Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec has recently announced Six new COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core(Raptor Lake) processors. The module comes with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W.

We’ve noticed a surge in the popularity of COM Express modules and Congatec has recently announced six new conga-TC675r COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core (Raptor Lake) processors that happen to come with soldered RAM instead of the usual SO-DIMM memory slots found in this form factor. The modules come with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W. According to Congatec, this device is designed to work under extreme temperatures (-40°C to +85°C), and is built to withstand the highest standards for shock and vibrations notably thanks to the user of soldered onboard RAM, making this device suitable for off-road vehicles for mining, construction, agriculture, forestry, and other demanding mobility applications. Previously we have seen manufacturers like ADLINK announce COM Express modules based on the 13th Gen architecture, and both ADLINK and Congatec have also just […]

conga-STDA4 SMARC 2.1 module features TI TDA4VM/DRA829J Jacinto 7 processor

conga-STDA4 SMARC Module TI Jacinto 7 TDA4VM DRA829J

congatec conga-STDA4 is a SMARC Computer-on-Module (CoM) based on Texas Instruments TDA4VM or DRA829J Jacinto 7 processor with two Cortex-A72 cores, six real-time Cortex-R5 cores for functional safety, accelerated vision and AI processing capabilities, and plenty of interfaces. The first Texas Instruments-powered CoM from the company is designed for industrial mobile machinery requiring near-field analytics, such as automated guided vehicles and autonomous mobile robots, construction and agricultural machinery, as well as any industrial or medical solutions requiring energy-efficient computer vision at the edge. conga-STDA4 specifications: SoC – Texas Instruments Jacinto 7 TDA4VM/DRA829J with Dual-core Arm Cortex-A72 up to 2.0 GHz 6x Arm Cortex-R5F cores @ 1.0 GHz up to 8 MB of on-chip L3 RAM 1x C7x DSP up to 80 GFLOPs 2x C66 DSPs up to 40 GFLOPs Up to 8 TOPS MMA AI accelerator PowerVR Rogue 8XE GE8430 3D GPU with support for OpenGL ES 3.1, OpenVX, OpenCL […]

conga-HPC/cRLS Raptor Lake COM-HPC Client module supports up to 128GB DDR5 RAM

Congatec conga HPC/cRLS COM HPC Client Size C Raptor Lake CPU

Congatec conga-HPC/cRLS is a COM-HPC Client Size C computer-on-module based on a 13th gen Intel Raptor Lake processor with support for up to 128GB DDR5 memory through four SO-DIMM sockets. The COM-HPC module also provides up to three DDI display interfaces, two 2.5GbE networking interfaces with TSN support, two SATA storage interfaces, and a range of PCIe Gen 3, 4, and 5 interfaces through the two 400-pin connectors defined in the COM-HPC standard. conga-HPC/cRLS specifications: Raptor Lake-S SoC (one or the other) Intel Core i3-13100E with 4x P-cores @ 3.3GHz / 4.4GHz, 12 MB cache, Intel UHD Graphics 730; PBP: 65W Intel Core i5-13400E with 6x P-cores @ 2.4GHz / 4.6GHz, 4x E-cores @ 1.5GHz / 3.3GHz, 20MB cache, Intel UHD Graphics 730; PBP: 65W Intel Core i7-13700E with 8x P-cores @ 1.9GHz / 5.1GHz, 8x E-cores @ 1.3GHz / 3.9GHz, 30MB cache, Intel UHD Graphics 770; PBP: 65W Intel […]

conga-HPC/uATX is a micro-ATX board for COM-HPC Client Type modules

congatec Micro-ATX Carrier Board for COM-HPC Client

congatec has just introduced the conga-HPC/uATX micro-ATX carrier board designed for COM-HPC Client modules size A, B, and C. The board is vendor independent since it is based on the COM-HPC and micro-ATX standards and designed for embedded long-term availability of at least seven years. That means the micro-ATX carrier board works congatec solutions such as the high-end conga-HPC/cALS COM-HPC Client Size C module with up to a 16-core Intel Core i9 Alder Lake-S processor or the more power-efficient conga-HPC/cALP COM-HPC Client Size A modules with Intel Celeron 7305E processor, as well as similar solutions from ADLINK Technology, Advantech, Portwell, and other vendors. conga-HPC-/uATX carrier board specifications: Compatible with COM-HPC Client Type Modules (Size A: 95 x 120mm, Size B: 120 x 120mm, and Size C: 160 x 120mm) with CPU and memory sockets Video Output 3x DP++ with 8.1 Gbps Re-driver 1x eDP (optional for LVDS) Audio HDA codec […]

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel Xeon D: D-2700 and D-1700

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

Alder Lake COM-HPC COM Express

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

SMARC Modules With NXP i.MX 8M Plus Processor (Sponsored)

congatec smarc NXP i.MX8M Plus

Low-power flagship for artificial intelligence – congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with an application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible. That hasn’t always been so easy. Previously, it was usually much more difficult to use the latest processor technology from the Arm environment as a finished system than to implement the x86 environment. This is because, as a result of the historically large range of individually tailored custom designs used in large quantities, the ecosystem of system platforms is not that extensive. However, with the modular approach based on the SMARC computer-on-modules specification, it is now also possible to obtain standard form factors from the x86 box PC range with ARM processors. For example, the embedded computing specialist congatec […]

Congatec COM-HPC & COM Express Xeon modules target high-end IoT gateways, medical edge applications

Tiger Lake-H COM-HPC & COM Express CPU modules

Yesterday, we wrote about ADLink Express-TL COM Express Basic Size Type 6 module powered by the latest Intel Tiger Lake-H Xeon, Core, and Celeron processors designed for high-end industrial & embedded systems. But as one would expect more such modules are coming to market, and Congatec announced both COM-HPC and COM Express CPU modules based on Intel Tiger Lake-H processors with target applications include high-end IoT gateways and medical edge applications. Let’s check out both conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm). conga-HPC/cTLH COM-HPC module Key features and specifications: SoC – Choice of ten Intel Xeon, Core i3/i5i/7, or Celeron 6600HE processors with Intel Xe Gen12 graphics part of Tiger Lake-H family System Memory – Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GB each (128 GB total) with […]

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