hmi

Posted on by Jean-Luc Aufranc (CNXSoft) - 4 Comments on Review of MaTouch_ESP32-S3 4-inch Display Demo Kit with sensors, Arduino, LVGL graphics library

Review of MaTouch_ESP32-S3 4-inch Display Demo Kit with sensors, Arduino, LVGL graphics library

Matouch Environmental Monitor LVGL graphics library

Makerfabs MaTouch_ESP32-S3 4-inch Display Demo Kit is an ESP32-S3 development board with a 4-inch touchscreen display, a TVOC sensor, and a thermal camera. It can be used to make various projects such as electronic photo frames. air quality monitors, or patient screening devices MaTouch_ESP32-S3 4-inch display demo kit unboxing When we unpack the box, we will find the device as in the picture, consisting of the following items: The mainboard of the MaTouch_ ESP32-S3 4-inch Display with the following specifications: Controller –  ESP32-S3-WROOM-1, PCB Antenna, 16MB Flash, 8MB PSRAM, ESP32-S3-WROOM-1-N16R8 Wireless – WiFi & Bluetooth 5.0 Storage – MicroSD card slot LCD 4.0-inch IPS display with  480×480 resolution, 50+ FPS RGB 5/6/5+ SPI interface using ST7701S controller. 5 Points Touch, Capacitive via GT911 touch panel driver. Audio – MAX98357A USB – Dual USB Type-C (one for USB-to-UART and one for native USB); USB to UART Chip: CP2104 Expansion – 2x […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on $14+ Allwinner T113-S3 CPU module comes with 128MB RAM, 256MB NAND flash or 4GB eMMC flash

$14+ Allwinner T113-S3 CPU module comes with 128MB RAM, 256MB NAND flash or 4GB eMMC flash

Allwinner T113-S3 CPU module

MYiR MYC-YT113X is a low-cost solderable CPU module powered by an Allwinner T113-S3 dual-core Cortex-A7 processor with 128MB on-chip DDR3 RAM, and fitted with either a 256MB NAND flash or a 4GB eMMC flash for storage. The industrial temperature grade module provides a lower-end alternative to the company’s earlier MYC-YT507H Allwinner T507-H Cortex-A53 CPU module, and offers various display, camera, audio, Ethernet, USB, and low-speed I/Os through a 140-pin stamp hole design. It is designed for HMI, industrial automation, as well as display and control terminals. MYiR MYC-YT113X specifications: SoC – Allwinner T113-S3 CPU – Dual-core Arm Cortex-A7 @ 1.2 GHz with 32 KB L1 I-cache + 32 KB L1 D-cache per core, and 256 KB L2 cache DSP – Single-core HiFi4 VPU – H.265/H.264 video decoding up to 1080p60 and JPEG/MJPEG video encoding up to 1080p60 Memory – 128 MB DDR3 Storage – 4GB eMMC or 256MB NAND flash, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on LILYGO T-Track ESP32-S3 board combines 1.1-inch AMOLED display with trackball

LILYGO T-Track ESP32-S3 board combines 1.1-inch AMOLED display with trackball

LILYGO T-Track board

After the T-Display-S3 AMOLED board, LILYGO has launched another ESP32-S3 board with an AMOLED display named the T-Track that features a smaller 1.1-inch AMOLED display and a trackball that allows the user to navigate any menu or user interface shown on the display. The rest of the board’s specifications are very similar with an ESP32-S3R8 dual-core chip with 8MB PSRAM providing WiFi and BLE connectivity, a 16MB SPI flash for storage, two rows of pins for up to 18x GPIOs, a Qwicc connector for module expansion, and support for USB-C charging and a LiPo battery for power. T-Track specifications: Wireless MCU – Espressif Systems ESP32-S3R8 dual-core Tensilica LX7 @ up to 240 MHz with vector instructions for AI acceleration, 512KB RAM, 8MB PSRAM, wireless connectivity Storage – 16MB flash Connectivity via ESP32-S3 2.4 GHz 802.11 b/g/n Wi-Fi 4 with 40 MHz bandwidth support Bluetooth Low Energy (BLE) 5.0 connectivity with […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 4 Comments on T-HMI ESP32-S3 board comes with an 2.8-inch touchscreen color display, three Grove expansion connectors

T-HMI ESP32-S3 board comes with an 2.8-inch touchscreen color display, three Grove expansion connectors

ESP32-S3 HMI board resistive touch panel

Lilygo has launched yet another ESP32-S3 board with an integrated display, but the T-HMI has a larger 2.8-inch color display and a resistive touch panel suitable for HMI (Human Machine Interfaces). It is also equipped with three Grove connectors for expansion with sensors or actuators. Like all the recent ESP32-S3 boards from Lilygo, the T-HMI features the ESP32-S3R8 WiFi 4 and Bluetooth MCU with 8MB PSRAM, as well as a 16MB SPI flash, a microSD card slot, a few buttons, and power from USB or a LiPo battery. Lilygo T-HMI board specifications: Wireless MCU – Espressif Systems ESP32-S3R8 dual-core Tensilica LX7 @ up to 240 MHz with vector instructions for AI acceleration, 512KB RAM, 8MB PSRAM, wireless connectivity Storage – 16MB SPI flash, microSD card socket Connectivity via ESP32-S3 2.4 GHz 802.11 b/g/n Wi-Fi 4 with 40 MHz bandwidth support Bluetooth Low Energy (BLE) 5.0 connectivity with long-range support, up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Renesas RZ/G2L CPU module targets HMI and IoT gateway applications

Renesas RZ/G2L CPU module targets HMI and IoT gateway applications

RENESAS RZ/G2L development board

MYIR MYC-YG2LX is Renesas RZ/G2L CPU module with up to 4GB DDR4, 32GB eMMC flash, and various I/Os such as gigabit Ethernet, USB 2.0, camera and display interfaces accessible through 222 castellated holes, and designed for advanced HMI, IoT edge gateways, and other embedded devices with video capabilities. As a reminder, the Renesas RZ/G2L microprocessor comes with up to two Arm Cortex-A55 cores clocked at 1.2 GHz, one 200 MHz Cortex-M33 real-time core, a Mali-G31 GPU for 3D graphics interfaces, and a VPU capable of H.264 encoding/decoding. The company also offers the MYD-YG2LX development board based on the 45x43mm MYC-YG2LX CPU module with easy access to its interfaces. MYIR MYC-YG2LX Renesas RZ/G2L CPU module MYC-YG2LX module specifications: SoC – Renesas RZ/G2L (R9A07G044L23GBG) dual-core Cortex-A55 processor with Cortex-M33 core @ 200 Mhz, Arm Mali-G31 GPU, H.264 hardware video decoding/encoding System Memory – 1 or 2GB DDR4 (option for up to 4GB) […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on OSD62x SiP combines TI AM62x processor with LPDDR4, EEPROM, PMIC, and passives into a single package

OSD62x SiP combines TI AM62x processor with LPDDR4, EEPROM, PMIC, and passives into a single package

OSD62x system-in-package

Octavo Systems OSD62x is a system-in-package (SiP) combining the Texas Instruments AM62x processor with LPDDR4 RAM, EEPROM, power management, oscillators, and passive components, plus optional features such as an RTC and an 8-channel ADC. At least that’s true for the OSD62x Max Integration SiP (22×22 mm BGA), but Octavo Systems also have a smaller 14x9mm package called the OSD62x Size Optimized with “just’ the AM62x processor, LPDDR4 memory, and passive components. OSD62x “Max Integration” specifications: SoC – Texas Instruments AM62x (AM623/AM625) CPU – Up to 4x Arm Cortex-A53 @ 1.4GHz MCU – Arm Cortex-M4F GPU – 3D graphics up to 2048×1080 @ 60 fps (AM625 only) Storage I/F – 1x eMMC, 2x SDIO, 1x GPMC Display I/F – 24-bit RGB MIPI DPI and OLDI/LVDS Camera I/F – 1x MIPI CSI-2 with DPHY 1.2 Networking – 2x 10/100/1000M Gigabit Ethernet with TSN support USB – 2x USB 2.0 interfaces PRU-ICSS Other […]

Posted on by Leo Zachary - 1 Comment on 100ASK-T113-Pro Allwinner T113-S3 industrial board, and Allwinner T113-S4 with 256MB DDR3

100ASK-T113-Pro Allwinner T113-S3 industrial board, and Allwinner T113-S4 with 256MB DDR3

100ask T113-S3 board

Last year, Jean-Luc introduced the T113-S3 processor and the small MangoPi-Dual board with T113-S3. This time, I will introduce a development board with relatively rich resources, the 100ASK-T113-PRO, which consists of a core board with T113-S3 and a carrier board with a large number of peripheral interfaces, and the upcoming Allwinner T113-S4 SoC with 256MB DDR3. 100ASK-T113-Pro Allwinner T113-S3 industrial board While the T113-S3 and D1s/F133 RISC-V processors are pin-to-pin compatible, the T113-S3 is a dual-core Arm Cortex-A7 processor with HiFi4 DSP, CAN interfaces added (CAN is not mentioned publicly, but can be seen in the T113-S3 Datasheet) and 128MB DDR3 on-chip memory.   100ASK-T113-PRO preliminary specifications: T113-S3 Core Lite: SoC – Allwinner T113-S3 CPU – Dual-core Arm Cortex-A7 with 32 KB L1 I-cache + 32 KB L1 D-cache per core, and 256 KB L2 cache DSP – Single-core HiFi4 Memory – 128 MB DDR3 (SIP) Storage – 16MB SPI NandFlash […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 10 Comments on ASUS unveils Tinker V RISC-V single board computer, Tinker board 3 SBC with Rockchip RK3568 SoC

ASUS unveils Tinker V RISC-V single board computer, Tinker board 3 SBC with Rockchip RK3568 SoC

ASUS Tinker V RISC-V SBC

ASUS IoT has added two new members to the Tinker board family with the Tinker V and Tinker Board 3 single board computers powered by respectively Renesas RZ/Five single-core RISC-V SoC and Rockchip RK3568 quad-core Arm Cortex-A55 processor. ASUS Tinker V RISC-V SBC Tinker V specifications: SoC – Renesas RZ/Five single core AndesCore AX45MP RISC-V processor clocked at 1.0 GHz System Memory – 1GB DDR4 Storage – MicroSD card slot, optional 16GB eMMC flash, optional SPI flash Networking – 2x Gigabit Ethernet RJ45 ports USB – 1x Micro USB port, 1x Micro USB (OTG) port Serial – 2x CAN Bus via 6-pin terminal block 2x COM RS232 via 5-pin terminal block Expansion – 20-pin GPIO header with up to 2x UART, 2x I2C, 4x GPIO, 2x ADC, 1x SPI, 3.3V, and GND Debugging – JTAG pin header Power Supply – 10 to 24V DC via 5.5/2.5 mm DC barrel jack […]

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