. However, there is scope for meaningful performance gains without major impact to power or area. This talk describes work done at lowRISC to analyze and improve the performance of […]
MYiR Tech Limited (aka MYiR) has launched a new NXP i.MX 8 CPU module – MYC-JX8MX – powered by NXP i.MX 8M processor, as well as the corresponding MYD-JX8MX development kit. The module integrates up to 2GB LPDDR4 RAM, 8GB eMMC flash, 256Mbit QSPI Flash, Gigabit Ethernet PHY & PMIC onboard, and I/O signals are accessible from a 314-pin MXM 3.0 expansion connector. Typical applications for the company’s latest system-on-module include scanning/imaging solutions, building automation and smart home, human-machine interface (HMI), machine vision or other consumer and industrial applications requiring multimedia capabilities. MYC-JX8MX CPU Module Specifications: SoC – NXP i.MX 8M quad-core Arm Cortex-A53 processor @ 1.3GHz, Arm Cortex-M4 real-time core @ 266MHz, 2D and 3D GPU System Memory – 1GB or 2 GB LPDDR4 (supports up to 4GB LPDDR4) Storage – 8GB eMMC Flash (supports up to 64GB), 256Mbit QSPI Flash 314-pin MXM 3.0 edge connector with: 1x Gigabit Ethernet 3x Serial ports 3 x I2C, 2x SPI, 4x […]
Rockchip RK3308 is a quad-core Cortex-A35 processor that was announced in 2018 together with RK3326 specifically for Smart AI solutions. While the processor is equipped with an RGB LCD output interface, it does not come with a 2D or 3D graphics accelerator, so it’s better suited to smart speakers with an optional display using a basic user interface. I’ve not seen many hardware platforms or boards based on the processor, but today I noticed “Hangzhou Wild Chip Tech” had an RK3308 system-on-module, as well as development kits for sale on Aliexpress with the module price starting at $23. Mcuzone MDK3308 Coreboard Specifications: SoC – Rockchip RK3308 quad-core Cortex-A35 processor @ 1.3 GHz with NEON and VFPv4 FPU System memory / storage configurations: 256MB DDR3/3L + 256MB NAND flash 512MB DDR3/3L + 8GB eMMC flash 2x 100-pin dual row headers (1.27mm pitch) exposing: Display – LCD interface up to 1024×600 (RGB), up to 1280×720 (LVDS) Networking – 10/100M Ethernet (apparently multiplexed […]
Inforce Computing has launched yet another Snapdragon-based single board computer with their Inforce 6560 SBC powered by Qualcomm Snapdragon 660 processor with stereoscopic depth sensing and deep learning capabilities made possible thanks to three MIPI camera connectors. The board also comes with to 3GB LPDDR4 RAM, 32GB flash, HDMI and MIPI DSI video outputs, Gigabit Ethernet, a wireless module, USB ports, sensors, and more. Inforce 6560 specifications: SoC – Qualcomm Snapdragon 660 (SDA660) with 8x Kryo ARMv8 compliant 64-bit CPUs arranged in two dual-clusters, running at 2.2GHz (Gold) and 1.8GHz (Silver) each, Adreno 512 GPU, Hexagon 680 DSP with dual-Hexagon vector processor (HVX-512) @ 787MHz for low-power audio and computer vision processing, Spectra 160 camera (dual) Image Signal Processors (ISPs) System Memory – 3GB onboard LPDDR4 RAM Storage – 32GB eMMC flash, 1x µSD card v3.0 socket Video Output / Display Interface HDMI V1.3a FullHD @ 60fps port 4-lane MIPI-DSI with FullHD+ capability UltraHD (4K) display on USB-C port Audio – […]
Intrinsyc is known for manufacturing and selling mobile development platforms (MDP) & hardware development kits (HDK) for Qualcomm Snapdragon processors, but this time the company is taking pre-orders for a slightly different Qualcomm development platform: Qualcomm Flight Pro development kit / reference design that targets the development of high-end drones and robotics projects. Qualcomm Flight Pro board specifications: SoC – Qualcomm Snapdragon 820 (APQ8096) with quad core Kryo processor @ up to 2.15GHz, Adreno 530 GPU, and Hexagon 680 DSP System Memory – 4GB LPDDR4 RAM Storage – 32GB UFS Flash storage, microSD card slot Wireless Connectivity – WiFi 5 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.2 via pre-certified QCA6174A module + 2x Wi-Fi/BT antennas Location Technology Integrated GNSS solution based on WGR7640 (not recommended for flight applications) Support for U-blox MAX-M8Q-0-00 external GNSS module with high performance antenna and shielding Sensors – Dual IMU (2x Invensense MPU9250): Gyroscope, Accelerometer, Compass + Barometric pressure sensor (Bosch BMP280) Cameras […]
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