A highly reliable performance boost for the edge The new Intel Atom® x6000E Series, Intel Celeron®, and Pentium® N & J processors (code name Elkhart Lake) impress with twice the graphics speed of their predecessors and 50% more multi-thread performance on up to 4 cores. congatec is now making these processors available on the 2.5-inch Pico-ITX form factor, leveraging their industrial quality for the most reliable performance boost possible. With growing digitization and the IoT trend, even the smallest edge computers are expected to meet high-reliability requirements today. Start-ups, makers, and spin-offs from big industrial companies increasingly deploy them in massively distributed applications to implement their new business models and IoT-supported services. They all face a similar challenge: Their apps are approaching market-readiness but their hardware platforms, which often originate from the maker board scene, lack reliability since they were not designed for large series and harsh environments. Industrial edge computing designs, however, must provide highly reliable 24/7 service over […]
With the announcement of Intel Elkhart Lake IoT-optimized processors, we should expect embedded systems companies to unveil their own Atom x6000E and Celeron/Pentium Elkhart Lake powered products, and one of the first to do so is Congatec with the introduction of four different Elkhart Lake computers-on-module (CoM) following Qseven, SMARC, and COM Express standards, as well as a Pico-ITX SBC. conga-PA7 Atom x6000E SBC (with Celeron/Pentium J optional) Detailed specifications: SoC – Choice of eight different Elkhart Lake processors from the 6W Atom x6211E dual-core processor to the 10W Intel Pentium J6425 quad-core processor up to 3.0 GHz, all with 10th Gen Intel UHD graphics System Memory – Up to 16GB quad-channel onboard LPDDR4x Storage 32GB or 64GB UFS 2.0 flash (optional up to 512GB) M.2 SATA/PCIe SSD support (see expansion) 32 MB serial flash for AMI Aptio UEFI firmware Video DisplayPort DP++ video output up to 4Kp60 1x USB-C port with DisplayPort Alt mode 1x LVDS 18/24-bit connector or […]
Intel Core “Tiger Lake” processors designed for ultra-thin laptops have just been officially launched together with some laptop announcements. But Tiger Lake processors will find their way into embedded applications as well, with Congatec announcing conga-TC570 COM Express Type 6 Compact module and conga-HPC/cTLU COM-HPC high-performance module both featuring Intel Tiger Lake-UP3 (12W to 25W TDP) processors. conga-TC570 Tiger Lake COM Express Module Specifications: SoC – Intel Core i3/i5/i7 Tiger Lake-UP3 processor with up to 96 EU Intel Iris Xe graphics; 12W-28W configurable TDP System Memory – Up to 2x SO-DIMM sockets for DDR4 memory modules up to 32 GB each with 3200 MT/s ECC and non-ECC supported Networking – Intel i225 Gigabit Ethernet controller with TSN support COM Express board-to-board connectors with 440 pins Video Output – HDMI 2.0/2.1, DP 1.4, MIPI D-PHY 2.1; up to 4x independent display unit (4x 4K or 2x 8K) Storage – 2x SATA III (6Gb/s) Networking – 1x GbE TSN Ethernet via Intel® […]
We’ve covered plenty of AMD Ryzen Embedded V1000-series SBCs, and some Ryzen Embedded mini PCs, but so far, we had not written about any AMD Ryzen Embedded V1000 or R1000 system-on-module (SoM) or computer-on-module (CoM), partially because there aren’t many yet, and because we missed Advantech SOM-5871 CPU module earlier this year. But there’s now another option courtesy of Congatec with conga-TR4 AMD Ryzen Embedded COM Express module with consumer or industrial temperature range, and a choice of seven different processors. conga-TR4 COM Express module specifications: SoC (one or the other) AMD Ryzen V1807B quad-core processor @ up to 3.35 GHz with 2MB L2 cache, Vega 11 graphics; 35-54W TDP AMD Ryzen V1756B quad-core processor @ up to 3.25 GHz with 2MB L2 cache, Vega 8 graphics; 35-54W TDP AMD Ryzen V1605B quad-core processor @ 2.0 GHz with 2MB L2 cache, Vega 8 graphics; 12-25W TDP AMD Ryzen V1202B dual-core processor @ 2.5 GHz with 1MB L2 cache, Vega 8 […]
Last year, Congatec introduced SMARC 2.0 compliant systems-on-modules based on NXP i.MX 8, i.MX 8M Mini and i.MX 8M Nano processors, together with Conga-SEVAL carrier board designed for evaluation and early software development, but is not suitable for deployment in the field. The company has now unveiled a standard 3.5″ carrier board – conga-SMC1 – that takes any of the company’s i.MX8 SMAC modules, in order to help their customers bring products faster to market thanks to a commercial-off-the-shelf (COTS) board. Congatec conga-SMC1/SMARC-ARM carrier board features and specifications: Supported SoM – conga-SMX8 (i.MX8), conga-SMX8-Mini (i.MX 8M Mini), or conga-SMX8-Nano (i.MX 8M Nano). Future SMARC 2.0 Arm-based modules should also be supported Storage – 1x SATA III (support of SATADOM VCC PIN 7 and PIN 8), 1x SATA power (+5V, +12V), MicroSD card socket, M.2 NVMe SSD support Display Interface 1x LVDS 18/24bit single/dual channel LVDS 2x optional eDP/DSI (dependent on processor platform) 1x LCD backlight (5V and 12V) 1x HDMI […]
Congatec Announces Ultra-Low-Power SMARC 2.0 CoM Congatec has come out with a new CoM, the Conga-SMX8-Nano that carries up to 4x ARM Cortex-A53 and 1x Cortex-M7 cores with a full spectrum of options. The SMARC 2.0 module can meet ultra-low-power requirements, offers low cost, as well as high-level performance. Background Information Background on NXP i.MX 8M Nano processors and modules have been reported in our report about iWave’s iW-RainboW-G34M-SM SoM and the introduction of the i.MX 8M Nano ARM Cortex-A53 and M7 processor to the market. A Board for the Industry The intention here is to develop a board that has high performance, ultra-low power requirements and can reach high volumes at low cost. The modules are scalable to the conga-SMX-8-Mini CoM, with options for a multitude of setups across types. Example Uses for conga-SMX8-Nano The company offers the example of a complex medical user interface that engineers might want to transform from a button-based interface into a GUI, which […]
AI training often requires thousands of samples to become accurate, and it can be costly and time-consuming, for example, if you want to train a model to detect manufacturing defects you’d need to provide images with both defective samples and good samples. Japanese AI experts at Hacarus have been working on a solution called Sparse Modeling which requires about 50 samples or even less for training, and worked with Congatec to provides an embedded AI computing kit leveraging the technology. Sparse Modeling Technology Hacarus does not go into great detail but explains Sparse Modeling technology is using a data modeling approach that focuses on identifying unique characteristics, in a way that humans recognize friends and family without having to look at everything from feet to head. That means algorithms based on Sparse Modeling do not need as much data as traditional AI solutions, leading to much smaller AI footprint suitable for fanless low-power systems operating 24/7, and/or that may a […]
NXP i.MX 8M Mini is the first i.MX processor from the company to be manufactured using a 14nm process, which enabled a higher 2.0 GHz frequency for the Cortex-A53 cores. While it was announced in 2018, the first systems-on-module were launched earlier this with products such as iWave System’ iW-RainboW-G34M-SM, TechNexion Axon Flex modules, F&S Elektronik Systems PicoCore-MX8MM, or CompuLab UCM-iMX8M-Mini among many others. So far, we had no covered any SMARC 2.0 compatible system-on-module based on the new NXP processor, but some companies had already launched such modules including Embedian and Avnet. Congatec has now joined them with the launch of conga-SMX8-Mini SMARC 2.0 system-on-module which builds on the company’s earlier conga-SMX8 i.MX 8 module. conga-SMX8-Mini SoM specifications: SoC (one or the other) NXP i.MX 8M Mini Quad with 4x Arm Cortex-A53 @ 1.8 GHz, 1x Arm Cortex-M4 @ 400MHz, GC NanoUltra 3D GPU, GC328 2D Graphics NXP i.MX 8M Mini Dual with 2x Arm Cortex-A53 @ 1.8 GHz, […]
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