conga-SMX95 NXP i.MX 9596 SMARC 2.1 SoM supports M.2 1216 WiFi 6 and Bluetooth 5.3 modules

conga-SMX95 NXP i.MX9596 SoM M.2 1216 WiFi 6 module

We had already written about NXP i.MX 95 SMARC 2.1 system-on-modules from ADLINK, iWave Systems, Avnet, and Advantech, but congatec has now launched its own with the conga-SMX95 featuring the NXP i.MX 9596 hexa-core Arm Cortex-A55 AI processor and up to 16GB LPDDR5 memory. The conga-SMX95 also comes with up to 256GB flash, is available on both commercial and industrial temperature grade variants, and exposes most of the same interfaces as competing products. What might be different is that the conga-SMX95 is offered with an optional M.2 1216 WiFi 6 and Bluetooth 5.3 wireless module. We’ve seen M.2 1216 wireless modules before, and they don’t use any M.2 socket but are LGA packages that need to be soldered to the target board/module. conga-SMX95 specifications: SoC – NXP i.MX 9596 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz (industrial) or 2.0 GHz (commercial) with 32K I-cache and […]

High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)

COM-HPC Mini Academy

Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]

congatec conga-SA8 Amston Lake SMARC modules are targeted at industrial edge applications

congatec conga-SA8 Amston Lake

Congatec’s new conga-SA8 SMARC modules are powered by the Intel Atom x7000RE “Amston Lake” processors. With twice the processing cores and similar power consumption to the previous generation, congatec’s new credit-card-sized modules are “intended for future-facing industrial edge computing and powerful virtualization.” An Intel Core i3‑N305 Alder Lake-N processor is also offered as an alternative to the Intel Atom x7000RE series for high-performance IoT edge applications. The conga-SA8 modules support up to 16GB LPDDR5 onboard memory, 256GB eMMC 5.1 onboard flash memory, and offer several high-bandwidth interfaces such as USB 3.2 Gen 2, PCIe Gen 3, and SATA Gen 3. The integrated Intel UHD Gen 12 graphics processing unit has up to 32 execution units and can power three independent 4K displays. The conga-SA8 is described as virtualization-ready and has a hypervisor (virtual machine monitor) integrated into the firmware. The RTS hypervisor takes complete advantage of the eight processing cores […]

Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec has recently announced Six new COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core(Raptor Lake) processors. The module comes with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W.

We’ve noticed a surge in the popularity of COM Express modules and Congatec has recently announced six new conga-TC675r COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core (Raptor Lake) processors that happen to come with soldered RAM instead of the usual SO-DIMM memory slots found in this form factor. The modules come with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W. According to Congatec, this device is designed to work under extreme temperatures (-40°C to +85°C), and is built to withstand the highest standards for shock and vibrations notably thanks to the user of soldered onboard RAM, making this device suitable for off-road vehicles for mining, construction, agriculture, forestry, and other demanding mobility applications. Previously we have seen manufacturers like ADLINK announce COM Express modules based on the 13th Gen architecture, and both ADLINK and Congatec have also just […]

conga-STDA4 SMARC 2.1 module features TI TDA4VM/DRA829J Jacinto 7 processor

conga-STDA4 SMARC Module TI Jacinto 7 TDA4VM DRA829J

congatec conga-STDA4 is a SMARC Computer-on-Module (CoM) based on Texas Instruments TDA4VM or DRA829J Jacinto 7 processor with two Cortex-A72 cores, six real-time Cortex-R5 cores for functional safety, accelerated vision and AI processing capabilities, and plenty of interfaces. The first Texas Instruments-powered CoM from the company is designed for industrial mobile machinery requiring near-field analytics, such as automated guided vehicles and autonomous mobile robots, construction and agricultural machinery, as well as any industrial or medical solutions requiring energy-efficient computer vision at the edge. conga-STDA4 specifications: SoC – Texas Instruments Jacinto 7 TDA4VM/DRA829J with Dual-core Arm Cortex-A72 up to 2.0 GHz 6x Arm Cortex-R5F cores @ 1.0 GHz up to 8 MB of on-chip L3 RAM 1x C7x DSP up to 80 GFLOPs 2x C66 DSPs up to 40 GFLOPs Up to 8 TOPS MMA AI accelerator PowerVR Rogue 8XE GE8430 3D GPU with support for OpenGL ES 3.1, OpenVX, OpenCL […]

conga-HPC/cRLS Raptor Lake COM-HPC Client module supports up to 128GB DDR5 RAM

Congatec conga HPC/cRLS COM HPC Client Size C Raptor Lake CPU

Congatec conga-HPC/cRLS is a COM-HPC Client Size C computer-on-module based on a 13th gen Intel Raptor Lake processor with support for up to 128GB DDR5 memory through four SO-DIMM sockets. The COM-HPC module also provides up to three DDI display interfaces, two 2.5GbE networking interfaces with TSN support, two SATA storage interfaces, and a range of PCIe Gen 3, 4, and 5 interfaces through the two 400-pin connectors defined in the COM-HPC standard. conga-HPC/cRLS specifications: Raptor Lake-S SoC (one or the other) Intel Core i3-13100E with 4x P-cores @ 3.3GHz / 4.4GHz, 12 MB cache, Intel UHD Graphics 730; PBP: 65W Intel Core i5-13400E with 6x P-cores @ 2.4GHz / 4.6GHz, 4x E-cores @ 1.5GHz / 3.3GHz, 20MB cache, Intel UHD Graphics 730; PBP: 65W Intel Core i7-13700E with 8x P-cores @ 1.9GHz / 5.1GHz, 8x E-cores @ 1.3GHz / 3.9GHz, 30MB cache, Intel UHD Graphics 770; PBP: 65W Intel […]

conga-HPC/uATX is a micro-ATX board for COM-HPC Client Type modules

congatec Micro-ATX Carrier Board for COM-HPC Client

congatec has just introduced the conga-HPC/uATX micro-ATX carrier board designed for COM-HPC Client modules size A, B, and C. The board is vendor independent since it is based on the COM-HPC and micro-ATX standards and designed for embedded long-term availability of at least seven years. That means the micro-ATX carrier board works congatec solutions such as the high-end conga-HPC/cALS COM-HPC Client Size C module with up to a 16-core Intel Core i9 Alder Lake-S processor or the more power-efficient conga-HPC/cALP COM-HPC Client Size A modules with Intel Celeron 7305E processor, as well as similar solutions from ADLINK Technology, Advantech, Portwell, and other vendors. conga-HPC-/uATX carrier board specifications: Compatible with COM-HPC Client Type Modules (Size A: 95 x 120mm, Size B: 120 x 120mm, and Size C: 160 x 120mm) with CPU and memory sockets Video Output 3x DP++ with 8.1 Gbps Re-driver 1x eDP (optional for LVDS) Audio HDA codec […]

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel Xeon D: D-2700 and D-1700

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

EmbeddedTS embedded systems design