SMARC Modules With NXP i.MX 8M Plus Processor (Sponsored)

congatec smarc NXP i.MX8M Plus

Low-power flagship for artificial intelligence – congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with an application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible. That hasn’t always been so easy. Previously, it was usually much more difficult to use the latest processor technology from the Arm environment as a finished system than to implement the x86 environment. This is because, as a result of the historically large range of individually tailored custom designs used in large quantities, the ecosystem of system platforms is not that extensive. However, with the modular approach based on the SMARC computer-on-modules specification, it is now also possible to obtain standard form factors from the x86 box PC range with ARM processors. For example, the embedded computing specialist congatec […]

Congatec COM-HPC & COM Express Xeon modules target high-end IoT gateways, medical edge applications

Tiger Lake-H COM-HPC & COM Express CPU modules

Yesterday, we wrote about ADLink Express-TL COM Express Basic Size Type 6 module powered by the latest Intel Tiger Lake-H Xeon, Core, and Celeron processors designed for high-end industrial & embedded systems. But as one would expect more such modules are coming to market, and Congatec announced both COM-HPC and COM Express CPU modules based on Intel Tiger Lake-H processors with target applications include high-end IoT gateways and medical edge applications. Let’s check out both conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm). conga-HPC/cTLH COM-HPC module Key features and specifications: SoC – Choice of ten Intel Xeon, Core i3/i5i/7, or Celeron 6600HE processors with Intel Xe Gen12 graphics part of Tiger Lake-H family System Memory – Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GB each (128 GB total) with […]

ANYbotics’ ANYmal C robot is a multi-module machine (Sponsored)

anymal c legged robot ml industrial inspection action

Rugged four-legged robot with three brains ANYbotics provides solutions for robot applications with the most advanced mobility and autonomy requirements in challenging terrains. The massive embedded computing performance for the key tasks – situational awareness, motion control and mission fulfillment – is delivered by three COM Express Computer-on-Modules from congatec. Due to the advancements in computer-based intelligence and sensor technology, previously stationary robots unaware of their environment are now evolving into smart autonomous mobile robots. This will not only help to relieve humans of potentially dangerous tasks but also to optimize repetitive tasks in real-life environments from an economic point of view. Such robots can autonomously fulfill many jobs that previously required human labor and significantly extend the list of feasible tasks. With such a perspective, it is not surprising that robot applications are a booming market. The overall global smart robot market is expected to grow with a CAGR […]

AMD Ryzen Embedded V2000 series on COM Express Compact (Sponsored)

conga-TCV2 AMD Ryzen Embedded V2000 COM Express

8 cores for heterogeneous edge computing Tasks at the embedded edge are getting more and more complex. Supporting up to 8 cores and 16 threads, the recently-launched AMD Ryzen Embedded V2000 processors are paving the way for x86-based embedded designs with unprecedented compute density and performance per watt. congatec is offering the new Zen 2 based processor generation, which complements V1000 processor technology with 6- and 8-core versions, on COM Express Compact modules. As the trend towards more IIoT connectivity and digitization continues, embedded systems must handle a growing number of tasks. Additional tasks include the collection of application data that needs to be transcoded, and sometimes analyzed locally using artificial intelligence (AI). In parallel, data must be exchanged with customers’ enterprise clouds and other OEM apps, and this communication must be highly secure, because new pay-per-use models turn the devices, machines, and systems into an OEM revenue source that […]

It’s raining i.MX 8M Plus systems-on-module at Embedded World 2021

i.MX 8M Plus Systems-on-Module

NXP introduced i.MX 8M Plus AI SoC with a built-in 2.3 TOPS neural processing unit (NPU) last year, and we’ve already covered several early announcements about i.MX 8M Plus systems-on-module (SoM) with Variscite VAR-SOM-MX8M-PLUS and DART-MX8M-PLUS, TechNexion EDM-G-IMX8M-PLUS and AXON-E-IMX8M-PLUS respectively using SO-DIMM edge connectors and board-to-board connectors, as well as SolidRun i.MX 8M Plus SoM that was announced together with the HummindBoard Mate carrier board with dual Gigabit Ethernet. But as Embedded World 2021 Digital is taking place virtually until Friday, other companies have now made their own announcements of i.MX 8M Plus SoMs as the processor enters mass production this month, and since as far as I know, it’s pin-to-pin and software compatible with earlier i.MX 8M Nano/Mini SoCs, the update must have been easy. That means we’ve got a longish list of modules, and I have probably missed some. Supported operating systems are basically the same across […]

Edge computing boards with new Intel Atom x6000E processors (Elkhart Lake) – Sponsored

04-conga-PA5 with heat spreader

A highly reliable performance boost for the edge The new Intel Atom® x6000E Series, Intel Celeron®, and Pentium® N & J processors (code name Elkhart Lake) impress with twice the graphics speed of their predecessors and 50% more multi-thread performance on up to 4 cores. congatec is now making these processors available on the 2.5-inch Pico-ITX form factor, leveraging their industrial quality for the most reliable performance boost possible. With growing digitization and the IoT trend, even the smallest edge computers are expected to meet high-reliability requirements today. Start-ups, makers, and spin-offs from big industrial companies increasingly deploy them in massively distributed applications to implement their new business models and IoT-supported services. They all face a similar challenge: Their apps are approaching market-readiness but their hardware platforms, which often originate from the maker board scene, lack reliability since they were not designed for large series and harsh environments. Industrial edge […]

Congatec Unveils Atom x6000E Elkhart Lake Powered Pico-ITX SBC, Qseven, SMARC, COM Express Modules

conga-PA7 Atom x6000E SBC

With the announcement of Intel Elkhart Lake IoT-optimized processors, we should expect embedded systems companies to unveil their own Atom x6000E and Celeron/Pentium Elkhart Lake powered products, and one of the first to do so is Congatec with the introduction of four different Elkhart Lake computers-on-module (CoM) following Qseven, SMARC, and COM Express standards, as well as a Pico-ITX SBC. conga-PA7 Atom x6000E SBC (with Celeron/Pentium J optional) Detailed specifications: SoC –  Choice of eight different Elkhart Lake processors from the 6W Atom x6211E dual-core processor to the 10W Intel Pentium J6425 quad-core processor up to 3.0 GHz, all with 10th Gen Intel UHD graphics System Memory – Up to 16GB quad-channel onboard LPDDR4x Storage 32GB or 64GB UFS 2.0 flash (optional up to 512GB) M.2 SATA/PCIe SSD support (see expansion) 32 MB serial flash for AMI Aptio UEFI firmware Video DisplayPort DP++ video output up to 4Kp60 1x USB-C […]

Congatec Unveils COM Express & COM-HPC Tiger Lake Computers-on-Module

conga-TC570 Tiger Lake COM Express Module

Intel Core “Tiger Lake” processors designed for ultra-thin laptops have just been officially launched together with some laptop announcements. But Tiger Lake processors will find their way into embedded applications as well, with Congatec announcing conga-TC570 COM Express Type 6 Compact module and conga-HPC/cTLU​ COM-HPC high-performance module both featuring Intel Tiger Lake-UP3 (12W to 25W TDP) processors. conga-TC570 Tiger Lake COM Express Module Specifications: SoC – Intel Core i3/i5/i7 Tiger Lake-UP3 processor with up to 96 EU Intel Iris Xe graphics; 12W-28W configurable TDP System Memory – Up to 2x SO-DIMM sockets for DDR4 memory modules up to 32 GB each with 3200 MT/s ECC and non-ECC supported Networking – Intel i225 Gigabit Ethernet controller with TSN support COM Express board-to-board connectors with 440 pins Video Output – HDMI 2.0/2.1, DP 1.4, MIPI D-PHY 2.1; up to 4x independent display unit (4x 4K or 2x 8K) Storage – 2x SATA […]