Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel Xeon D: D-2700 and D-1700

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

Intel unveils Alder Lake desktop and mobile IoT processors

Intel Alder Lake-H Mobile IoT processsor

Intel introduced high-end Alder Lake Hybrid processor family for consumer devices a couple of months ago, with Pentium G7400 and Celeron G6900 leaking a few weeks later, and now the company has formally announced the Alder Lake-S and Alder Lake-H processor families for respectively desktop IoT and mobile IoT solutions, as well as more efficient U-series and P-series of 12th Gen Intel Core Alder Lake IoT processors with a TDP ranging from 15W to 28W. Alder Lake S-Series desktop processors for IoT Key features and specifications: CPU Up to 16 cores, up to 24 threads in IoT SKUs Up to 30 MB Intel Smart Cache TDP – 35W to 65W Real-time capability on select SKUs Graphics/Video Intel UHD Graphics 770 driven by Intel Xe architecture with up to 32 EUs Up to four independent displays up to 4K or one display at 8K resolution Up to two video decode boxes […]

Onera Health unveils Onera Biomedical-Lab-on-Chip with over a dozen sensor inputs

Onera Biomedical Lab-on-Chip

Onera Health, a Dutch-American MedTech company has just introduced the Onera Biomedical-Lab-on-Chip, an ultra-low-power biosignal sensor hub for wearable health, following their earlier work on sleep diagnostic solutions. The Arm Cortex-M4F based Onera ONE010 chip embeds a multi-channel sensor readout system with integrated data processing, power management, and interfacing features. It features biomedical inputs with 10 readouts for ExG, covering EEG, ECG, EMG, and EOG, 2 bioimpedance readouts, and 2 readouts for photoplethysmography, as well as digital filters and accelerators to process the data from the sensors. The microcontroller is also equipped with several standard wired interfaces such as UART, SPI, I2C, and I2S, operates from a single power source between 0.8V and 3.6V, and the company says a large amount of SRAM and embedded FLASH is available. I’ve managed to obtain a more readable block diagram and that means 320KB of SRAM and 768KB of flash. We can also […]

COM Express Type 6 module supports up to 64GB ECC RAM, 2.5GbE, 4 displays, and more

COM Express Type 6 module ECC RAM

Here’s another Tiger Lake UP3 COM Express module courtesy of AAEON with the COM-TGUC6 COM Express Compact Type 6 modules equipped with a choice of Celeron. Core i3/i5/i7 embedded processors from the 11th generation Tiger Lake family. The module supports up to 64 GB ECC RAM via two SO-DIMM sockets, 2.5 Gpbs Ethernet, up to four independent displays via LVDS, VGA, and 4K DDI interfaces, SATA storage, PCIe Gen 3 & Gen4, and more for industrial. medical, and military applications. COM-TGUC6 specifications: Tiger Lake UP3 SoC (one or the other) Intel Core i7-1185G7E/GRE quad-core/octa-thread processor @ 1.8/4.4 GHz with 12 MB cache, 96 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i7-1145G7E/GRE quad-core/octa-thread processor @ 1.5/4.1 GHz with 8 MB cache, 80 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i3-1115G4E/GRE dual-core/quad-thread processor @ 2.2/3.9 GHz with 6 MB cache, 48 EU […]

Portwell COM Express Tiger Lake-H module supports 2.5GbE, PCIe Gen 4, 8K, up to 64GB DDR4

Portwell PCOM-B657VGL COM Express TIger Lake-H

Portwell PCOM-B657VGL joins other COM Express and COM HPC modules based on Intel Tiger Lake-H Xeon, Core, and Celeron embeddded processors such as ADLINK Express-TL and Congatec conga-HPC/cTLH. Just like its competitors, the Portwell COM Express Type 6 Basic module offers 8K video output, PCIe x16 Gen 4, up to 64GB DDR4, USB 3.2 Gen 2, and 2.5GbE networking for a wide range of higher-end embedded applications such as industrial automation, medical equipment, graphics-intensive applications, and artificial intelligence. Portwell PCOM-B657VGL specifications: SoC (one or the other) General Embedded Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 Cache, 16EU Intel UHD graphics, 35W TDP Intel Core i3-11100HE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.4GHz in Turbo Boost) with 8MB L3 Cache, 16EU Intel UHD graphics, 45/35W cTDP Intel Core i5-11500HE processor with 6 cores / 12 threads @ 2.6GHz (up to 4.1GHz in Turbo […]

NVIDIA Jetson AGX Orin 12-core Cortex-A78E module delivers up to 200 TOPS

Jetson AGX Orin

The upcoming NVIDIA Jetson AGX Orin module packs some serious processing power with a 12-core Cortex-A78AE processor, 2048 CUDA cores, and 64 Tensor cores delivering up to 200 TOPS of AI performance, or 6 times more than its predecessor, the Jetson AGX Xavier module. Designed for robotics, autonomous machines, medical devices, the Jetson AGX Orin delivers the same performance as a GPU-enabled server, but in a much more compact 100 x 87mm form factor. The module can be operated in three power modes, namely 15W, 30W, or 50W depending on performance and power requirements, and a compact developer kit will also be made available. Jetson AGX Orin specifications: CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor with 3MB L2 + 6MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores @ 1 GHz DL Accelerator – 2x NVDLA v2.0 Vision Accelerator […]

OpenNCC Nighthawk – A face blurring AI camera based on Myriad X VPU

OpenNCC Nighthawk Myriad X AI camera

We’ve just written about OpenCV Ai Kit Lite computer vision camera based on Intel Myriad X VPU, and OpenNCC Nighthawk is another such programmable camera based on the Intel AI accelerator, but with an IR filter for night vision, and working with OpenNCC-SDK notably supporting real-time face blurring for enhanced privacy. OpenNCC Nighthawk specifications: VPU – Intel Movidius Myriad X MA2085 up to 4 TOPS RAM – 8 Gbits (1GB) LPDDR4 Camera 2MP camera up to 1920 x 1080 @ up to 30fps ~114° Field of View (DFOV) 2.2mm focal length Lens TTL (through the lense) – 24mm Mount – M12 x 0.5mm thread size Day&Night IR Filter – Solenoid excitation type, automatically switch between 0.1~2 lux IR LED – 850nm up to 5m Output Data format – YUV420, YUV422, MJPG, H.264 Misc – Reset, GPIO Host Interface – USB 3.1 TYPE-C port Temperature Range – 0°- 50° The camera […]

Feature-packed i.MX 8M Plus SBC offers dual GbE, PCIe, RS485, CAN Bus, 4G & 5G modems, and more

OKMX8MP-C i.MX 8M Plus SBC

We’ve already covered plenty of NXP i.MX 8M Plus systems-on-module and carrier boards, but here’s another solution with Forlinx OKMX8MP-C SBC single board computer based on FETMX8MP-C SoM with 4GB LPDDR4 and 16GB eMMC flash. The feature-packed board also offers dual Gigabit Ethernet, 4G and 5G cellular connectivity support via mPCIe and M.2 sockets, multiple display and camera interfaces, RS485 and CAN Bus connector, USB interfaces, various expansion headers, and more… Forlinx OKMX8MP-C specifications: Forlinx FETMX8MP-C System-on-Module SoC – NXP i.MX8M Plus with quad-core Cortex-A53 processor @ up to 1.6 GHz, Arm Cortex-M7 real-time core, Vivante 2D/3D GPUs, 1080p60 video decoder/encoder, 2.3 TOPS AI accelerator System Memory –  2GB, 4GB (default), 6GB, or 8GB LPDDR4 Storage – 16GB eMMC flash Ultra-thin board-to-board connector (4x 80-pin connector with 0.5mm pitch) Supply Voltage – 5V Temperature Range – -40°C to +85°C Dimensions – 62 x 36 mm (8-layer ENIG PCB) Storage – […]