Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec has recently announced Six new COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core(Raptor Lake) processors. The module comes with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W.

We’ve noticed a surge in the popularity of COM Express modules and Congatec has recently announced six new conga-TC675r COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core (Raptor Lake) processors that happen to come with soldered RAM instead of the usual SO-DIMM memory slots found in this form factor. The modules come with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W. According to Congatec, this device is designed to work under extreme temperatures (-40°C to +85°C), and is built to withstand the highest standards for shock and vibrations notably thanks to the user of soldered onboard RAM, making this device suitable for off-road vehicles for mining, construction, agriculture, forestry, and other demanding mobility applications. Previously we have seen manufacturers like ADLINK announce COM Express modules based on the 13th Gen architecture, and both ADLINK and Congatec have also just […]

COM Express Type 6 Compact module features 14th gen Intel Core Ultra “Meteor Lake” processor

Intel Core Ultra COM Express

ADLINK cExpress-MTL is a COM Express Type 6 Compact module based on the just-announced 14th gen Intel Core Ultra “Meteor Lake” processor family with up to fourteen CPU cores in 6P+8E configuration, eight Xe-cores (128 EUs), and an NPU (11pTOPS/8.2eTOPS) in a 15 or 28W TDP thermal configuration delivering up to 1.9x the GPU performance of the previous generation (Raptor Lake). The power consumption will also be lower thanks to Intel Core Ultra’s new Low-Power E-cores that are 30 to 50% more efficient than the E-cores in 13th gen Intel Core processors, and the faster GPU and built-in NPU will enable hardware-accelerated AV1 encoding/decoding and various devices leveraging AI such as portable medical ultrasound devices, industrial automation, autonomous driving, AI robots, and more. cExpress-MTL specifications: Meteor Lake-H/U SoC (one of the other) Intel Core Ultra 7 MS3 165H 16-core (6P+8E+2LPE) processor @ 1.4 / 5.0 GHz with 24MB cache, Intel […]

AMD Ryzen Embedded V3000 COM Express Type 7 module supports up to 64GB DDR5 memory

AMD Ryzen V3000 COM Express Module

ADLINK Express VR7 is a COM Express Basic size Type 7 computer-on-module powered by the eight-core AMD Ryzen Embedded V3000 processor with two 10GbE interfaces, fourteen PCIe Gen 4 lanes, and optional support for the “extreme temperature range” between -40°C and 85°C. The COM Express module supports up to 64GB dual-channel DDR5 SO-DIMM  (ECC/non-ECC) memory and targets headless embedded applications such as edge networking equipment, 5G infrastructure at the edge, video storage analytics, intelligent surveillance, industrial automation and control, and rugged edge servers. Express-VR7 specifications: SoC – AMD Embedded Ryzen V3000 (one or the other Ryzen V3C48 8-core/16-thread processor @ 3.3/3.8GHz; TDP: 45W Ryzen V3C44 4-core/8-thread processor @ 3.5/3.8GHz; TDP: 45W Ryzen V3C18I 8-core/16-thread processor 1.9/3.8GHz; TDP: 15W (useful in the extreme temperature range) Ryzen V3C16 6-core/12-thread processor 2.0/3.8GHz; TDP: 15W Ryzen V3C14 4-core/8-thread processor 2.3/3.8GHz; TDP: 15W System Memory – Up to 64GB (2x 32GB) dual-channel ECC/non-ECC DDR5 memory […]

COM Express development kit ships with Intel Core i3-13300HE or Core i5-13600HE Raptor Lake-P processor

COM Express Raptor Lake development kit

ADLINK has launched an “IoT prototyping kit” based on the company’s Express-RLP COM Express Type 6 module with either an Intel Core i3-13300HE or Core i5-13600HE Raptor Lake-P processor. The module supports up to 64GB DDR5 and the ATX carrier board offers a wide range of interfaces such as 2.5GbE, two SATA ports, DisplayPort, LVDS (or EDP), and VGA video outputs, two USB4 ports, and more. COM Express Type 6 Raptor Lake-P devkit specifications: System-on-Module – ADLINK Express-RLP COM Express Type 6 computer-on-module Raptor Lake-P SoC Intel Core i5-13600HE 4P+8E cores/16 threads processor @ up to 2.7 GHz with 18MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W) Intel Core i3-13300HE 4P+4E cores/12 threads processor @ up to 2.1 GHz with 12MB cache, Intel UHD graphics; TDP: 45W (cTDP: 35W) System Memory – Up to 64GB (2x 32GB) DDR5 via SO-DIMM sockets Dimensions – 125 x 95 mm (PICMG […]

Selecting Raptor Lake COM-HPC or COM Express modules for your application (Sponsored)

COM Express vs COM HPC Raptor Lake modules

ADLINK Technology introduced the COM-HPC-cRLS (Raptor Lake-S) COM-HPC size C module and Express-RLP Raptor Lake-P COM Express Type 6 module at the beginning of the year, and while we covered the specifications for both in detail at the time of the announcement, we’ll compare the advantages and benefits of the two types of 13th generation Raptor Lake modules in this post and compare 12th gen Alder Lake-S and 13th Gen Raptor Lake-S processor performance to help potential buyers select the right one for their applications. Raptor Lake COM-HPC vs COM Express vs modules The table above provides a high-level comparison between the COM-HPC-cRLS (Raptor Lake-S) and the Express-RLP (Raptor Lake-P) modules. The Raptor Lake-S socketed processor family found in the COM-HPC provides more processing power, supports up to 128GB DDR5, and the COM-HPC standard adds support for PCIe Gen5 which is not possible with the COM Express standard. The Raptor […]

IoT Prototype Kit is powered by an Alder Lake-H COM Express module with up to Core i5-12600HE CPU

IoT Prototype Kit Intel Alder Lake-P module

ADLINK has launched an IP-i IoT Prototype Kit based on their Express-ADP COM Express Type 6 Basic “Alder Lake-H” module with either an Intel Core i5-12600HE 12-core (4P+8E) processor clocked at up to 4.5 GHz or a Core i3-12300HE 8-core (4P+4E) processor reaching up to 4.3 GHz. The kit also includes the Express-BASE6 R3.1 carrier board, a thick heatsink with an active fan, a debug board (DB30 x86), and various cables for SATA storage, a DB9 COM port, and I/Os, and the kit can be used to develop applications for industrial automation and control, medical ultrasound, image processing and analysis, high-speed video encoding and streaming, predictive traffic analysis, multi camera-based AI, etc… The Express-ADP module supports up to 64GB DDR5 memory, optional on-module NVMe storage, up to 4x 4K displays, multiple PCIe Gen4 and Gen3 interfaces, SATA 3.0, and so on. You’ll find detailed Express-ADP COM Express module specifications in […]

COM Express & COM-HPC modules features Intel 13th gen Raptor Lake embedded processors

Express-RLP Raptor Lake-P COM Express

ADLINK has just announced the Express-RLP COM Express Type 6 and COM-HPC-cRLS COM-HPC size C modules based on the new Intel 13th generation Raptor Lake hybrid processors with Embedded and Industrial SKUs. The Express-RLP comes with an up to 14 cores, 20 threads Raptor Lake-P processor, 64GB DDR5 SO-DIMM, and PCIe Gen4, while the COM-HPC-cRLS offers up to a 24-core Rasptor Lake-S embedded processor, 128GB DDR5 SO-DIMM, PCIe Gen5, and 2x 2.5GbE LAN. Both modules support Intel TCC, and Time Sensitive Networking (TSN), and are suitable for hard real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation. Express-RLP Raptor Lake-P COM Express module Specifications: Raptor Lake-P SoC (one of the other) Intel Core i7-13800HRE 6P+8E cores/20 threads processor @ up to 2.5 GHz with 24MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W) Intel Core i7-1370PRE 6P+8E cores/20 threads processor @ up […]

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel Xeon D: D-2700 and D-1700

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

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