com-hpc

Posted on by Jean-Luc Aufranc (CNXSoft) - 9 Comments on AMD launches Ryzen AI Embedded X100 processors, Kria AI SoM, and physical AI/robotics developer platform

AMD launches Ryzen AI Embedded X100 processors, Kria AI SoM, and physical AI/robotics developer platform

AMD Ryzen AI Embedded X100

AMD has announced a range of new AI solutions at Advanced AI 2026, including 6th Gen AMD EPYC CPUs, AMD Instinct MI400 Series GPUs, and AMD Helios AI rackscale solutions designed for data centers. In this article, we’ll focus instead on embedded and physical AI solutions like the new Ryzen AI Embedded X100 processor family and a new Kria AI SoM integrated into the Kria AI Robotics Developer Platform pairing an X100 embedded CPU with a Kria FPGA. AMD Ryzen AI Embedded X100 AMD first introduced the Ryzen AI Embedded X100 family when it launched the Ryzen AI Embedded P100 family in January 2026, delivering up to 50 TOPS of AI performance. However, at the time there were very few details about the X100 family, just that it would offer higher CPU core counts and AI TOPS performance, and this latest announcement fixes that. AMD claims the new X100 series […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on ADLINK COM-HPC-mPTL COM-HPC Mini computer-on-module features up to 180 TOPS Intel Core Ultra Series 3 CPU

ADLINK COM-HPC-mPTL COM-HPC Mini computer-on-module features up to 180 TOPS Intel Core Ultra Series 3 CPU

COM-HPC Mini module based on Intel Core Ultra Series 3 Panther Lake

ADLINK COM-HPC-mPTL is a COM-HPC R1.3 Mini computer-on-module powered by the Intel Core Ultra Processor Series 3 “Panther Lake” family, up to the 180 TOPS 16-core Core Ultra X7 358H processor. The module supports up to 64GB LPDDR5x and optional NVMe SSD BGA storage, and features two 2.5GbE controllers, optional MIPI CSI camera connectors,  and a 40-pin  debug connector. All I/Os are exposed through a standard 400-pin high-density board-to-board connector, including four display interfaces (HDMI, DP, USB4, eDP), and up to 16x PCIe Gen4/Gen5 lanes. COM-HPC-mPTL specifications: SoC – Intel Core Ultra Series 3 Panther Lake-H processors (one or the other) Intel Core Ultra 5 325 8-core (4P+0E+4LPE) processor up to 2.1 GHz / 4.5 GHz (Turbo) with 12MB cache, 4-core Xe3 graphics (40 TOPS), 47 TOPS NPU; PBP: 25W Intel Core Ultra 7 356H 16-core (4P+8E+4LPE) processor up to 1.9 GHz / 4.7 GHz (Turbo) with 18MB cache, 4-core […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on COM HPC Mini-sized VersaLogic Raptor “Embedded Processing Unit” features 13th gen Intel Core i5-1345URE or Processor U300E SoC

COM HPC Mini-sized VersaLogic Raptor “Embedded Processing Unit” features 13th gen Intel Core i5-1345URE or Processor U300E SoC

VersaLogic Raptor

VersaLogic Raptor (VL-EPU-5530) Embedded Processing Unit is powered by a 13th Gen Intel Core i5-1345URE or Processor U300E SoC and designed for high-performance computing applications in harsh environments with a -40 to +85°C temperature range and MIL-STD-202H shock and vibration qualification. The COM HPC Mini-sized (95 x 80 x 36mm) board supports up to 64 GB of soldered-down LPDDR5 memory, features vertical USB4, USB 3.0 Type-A, and mini DisplayPort connectors, two 2.5 Gbps Ethernet ports with TSN support, and three M.2 expansion sockets for NVMe SSDs, AI accelerators, or other expansion modules. Specifications: Raptor Lake SoC (one or the other) Intel Processor U300E 5-core/6-thread processor with 1x P-core @ 1.1 GHz / 4.3 GHz (Turbo) 4x E-cores up to 3.2 GHz (Turbo), 8MB Cache, 48EU Intel UHD Graphics up to 1.1 GHz; PBP: 15W Intel Core i5-1345URE 10-core/12-thread processor with 2x P-cores @ 1.4 GHz / 4.6 GHz (Turbo), 8x […]

Posted on by Debashis Das - 1 Comment on Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

EXEC Q911 Qualcomm Solution COM HPC Mini Starter Kit

Innodisk has recently introduced the EXEC-Q911, a COM-HPC Mini starter kit designed for edge AI applications powered by a Qualcomm Dragonwing IQ-9075 System-on-Chip (SoC), also known as the QCS9075, which delivers up to 200 TOPS of AI performance. The platform includes 36GB LPDDR5X memory and 128GB UFS 3.1 storage, supports dual 2.5GbE, two 4-lane MIPI CSI-2 camera interfaces, DisplayPort 1.2 and eDP outputs, and multiple expansion options via M.2 (PCIe Gen4 x4/x2) slots. Designed for industrial applications, it operates in a wide -40°C to 85°C operating temperature range, accepts 9–36V DC input, integrates TPM 2.0 security, and offers various I/Os, USB 3.2 Gen 2, CAN FD, RS-232/422/485, GPIO, SPI, and I²C, with longevity guaranteed until 2038. Innodisk EXEC-Q911 specifications: Compute-on-Module – Innodisk EXMA-Q911 COM-HPC Mini module SoC – Qualcomm DragonWing IQ-9075 CPU Octa-core Kryo Gen 6 (Cortex-A78C-based) application cores @ up to 2.36 GHz Quad-core Cortex-R52 real-time cores @ up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on COM-HPC Mini Computer-on-Module (CoM) features up to Intel Core Ultra 7 255H “Arrow Lake” processor

COM-HPC Mini Computer-on-Module (CoM) features up to Intel Core Ultra 7 255H “Arrow Lake” processor

COM-ARHm COM-HPC Mini module

AAEON HPC-ARHm is a COM-HPC Mini R1.2 module powered by a choice of 28W Intel Core Ultra Arrow Lake and Meteor Lake processors with Intel Arc/Arc 140T/130T GPU and up to 96 TOPS of combined AI performance. The Computer-on-Module supports up to 64GB LPDDR5x, offers three 4K-capable display interfaces through two DDI (DP/HDMI) and one eDP interface, dual 2.5GbE networking, twelve USB interfaces, including four 10 Gbps USB 3.2, sixteen PCIe Gen4/Gen3 lanes, and more. It primarily targets Edge AI solutions such as UAVs, robots, IC testing equipment, and healthcare imaging devices. HPC-ARH-m COM-HPC Mini module specifications: Meteor Lake-H or Arrow Lake-H SoC (one or the other) Intel Core Ultra 5 125H 14-core/18-thread (4P+8E+2LPE) processor @ up to 4.9 / 3.6 / 2.5 GHz with 18MB cache, 7x Xe-Cores Intel Arc graphics @ 2.2 GHz (18 TOPS), Intel AI Boost NPU (11 TOPS); PBP: 28W Intel Core Ultra 7 155H […]

Posted on by Debashis Das - 1 Comment on BCM ESM-HRPL COM-HPC Client Size C module supports up to 24-core Intel Core i9-14900K CPU

BCM ESM-HRPL COM-HPC Client Size C module supports up to 24-core Intel Core i9-14900K CPU

ESM HRPL COM HPC Client Size C Module

The BCM ESM-HRPL is an industrial-grade COM-HPC Client Size C module based on Intel Core 12th to 14th Gen processors, supporting up to the 24-core Intel Core i9-14900K Raptor Lake SoC via an LGA1700 socket. It features PCIe Gen5, Intel Deep Learning Boost, and AI Boost for AI inference, delivering up to 8.2 TOPS of AI processing power. The module follows the PICMG COM-HPC Client Type specification and supports up to 128GB DDR5 memory via four 262-pin SO-DIMM sockets and optional ECC support depending on the CPU. Interfaces include 2x SATA III ports, dual 2.5GbE, USB 3.2 Gen2x2, eDP, and triple DDI display interfaces (for a total of 4 independent displays). Designed for long-term support, this board targets applications such as AI inference, medical imaging, smart energy, and automation. BCM ESM-HRPL specifications: Processor Support – Compatible with 12th/13th/14th Gen. Intel Core i9/i7/i5/i3/Pentium/Celeron “Alder Lake-S” or “Raptor Lake-S” processor via LGA1700 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK COM-HPC-mMTL – A COM-HPC Mini Computer-on-Module with up to 16-core Intel Core Ultra 7 165H processor

ADLINK COM-HPC-mMTL – A COM-HPC Mini Computer-on-Module with up to 16-core Intel Core Ultra 7 165H processor

COM-HPC-mMTL 16-core Intel Core Ultra COM-HPC Mini

ADLINK COM-HPC-mMTL is an industrial-grade COM-HPC Mini Computer-on-Module based on Intel Meteor Lake processors up to the 16-core Intel Core Ultra 7 165H featuring Intel Arc Graphics with eight Xe cores, Intel AI Boost NPU up to 8.2 TOPS, and 16x PCIE Gen4 lanes. The COM-HPC R1.2-compliant Mini size module also supports up to 64GB LPDDR5x memory soldered directly onto the board, an optional NVMe BGA SSD, and features two SATA interfaces, two 2.5 Gbps Ethernet, multiple DDI/USB4, and USB 3.0/2.0 through the standard 400-pin board-to-board connector of the 95x70mm CoM. ADLINK COM-HPC-mMTL specifications: Meteor Lake H/U SoC (one or the other) Intel Core Ultra 7 165H 16-core (6P+8E+2LPE) processor @ up to 5.0 / 3.8 / 2.5 GHz with 24MB cache, 8x Xe-cores Intel Arc graphics @ 2.35 GHz, Intel AI Boost NPU; TDP: 28W Intel Core Ultra 7 155H 16-core (6P+8E+2LPE) processor @ up to 4.8 / 3.8 […]

Posted on by Debashis Das - No Comments on Intel Core Ultra 200S/200U/200H-powered COM-HPC Client modules support up to 192GB DDR5 memory, PCIe Gen5

Intel Core Ultra 200S/200U/200H-powered COM-HPC Client modules support up to 192GB DDR5 memory, PCIe Gen5

Portwell COM HPC client modules PCOM B887 and PCOM B886

Portwell PCOM-B887 and PCOM-B886 are two new COM-HPC client modules built around Intel Core Ultra 200S/200U/200H processors delivering high-performance computing and AI acceleration for industrial, edge, and AI-driven applications. The Portwell PCOM-B887 (Size C) module is built around the 200S Series, offers up to 36 TOPS, supports 192GB DDR5 memory, and features 42 PCIe lanes up to Gen5. The PCOM-B886 (Size B) module supports 200H/200U Series processors, which deliver up to 99 TOPS, support 96GB DDR5 memory, and include 24 PCIe lanes. Both modules feature various I/O options, including USB4, USB3.2 Gen2, and multiple display outputs. Portwell PCOM-B887 – COM-HPC Client Type Size C module The PCOM-B887 COM-HPC Client Type Size C module is powered by Intel Core Ultra 200S Series processors, which feature up to 36 TOPS of AI performance via an integrated neural processing unit (NPU). It supports up to 192GB of DDR5 memory at 4800MT/s with 42 […]

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