Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

We’ve noticed a surge in the popularity of COM Express modules and Congatec has recently announced six new conga-TC675r COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core (Raptor Lake) processors that happen to come with soldered RAM instead of the usual SO-DIMM memory slots found in this form factor. The modules come with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W.

According to Congatec, this device is designed to work under extreme temperatures (-40°C to +85°C), and is built to withstand the highest standards for shock and vibrations notably thanks to the user of soldered onboard RAM, making this device suitable for off-road vehicles for mining, construction, agriculture, forestry, and other demanding mobility applications.

Previously we have seen manufacturers like ADLINK announce COM Express modules based on the 13th Gen architecture, and both ADLINK and Congatec have also just unveiled new COM Express modules based on the 14th Gen Meteor Lake processors.

Congatec COM Express Type 6 Modules (conga-TC675r) Specification:

• CPU Options:
  • Intel Core i7-13800HRE (6P/8E cores, up to 5.0/4.0 GHz, 24MB cache, 45W)
  • Intel Core i7-1370PRE  (6P/8E cores, up to 4.8/3.7 GHz, 24MB cache, 28W)
  • Intel Core i7-1365URE (2P/8E cores, up to 4.9/3.7 GHz, 12MB cache, 15W)
  • Intel Core i5-13600HRE (4P/8E cores, up to 4.8/3.6 GHz, 18MB cache, 45W)
  • Intel Core i5-1350PRE (4P/8E cores, up to 4.6/3.4 GHz, 12MB cache, 28W)
  • Intel Core i3-1320PRE  (4P/4E cores, up to 4.5/3.3 GHz, 12MB cache, 28W)
• Graphics: Intel UHD Graphics or Intel Iris Xe, up to 96 EUs
• DRAM: Up to 32 GB (opt. 64GB) LPDDR5x, 6400 MT/s, dual channel, IBECC
• Mass Storage: NVMe x4 SSD (optional)
• Video Interfaces: Up to 3x DDI (2x shared with USB4), LVDS/eDP, VGA (optional)
• Ethernet: 2.5 GbE with TSN, Intel i226 controller
• I/O Interfaces:
  • Up to 8x PCIe Gen4 PEG (H-Series) or 4x PCIe Gen4 PEG (P-and U-Series)
  • 8x PCIe Gen3
  • 2x USB4
  • 4x USB 3.2 Gen2 + 4x USB 2.0
  • 2x SATA, 2x UART, CAN (opt.), 8x GPIOs, SPI, LPC bus, SM-Bus, I²C bus
• Congatec Board Controller: Multiple features including Multi Stage Watchdog, User Data Storage, Board Statistics, Power Loss Control
• BIOS: AMI Aptio UEFI, 32 Mbyte SPI, LCD Control, Flash Update
• Security: TPM 2.0
• Power Management: ACPI 6.0 with battery support
• Size: 95 x 95 mm (3,74″ x 3,74″) – COM Express Compact form factor
• Temperature Range: Operating: -40°C to 85°C | Storage: -40°C to 85°C
• Humidity: Operating: 10 to 90% r. H. non-cond. | Storage: 5 to 95% r. H. non-cond.
• Operating Systems: Windows 11/10 IoT Enterprise, Linux, Yocto, RTS Hypervisor

The configurations for the COM Express module (conga-TC675r) are shown above, and the company also offers custom hardware configurations tailored for OEMs and industrial requirements.

The company offers a range of software and drivers for Linux, Windows 10, and Windows 10 IoT, including CGOS API support, legacy drivers, Python packages, and the Congatec System Utility for BIOS updates. Additionally, they provide various Intel chipsets and technology drivers, utilities for BIOS customization, and support for graphics and Ethernet, catering to diverse system development needs.

As of now, the price for the conga-TC675r COM Express module with soldered RAM can be requested via a quote on their product page, indicating it’s not directly available for purchase. Congatec also offers a range of solutions and services, details of which can be found on their press release page.

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