ADLINK unveils Intel Atom x7000RE & x7000C Amston Lake COM Express and SMARC 2.1 modules

Intel Amston Lake COM Express module

ADLINK has released two Intel Atom X7000RE & x7000C Amston Lake-powered modules with the cExpress-ASL COM Express Type 6 Compact module and the LEC-ASL SMARC 2.1 system-on-module both offered with up to 16GB LPDDR5 soldered-down memory and 2.5GbE networking. The modules are designed for high-performance, low-power, and ruggedized edge solutions running 24/7, and with support for Intel TCC and Time Sensitive Networking (TSN), the modules are also suitable for hard-real-time computing workloads required by use cases such as industrial automation, AI robots, smart retail, transportation, network communication, and more. Intel Atom x7000RE and x7000C Amston Lake processors The announcement came as a surprise because I had never heard about Intel Amston Lake processors so far. It might be because they were just announced and all seven SKUs are embedded parts with two to eight cores, and as a result, they may not quite get as much coverage as consumer processors. […]

SolidRun’s first COM Express module is powered by the AMD Ryzen V3000 series APU

AMD Ryzen COM Express with SO DIMM Sideways 1030x687

SolidRun has recently introduced the “Ryzen V3000 CX7” x86-based CoM Express 7 module powered by an AMD Ryzen V3000 Series V3C48 or V3C18I APU. This module is designed with AMD’s 6nm ‘Zen3’ architecture and can reach speeds up to 3.8GHz. It supports up to 96 GB of DDR5  memory, which can be either ECC or non-ECC, offering strong performance for different uses. The module features 20 PCIe Gen4 lanes, dual 10Gbps Ethernet MAC, and two SATA Gen3 6Gbps interfaces (on V3C18I and V3C48 models) all these features make this module useful for high-speed networking, embedded computing, and storage applications. Previously we have seen many similar COM Express & other modules based on the Ryzen V3000 Series of APUs including the ADLINK Express VR7 (COM Express) and another custom CPU module found in SolidRun Bedrock V3000 fanless industrial computer. Feel free to check those out if you are looking for similar […]

AAEON COM-RAPC6 and COM-ADNC6 COM Express modules feature Raptor Lake and Alder Lake-N CPUs

AAEON COM-ADNC6 Alder Lake-N COM Express module

AAEON has unveiled two COM Express Type 6 Compact Computer-on-Module families with the COM-RAPC6 designed for high performance with 13th generation Raptor Lake processors from the 15W Intel Processor U300E up to 45W Intel Core i7 SKUs, and the COM-ADNC6 optimized for efficiency with Alder Lake-N processors such as the Intel Core i3-N305 or Atom x7425E CPUs. COM-RAPC6 Raptor Lake COM Express CPU modules Specifications: 13th gen Raptor Lake SoC (one or the other) – Note frequencies shown as base frequencies Intel Core i7-13800HRE 14C/20T processor @ 2.5GHz with Intel Iris Xe Graphics; PBP: 45W Intel Core i7-13800HE 14C/20T processor @ 2.5GHz with Intel Iris Xe Graphics; PBP: 45W Intel Core i5-13600HE 12C/16T processor @ 2.7GHz with Intel UHD Graphics; PBP: 45W Intel Core i3-13300HE 8C/12T processor @ 2.1GHz with Intel UHD Graphics; PBP: 45W Intel Core i7-1370PE 14C/20T processor @ 1.9GHz with Intel UHD Graphics; PBP: 28W Intel Core […]

Avnet MSC C10M-ALN – A COM Express Type 10 Mini Module with Intel Alder Lake-N CPU, LPDDR5 memory

MSC C10M ALN COM Express Type 10 Module

Avnet MSC C10M-ALN is a COM Express Type 10 module powered by the Alder Lake-N family of processors including the Intel Core i3, Intel Atom x7000E, and Intel Processor N-Series. The design allows for easy adaptation of applications between various Intel CPU models, ensuring compatibility across different performance and power needs. The module supports up to 16GB LPDDR5 memory with optional In-Band Error Correcting Code(IBECC), eMMC 5.1 storage, and features an Intel i226 2.5GbE controller. It can handle up to two 4K displays through DDI and eDP video outputs, ten USB ports including USB 3.2 Gen 2, and four PCI Express Gen 3 x1 slots for expanded connectivity options. Avnet MSC C10M-ALN Com Express Module Specification: Alder Lake-N SoC (one or the other) Intel Core i3-N305, eight-core, 1.0GHz/1.8GHz, 32EU Intel UHD Graphics, 9/15W, PUC (PC Client Use Conditions) Intel Atom x7425E, four-core, 1.5GHz, 24EU Intel UHD Graphics, TCC, 12W, EUC […]

DFI MTH968 Intel Core Ultra “Meteor Lake” COM Express module to power industrial AI PCs

Intel Core Ultra Meteor Lake COM Express

DFI MTH968 is a COM Express Compact Type 6 computer-on-module equipped with an Intel Core Ultra Meteor Lake processor designed for industrial AI PCs thanks to the integrated Neural Processor Unit (Intel AI Boost) and designed for industrial automation, smart transportation, and smart agriculture. It’s not quite the first COM Express module based on the new Core Ultra Meteor Lake SoCs, as we previously covered the ADLINK cExpress-MTL and conga-TC700 with a similar range of features, and the MTH968 provides another alternative with the company highlighting a fanless wide temperature design operating from -40°C to 85°C, DDR5 memory, and NVMe SSD storage (soldered on module). DFI MTH968 specifications: Meteor Lake U/H-series SoC (one or the other) Intel Core Ultra 7 165H 16-core (6P+8E+2LPE) processor @ 0.9 / 1.4 / 5.0 GHz (Turbo) with 24MB cache, 8x Xe-cores Intel Arc graphics @ 2.3 GHz, Intel AI Boost NPU; TDP: 28W Intel […]

The PCOM-B65A COM Express module is powered by Intel Core Ultra Processors

PCOM B65A front

Taiwan-based embedded systems manufacturer, Portwell, has announced a new COM Express Type 6 Basic module based on the Intel Core Ultra processor platform. The Portwell PCOM-B65A module is a minimal COM Express module that comes with either one of the H-series or U-series processors in the Core Ultra series. The Intel Core Ultra series (formerly known as Meteor Lake) uses Intel’s 3D performance hybrid architecture (two core microarchitectures on a chip) to optimize performance and distribute workloads efficiently. It also features an integrated neural processing unit that offers low-power AI acceleration and hardware offloading.The I/O and artificial intelligence feature set on the PCOM-B65A COM Express module suits several embedded applications such as medical devices, automation, IoT, and industrial control. We have already covered other products based on the newly released 14th Gen Intel Core Ultra (Meteor Lake) series with the ADLINK’s cExpress-MTL Type 6 Compact module and the ASRock Industrial’s […]

AAEON COM-R2KC6 – A COM Express Module featuring the AMD Ryzen Embedded R2000 Series

AAEON COM-R2KC6 front

AAEON, a Taiwan-based hardware manufacturer, has released the COM-R2KC6, a new COM Express module in the Type 6 compact form factor. This computer-on-module board is the first COM Express module to feature AMD’s mid-range processor series, the Ryzen Embedded R2000 series. The R2KC6 will be sold with an R2000 CPU, with TDP ranging from 15W to 45W and up to 4 cores and 8 threads (4C/8T). The R2000 SoCs provide up to two times the I/O connectivity and CPU core count of their R-series predecessors. Relatedly, ADLINK recently announced a COM Express Type 7 module based on AMD’s Ryzen Embedded V3000 processor. The COM-R2KC6 supports four simultaneous 4K displays through an embedded DisplayPort (eDP) connector and three Digital Display Interface (DDI) connectors. This means the integrated AMD Radeon Vega 8 graphics card can be used to its maximum potential. Additional graphics support is available through the board’s PEG x4 slot. […]

Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec has recently announced Six new COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core(Raptor Lake) processors. The module comes with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W.

We’ve noticed a surge in the popularity of COM Express modules and Congatec has recently announced six new conga-TC675r COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core (Raptor Lake) processors that happen to come with soldered RAM instead of the usual SO-DIMM memory slots found in this form factor. The modules come with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W. According to Congatec, this device is designed to work under extreme temperatures (-40°C to +85°C), and is built to withstand the highest standards for shock and vibrations notably thanks to the user of soldered onboard RAM, making this device suitable for off-road vehicles for mining, construction, agriculture, forestry, and other demanding mobility applications. Previously we have seen manufacturers like ADLINK announce COM Express modules based on the 13th Gen architecture, and both ADLINK and Congatec have also just […]

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