conga-HPC/uATX is a micro-ATX board for COM-HPC Client Type modules

congatec Micro-ATX Carrier Board for COM-HPC Client

congatec has just introduced the conga-HPC/uATX micro-ATX carrier board designed for COM-HPC Client modules size A, B, and C. The board is vendor independent since it is based on the COM-HPC and micro-ATX standards and designed for embedded long-term availability of at least seven years. That means the micro-ATX carrier board works congatec solutions such as the high-end conga-HPC/cALS COM-HPC Client Size C module with up to a 16-core Intel Core i9 Alder Lake-S processor or the more power-efficient conga-HPC/cALP COM-HPC Client Size A modules with Intel Celeron 7305E processor, as well as similar solutions from ADLINK Technology, Advantech, Portwell, and other vendors. conga-HPC-/uATX carrier board specifications: Compatible with COM-HPC Client Type Modules (Size A: 95 x 120mm, Size B: 120 x 120mm, and Size C: 160 x 120mm) with CPU and memory sockets Video Output 3x DP++ with 8.1 Gbps Re-driver 1x eDP (optional for LVDS) Audio HDA codec […]

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

SMARC Modules With NXP i.MX 8M Plus Processor (Sponsored)

Low-power flagship for artificial intelligence – congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with an application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible. That hasn’t always been so easy. Previously, it was usually much more difficult to use the latest processor technology from the Arm environment as a finished system than to implement the x86 environment. This is because, as a result of the historically large range of individually tailored custom designs used in large quantities, the ecosystem of system platforms is not that extensive. However, with the modular approach based on the SMARC computer-on-modules specification, it is now also possible to obtain standard form factors from the x86 box PC range with ARM processors. For example, the embedded computing specialist congatec […]

Congatec COM-HPC & COM Express Xeon modules target high-end IoT gateways, medical edge applications

Yesterday, we wrote about ADLink Express-TL COM Express Basic Size Type 6 module powered by the latest Intel Tiger Lake-H Xeon, Core, and Celeron processors designed for high-end industrial & embedded systems. But as one would expect more such modules are coming to market, and Congatec announced both COM-HPC and COM Express CPU modules based on Intel Tiger Lake-H processors with target applications include high-end IoT gateways and medical edge applications. Let’s check out both conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm). conga-HPC/cTLH COM-HPC module Key features and specifications: SoC – Choice of ten Intel Xeon, Core i3/i5i/7, or Celeron 6600HE processors with Intel Xe Gen12 graphics part of Tiger Lake-H family System Memory – Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GB each (128 GB total) with […]

ANYbotics’ ANYmal C robot is a multi-module machine (Sponsored)

Rugged four-legged robot with three brains ANYbotics provides solutions for robot applications with the most advanced mobility and autonomy requirements in challenging terrains. The massive embedded computing performance for the key tasks – situational awareness, motion control and mission fulfillment – is delivered by three COM Express Computer-on-Modules from congatec. Due to the advancements in computer-based intelligence and sensor technology, previously stationary robots unaware of their environment are now evolving into smart autonomous mobile robots. This will not only help to relieve humans of potentially dangerous tasks but also to optimize repetitive tasks in real-life environments from an economic point of view. Such robots can autonomously fulfill many jobs that previously required human labor and significantly extend the list of feasible tasks. With such a perspective, it is not surprising that robot applications are a booming market. The overall global smart robot market is expected to grow with a CAGR […]

AMD Ryzen Embedded V2000 series on COM Express Compact (Sponsored)

8 cores for heterogeneous edge computing Tasks at the embedded edge are getting more and more complex. Supporting up to 8 cores and 16 threads, the recently-launched AMD Ryzen Embedded V2000 processors are paving the way for x86-based embedded designs with unprecedented compute density and performance per watt. congatec is offering the new Zen 2 based processor generation, which complements V1000 processor technology with 6- and 8-core versions, on COM Express Compact modules. As the trend towards more IIoT connectivity and digitization continues, embedded systems must handle a growing number of tasks. Additional tasks include the collection of application data that needs to be transcoded, and sometimes analyzed locally using artificial intelligence (AI). In parallel, data must be exchanged with customers’ enterprise clouds and other OEM apps, and this communication must be highly secure, because new pay-per-use models turn the devices, machines, and systems into an OEM revenue source that […]

It’s raining i.MX 8M Plus systems-on-module at Embedded World 2021

NXP introduced i.MX 8M Plus AI SoC with a built-in 2.3 TOPS neural processing unit (NPU) last year, and we’ve already covered several early announcements about i.MX 8M Plus systems-on-module (SoM) with Variscite VAR-SOM-MX8M-PLUS and DART-MX8M-PLUS, TechNexion EDM-G-IMX8M-PLUS and AXON-E-IMX8M-PLUS respectively using SO-DIMM edge connectors and board-to-board connectors, as well as SolidRun i.MX 8M Plus SoM that was announced together with the HummindBoard Mate carrier board with dual Gigabit Ethernet. But as Embedded World 2021 Digital is taking place virtually until Friday, other companies have now made their own announcements of i.MX 8M Plus SoMs as the processor enters mass production this month, and since as far as I know, it’s pin-to-pin and software compatible with earlier i.MX 8M Nano/Mini SoCs, the update must have been easy. That means we’ve got a longish list of modules, and I have probably missed some. Supported operating systems are basically the same across […]