Panthronics PTX30W is a 1W NFC wireless charging listener IC

PTX30W NFC Wireless Charging Chip

Panthronics PTX30W is an NFC wireless charging listener chip that can receive up to 1W as per the NFC Wireless Charging (WLC) specification unveiled in 2020 and integrates a power management unit and a Li-Ion battery charger. Offered in a compact 3.2mm2 (1.78 x 1.78 mm) WL-CSP package, the PTX30W will enable small battery-powered products, such as smartwatches and other wearables, to be charged over NFC. The chip can operate in standalone mode or connected to a host microcontroller, and the company claims it is around four times smaller than existing designs based on multiple discrete components. PTX30W features and specifications: Integrated NFC Wireless Charging Listener device Efficient Active Rectifier RF interface according to Forum Type 2 Tag Li-Ion battery charger with charging current from 5mA to 250mA MCU LDO with 1.8V or 3.3V output, up to 50mA Embedded power negotiation logic High-efficiency NFC wireless charging listener IC with up […]

Sub-$5 Cavli C16QS CAT1.bis cellular IoT module features Qualcomm QCX216 modem

Cavli C16QS Cat 1.bis module

Qualcomm QCX216 LTE IoT modem was announced at the end of last year as one of the first solutions supporting the new CAT1.bis standard enabling smaller, simpler, and cheaper modules with a single antenna design. This chip also integrates a WiFi scanner exclusively used for indoor positioning. Cavli Wireless C16QS CAT1.bis is one of the first cellular IoT modules based on the Qualcomm QCX216, and we now have a clearer idea of what “cheaper” means since the company says it will sell those for less than $5 to OEMs, although that price is likely in very high quantities, possibly 100k+ or one million pieces. Cavli C16QS specifications: Wireless IC – Qualcomm QCX216 with dual-core Cortex-M3 @ 204 MHz, cellular modem-RF Storage – 4 MB Cellular connectivity LTE CAT 1.bis based on 3GPP Release 14 Peak speeds – 10Mbps (DL), 5Mbps (UL) Bands EMEA: B1/B3/B5/B8/B20 North America : B2/B4/B12/B13/B66/B71 Integrated eSIM […]

Qualcomm Snapdragon Satellite enables two-way messaging using the Iridium network

Snapdragon Satellite

You may soon be able to get true global coverage even in remote areas thanks to Qualcomm Snapdragon Satellite which will offer pole-to-pole coverage and two-way messaging for emergency use, SMS texting, and other messaging applications. Qualcomm made this possible through a partnership with Iridium to bring satellite-based connectivity to next-generation premium Android smartphones starting with devices based on Snapdragon 8 Gen 2 Mobile Platform, while emergency messaging support was done in collaboration with Garmin. You’ll just need to point your phone to the sky to send and/or receive messages, and the connection should take place within a few seconds. Note it can only be used for text, and the bandwitdh would not be sufficient for audio, pictures, and videos. The solution relies on Snapdragon 5G Modem-RF Systems such as the Snapdragon X70 modem to connect to the Iridium low-earth orbit satellite constellation using the L-band spectrum (1 to 2 […]

Espressif ESP32-P4 – A 400 MHz general-purpose dual-core RISC-V microcontroller

ESP32-P4

Espressif ESP32-P4 is a general-purpose dual-core RISC-V microcontroller clocked at up to 400 MHz with AI instructions extension, numerous I/Os, and security features. It also happens to be the first microcontroller from Espressif Systems without wireless connectivity, and as such, it should probably be seen as an alternative to STM32F7/H7 or NXP i.RT Arm Cortex-M7 microcontrollers/crossover processors, and likely offered at a significantly lower cost. It should also offer lower power consumption than other ESP32 chips thanks in part to a third RISC-V core clocked at 40 MHz that can keep the system running while the other two high-performance cores are down. ESP32-P4 key features and specifications: MCU subsystems Dual-core RISC-V HP (High-performance) CPU @ up to 400 MHz with AI instructions extension and single-precision FPU, 768KB of on-chip SRAM Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz with 8KB of zero-wait TCM RAM Memory & Storage I/F […]

Orbbec Femto Mega 3D depth and 4K RGB camera features NVIDIA Jetson Nano, Microsoft ToF technology

Femto Mega 3D camera

Orbbec Femto Mega is a programmable multi-mode 3D depth and RGB camera based on NVIDIA Jetson Nano system-on-module and based on Microsoft ToF technology found in Hololens and Azure Kinect DevKit. As an upgrade of the earlier Orbbec Femto, the camera is equipped with a 1MP depth camera with a 120 degrees field of view and a range of 0.25m to 5.5m as well as a 4K RGB camera, and enables real-time streaming of processed images over Ethernet or USB. Orbbec Femto Mega specifications: SoM – NVIDIA Jetson Nano system-on-module Cameras 1MP depth camera Precision: ≤17mm Accuracy: < 11 mm + 0.1% distance NFoV unbinned & binned:H 75°V 65° WFoV unbinned & binned:H 120°V 120° Resolutions & framerates NFoV unbinned: 640×576 @ 5/15/25/30fps NFoV binned: 320×288 @ 5/15/25/30fps WFoV unbinned: 1024×1024 @ 5/15fps NFoV binned: 512×512 @ 5/15/25/30fps 4K RGB camera FOV – H: 80°, V: 51°b D: 89°±2° Resolutions […]

NXP i.MX 95 processor features Cortex-A55, Cortex-M33, and Cortex-M7 cores, eIQ Neutron NPU

NXP i.MX 95 CPU

NXP i.MX 95 is an upcoming Arm processor family for automotive, industrial, and IoT applications with up to six Cortex-A55 application cores, a Cortex-M33 safety core, a Cortex-M7 real-time core, and NXP eIQ Neutron Neural Network Accelerator (NPU). We’re just only starting to see NXP i.MX 93 modules from companies like iWave Systems and Forlinx, but NXP is already working on its second i.MX 9 processor family with the i.MX 95 application processor family equipped with a higher number of Cortex-A55 cores, an Arm Mali 3D GPU, NXP SafeAssure functional safety, 10GbE, support for TSN, and the company’s eIQ Neutron Neural Processing Unit (NPU) to enable machine learning applications. NXP i.MX 95 specifications: CPU Up to 6x Arm Cortex-A55 cores with 32KB I-cache, 32KB D-cache, 64KB L2 cache, 512KB L3 cache with ECC 1x Arm Corex-M7 real-time core with 32KB I-cache, 32KB D-cache, 512KB TCM with ECC 1x Arm Cortex-M33 […]

ASRock NUC 1300 BOX/ NUCS 1300 BOX mini PCs are powered by Intel Raptor Lake-P mobile processors

ASRock Raptor Lake-P mini PC

ASRock Industrial NUC 1300 BOX and NUCS 1300 BOX series mini PCs are equipped with Intel 13th generation Raptor Lake-P mobile processors up to the Core i7-1360P 12-core hybrid processor with four Performance cores and eight Efficiency cores. Yesterday, we wrote about the ADLINK Express-RLP COM Express module based on Raptor Lake-P embedded or industrial processors, but ASRock decided to use Raptor Lake-P mobile processors in their industrial “fanned embedded box PCs” coupled with up to 64GB DDR5/DDR4 memory, and featuring high-speed interfaces such as USB4, 2.5GbE, and more. NUCS 1300 BOX Series Two NUCS 1300 Box models are available with either an Intel Core i7-1360P or i5-1340P processor. NUCS 1300 Box specifications: Raptor Lake-P SoC NUCS BOX-1340P/D4 – Intel Core i5-1340P 12-core (4P @ 1.9/4.6 GHz + 8E @ 1.4/3.4 GHz) processor with 80EU Intel Iris Xe Graphics; PBP:  28W, MTP: 64W NUC BOX-1360P/D4 – Intel Core i7-1360P 12-core […]

Meet Intel Processor and Core-i3 N-series “Alder Lake N-series” processors

Intel Alder Lake N-series Processors

Pentium and Celeron brands are officially dead with Intel introducing the Alder Lake-N family comprised of “Intel Processor” and Core-i3 N-series processors based on the Gracemont “Efficiency” cores found in Alder Lake hybrid processors. Some of the details about the Intel Processor N100 and N200 processors were leaked last fall, followed by the Core i3-N300 and Core i3-N305, but at least it is now official, and we have more details so let’s dig into it. Alder Lake N-series key features and specifications: CPU – Up to 8x Gracemont Efficient cores for Core i3 N-series processor, and up to 4x with Intel Processor processor GPU – Intel UHD graphics with AV1 decode support Memory I/F – LPDDR5-4800, DDR4, DDR5 Storage I/F – eMMC/UFS 2.1 flash, 2x SATA 3.0 Video Output eDP 1.4b / MIPI DSI 1.3 DisplayPort 1.4 HDMI 2.0b Up to 3x independent displays Camera I/F – MIPI CSI Networking […]

UP 7000 x86 SBC