module News - Page 2 of 15 - CNX Software

August 2, 2024 by Tomisin Olujinmi - 2 Comments

200 MHz Microchip dsPIC33A 32-bit digital signal controller offers double-precision FPU, high speed analog interfaces

Top digital signal controller (DSC) vendor, Microchip Technology Inc., has launched the dsPIC33A series as the newest addition to its portfolio of high-performance DSCs. These digital signal controllers combine the capabilities of a digital signal processor (DSP) with the extensive peripherals of a microcontroller (MCU). The dsPIC33A series is built around a 32-bit architecture and operates at 200MHz – currently the highest clock speed for a dsPIC. The core includes a double-precision floating-point unit (DP FPU) and a DSP instruction set for numerically intensive operations in closed-loop control algorithms. The dsPIC33A architecture offers high-performance, high-precision real-time control and signal processing in various applications. The family of DSCs launching the dsPIC33A series, dsPIC33AK128MC1xx, features up to 128KB of flash memory, and an extensive set of built-in peripherals. It comes in different packages, including SSOP, VQFN, and TQFP, with pin counts ranging from 28 to 64 and sizes starting as small as […]

July 31, 2024 by Debashis Das - No Comments

Ezurio Sona NX611 – An NXP IW611-powered Wi-Fi 6 industrial IoT module

Ezurio, formerly Laird Connectivity, has announced the Sona NX611, a new Wi-Fi 6 module designed for industrial IoT applications. The module uses the NXP IW611 chipset and supports Wi-Fi 6 (802.11ax) and Bluetooth 5.4. It operates in the 2.4 GHz and 5 GHz bands, achieving data rates up to 600 Mbps, and can withstand industrial temperatures from -40°C to +85°C. The Sona NX611 comes in several form factors, including SiP (System-in-Package), M.2 1216 SMT, and M.2 2230 E-Key pluggable options. It is compatible with NXP processors and supports Ezurio’s Linux connectivity stack software and Android OS. The module is under development and is expected to be in mass production by September 2024. It will have global certifications like FCC, ISED, UKCA, CE, and Bluetooth SIG. Previously we have seen the IW611 and IW612 modules were used in the u-blox MAYA-W2 IoT module. We have also written about Laird RM126x LoRaWAN […]

July 30, 2024July 31, 2024 by Debashis Das - 8 Comments

Quectel LG290P is the world’s first quad-band GNSS module (L1, L2, L5, and E6)

Quectel LG290P Multi constellation and multi Band GNSS module

The Quectel LG290P is a quad-band, multi-constellation, high-precision, real-time kinematic (RTK) GNSS module that supports GPS, GLONASS, Galileo, BDS, QZSS, and NavIC constellations. A typical GNSS module like the SparkFun GNSS L1/L5 can receive signals from only one or two frequency bands, but the Quectel module can receive signals from four different frequency bands (L1, L2, L5, and E6) simultaneously and features built-in anti-jamming technology for improved signal reception in challenging environments. All these measures make this chip suitable for high-precision navigation applications like autonomous robots, UAVs, precision agriculture, surveying and mapping, and autonomous driving. Previously we have written about higher precision GPS modules like the SparkFun RTK EVK module, SparkFun RTK Torch module, the Cavli C17QS IoT GNSS module and much more feel free to check those out if you are interested in those topics. Quectel LG290P GNSS module specification Main module- LG290P GNSS Frequency bands and constellations GPS – L1 […]

July 9, 2024July 9, 2024 by Debashis Das - No Comments

4-inch LF40 square touchscreen display modules are designed for Luckfox Pico Ultra development board

Luckfox IPS Touch Displays LF40 480480 ARK and LF40 720720 ARK

Luckfox LF40-480480-ARK and LF40-720720-ARK are two new 4-inch square touchscreen display modules specially designed for the Luckfox Pico Ultra micro Arm Linux development board. Both displays feature IPS panels with wide viewing angles and capacitive touch input. The display modules connect to the Pico Ultra board via the RGB666 interface ensuring compatibility with the board. Both displays have a brightness of 400cd/m² and an operating temperature range of -20~70°C. The main differences between the two boards are in the resolution, color gamut, and contrast ratio. The LF40-720720-ARK has a resolution of 720×720 pixels with a wider color gamut of 68% NTSC and a 1000:1 contrast ratio. The LF40-480480-ARK on the other hand features a 480×480 pixels display, with an unspecified color gamut and 380:1 contrast ratio. Previously we have written about various products with rounded and semi-rounded displays like the Waveshare RP2040-LCD-0.99-B, the Waveshare ESP32-S3 1.69-inch touch display, the SB-Components […]

June 17, 2024June 18, 2024 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Cavli C17QS Cat 1.bis cellular IoT and GNSS module offers more memory, global support, a new FreeRTOS SDK

Cavli C17QS Cat 1.bis cellular IoT module with FreeRTOS SDK

Cavli Wireless C17QS is a Cat 1.bis cellular IoT and GNSS module that builds up on the Qualcomm QCX216-powered C16QS Cat 1.bis Cellular IoT module introduced last year, with more memory (2MB RAM) and storage (8MB flash), a wider range of LTE bands, multi-band (L1 and L5) GNSS, and a new FreeRTOS SDK for more flexibility compared to the C16QS. The Cavli C17QS Cat 1bis module is designed around a Qualcomm QCX217 Arm Cortex-M3 microcontroller clocked at up to 306MHz clock speed and running FreeRTOS real-time operating system. The module features a range of interfaces including UART, USB 2.0, USIM, SWD, ADCs, I2S, I2C, SPI, and GPIO pins. The new module is pin-to-pin compatible with the C16QS module for easier design upgrades. Cavli C17QS specifications: Wireless IC – Qualcomm QCX217 Arm Cortex-M3 @ 306 MHz, cellular modem-RF Memory – 2MB RAM Storage – 8 MB flash Cellular connectivity LTE CAT […]

June 6, 2024June 8, 2024 by Debashis Das - 7 Comments

NiCE5340 SoM packs Nordic nRF5340 MCU, Lattice iCE40 FPGA, and 11 sensors into a tiny 29x16mm form factor

Stefano Viola’s NiCE5340 SoM is built around a Nordic Semi nRF5340 Bluetooth SoC, an iCE40 FPGA, 11 sensors, a battery charger, and various other peripherals in a 29×16 mm form factor. The nRF5340 used in the SoM is a low-power, dual-core Arm Cortex-M33 SoC with Bluetooth 5.4, Bluetooth LE (BLE), Thread, Zigbee, and other proprietary protocols. Meanwhile, the Lattice iCE40 FPGA features 3520 logic cells, 80 Kbits of embedded Block RAM, I2C, and SPI blocks, and many other features that make it suitable for applications like environmental monitoring, health tracking, and others. Previously, we have written about Unexpected Maker NANOS3, TinyS3, FeatherS3, and ProS3 boards, and ESP32-S3 4G dev board which all fall under the tiny and compact board category but this is the first time we have seen an MCU board with so many features built into a module of that size. Stefano Viola’s NiCE5340 SoM Specification ICs Nordic […]

May 22, 2024May 22, 2024 by Jean-Luc Aufranc (CNXSoft) - 9 Comments

Tiny XIAO ESP32C6 WiFi, BLE, and 802.15.4 IoT board offers up to 16 GPIO pins

Seeed Studio has added yet another member to their XIAO board family with the XIAO ESP32C6 powered by an ESP32-C6 WiFi 6, Bluetooth LE 5, and 802.15.4 (Thread/Zigbee) RISC-V microcontroller and offering up to 16 GPIOs (headers + pads) in a tiny 21 x 17.5 mm form factor that’s smaller than a typical stamp and makes it one of the smallest ESP32-C6 boards around. The company started the XIAO family with the Seeeduino XIAO (Microchip SAMD21G18) in 2020, and since then they’ve made several other variants with different processors including the XIAO RP2040, XIAO ESP32C3, and XIAO ESP32S3. The XIAO ESP32C6 is the latest (10th) iteration of the board and the first to support WiFi 6, BLE, and 802.15.4 wireless connectivity. XIAO ESP32C6 specifications: Wireless MCU – Espressif Systems ESP32-C6 CPU Single-core 32-bit RISC-V clocked up to 160 MHz Low-power RISC-V core @ up to 20 MHz Memory – 512KB […]

May 16, 2024 by Dennis Mwihia - 2 Comments

MemryX MX3 edge AI accelerator delivers up to 5 TOPS, is offered in die, package, and M.2 and mPCIe modules

Jean-Luc noted the MemryX MX3 edge AI accelerator module while covering the DeGirum ORCA M.2 and USB Edge AI accelerators last month, so today, we’ll have a look at this AI chip and corresponding modules that run computer vision neural networks using common frameworks such as TensorFlow, TensorFlow Lite, ONNX, PyTorch, and Keras. MemryX MX3 Specifications MemryX hasn’t disclosed much performance stats about this chip. All we know is it offers more than 5 TFLOPs. The listed specifications include: Bfloat16 activations Batch = 1 Weights: 4, 8, and 16-bit ~10M parameters stored on-die Host interfaces – PCIe Gen 3 I/O and/or USB 2.0/3.x Power consumption – ~1.0W 1-click compilation for the MX-SDK when mapping neural networks that have multiple layers Under the hood, the MX3 features MemryX Compute Engines (MCE) which are tightly coupled with at-memory computing. This design creates a native, proprietary dataflow architecture that utilizes up to 70% […]