Raytac AN7002Q – A smaller nRF7002 Wi-Fi 6 module for industrial IoT applications

AN7002Q-P module

IoT solutions company Raytac has introduced the AN7002Q Wi-Fi 6 module series, which integrates Nordic Semiconductor’s nRF7002 chipset and is designed for Industrial IoT, smart home, healthcare, consumer electronics, and automotive applications. They can be paired with Raytac’s MDBT53 Bluetooth LE modules based on the nRF5340 multiprotocol SoC, supporting Wi-Fi and Bluetooth LE solutions. The AN7002Q is a low-power Wi-Fi 6 module supporting dual-band 2.4 GHz and 5 GHz operation with a maximum PHY data rate of 86 Mbps (MCS7). It is compatible with IEEE 802.11ax, a/b/g/n/ac standards, and connects to a host SoC or MCU via SPI or QSPI interfaces. The module also supports coexistence with Bluetooth LE, Thread, and Zigbee systems, making it ideal for IoT applications. Previously, we covered the Abluetech PTR7002, a low-power wireless module based on the Nordic Semiconductor nRF7002. The PTR7002 has a slightly larger size and offers more GPIO options, while the AN7002Q […]

ESP32-S3-PICO-based OMGS3 is the world’s smallest fully-featured ESP32-S3 module/board

OMGS3 board

Based on the ESP32-S3-PICO system-in-package (SiP), Unexpected Maker OMGS3 is a small, yet full-featured ESP32-S3 module/board whose designer claims is the world’s smallest in its category at just 25x10mm in size. It replaces the earlier Unexpected Maker NanoS3 based on the ESP32-S3FN8 SoC measuring 28 x 11 mm. The OMGS3’s ESP32-S3-PICO SiP integrates a dual-core ESP32-S3 WiFi and BLE wireless SoC, 8MB QSPI flash, and 2MB QSPI PSRAM. The board itself also includes a 3D antenna, an RGB LED, two LEDs for power and charging, and I/Os are exposed through 26 solder pads. Unexpected Maker OMGS3 specifications: SiP – Espressif ESP32-S3-PICO SoC ESP32-S3 dual-core Tensilica LX7 up to 240 MHz with 512KB SRAM, 16 KB RTC SRAM Wireless – WiFi 4 and Bluetooth 5 LE + Mesh Memory – 2MB QSPI PSRAM Storage – 8MB QSPI flash Antenna – High-gain 3D antenna I/Os via 26x solder pads Up to 17x GPIO […]

u-blox EVK-LEXI-R10 evaluation kits feature LEXI-R10 LTE Cat 1bis and MAX-M10S GNSS modules for Cellular IoT and GPS connectivity

EVK LEXI R10 Board

u-blox has developed the EVK-LEXI-R10 evaluation kits to help engineers test and evaluate their LEXI-R10 LTE Cat 1bis cellular modules. These compact modules support data speeds of up to 10Mbit/s for downloads and 5Mbit/s for uploads, all while using very little power. They also include built-in Wi-Fi to scan indoor hotspots and work with u-blox’s CellLocate service for both indoor and outdoor tracking. Available in regional variants, the boards and kits are certified by major mobile operators, including those in the US. The LEXI-R10 series by u-blox features the world’s smallest LTE Cat 1bis modules in the LEXI LGA form factor. The EVK-R10 kits simplify the evaluation of these multi-band LTE Cat 1bis modules. The EVK-R10401D kit supports the LEXI-R10401D module for North American operations, the EVK-R10801D kit supports the LEXI-R10801D module for Europe, Middle East, Africa, and Asia-Pacific, and the EVK-LEXI-R10001D kit supports the LEXI-R10001D module with global coverage. […]

Bluetooth 6.0 features accurate two-way ranging using Channel Sounding, latency reduction, improved scanning efficiency, and more

Bluetooth 6.0 Channel Sounding

The Bluetooth Special Interest Group (SIG) has just announced the release of the Bluetooth 6.0 Core Specification with features and feature enhancements that include Bluetooth Channel Sounding for two-way ranging between BLE devices, decision-based advertising filtering and monitoring advertisers to improve device scanning efficiency, an enhancement to the Isochronous Adaptation Layer (ISOAL) for lower latency and higher reliability, the LL extended feature set, and a frame space update for throughput optimization. Bluetooth 5.4 was released as a minor update mostly adding electronic shelf label (ESL) support in February 2023, or about 18 months ago, but Bluetooth 6.0 is a major update with the most notable feature being Bluetooth Channel Sounding to enable two-way ranging between two Bluetooth LE devices. It’s not the first time we’ve heard about “Bluetooth Channel Sounding” for distance measurements as it was implemented in WiFi 7/6 and Bluetooth 5.4 chipsets such as Synaptics SYN4382 and Broadcom […]

Compex unveils new Wi-Fi 7 dual-band dual-concurrent modules: WLE7002E25, WLTE7002E25 and WLTB7002E25 (Sponsored)

Compex Wi-Fi 7 Dual-Band Dual-Concurrent M.2 mPCIe Modules

Compex Systems (Compex) announces the latest additions to its Wi-Fi 7 modules, WLE7002E25, WLTE7002E25, and WLTB7002E25, expanding its Wi-Fi 7 solution lineup. The updated lineup now includes M.2 variants to its popular dual-band Wi-Fi 7 modules. The new WLE7002E25, one of the first in the industry to feature a standard mini PCIe form factor, promises enhanced wireless performance and reliability at Wi-Fi 6 prices. The similar-sized WLTE7002E25 with an M.2 E Key and WLTB7002E25 with an M.2 B+M Key further broaden the versatility of Compex’s Wi-Fi 7 solutions. Powered by Qualcomm’s QCN6224, QCN6274, and QCN9274 Waikiki series radio chipsets, the new WLE/WLTE/WLTB7002E25 are dual-band dual-concurrent 2.4+5GHz Wi-Fi 7 (802.11be) modules, offering wider signal coverage by transmitting both bands concurrently, reducing latency with Multi-Link Operation (MLO) support, featuring OFDMA and 4096 QAMs. Delivering up to 20dBm per chain, these 2×2 MU-MIMO models are ideal for enterprise, industrial, cybersecurity, transportation, and SMB applications. […]

Infineon AIROC CYW20829 Bluetooth LE 5.4 MCU and module family targets industrial, consumer, and automotive applications

Infineon AIROC CYW20829 Bluetooth Low Energy 5.4 microcontrollers

Infineon has recently released the AIROC CYW20829 Bluetooth LE (Low Energy) 5.4 family which now includes SoCs and modules. These SoCs include two Cortex-M33 MCU cores: one 48 or 96 MHz application core for the peripherals, security, and system resources, and one communication core for the 2.4 GHz RF transceiver with up to 10 dBm transmit power and -98 dBm receive sensitivity. This high integration reduces bill-of-material (BOM) costs for a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, home automation, and others. Back in 2021, we saw Infineon release the AIROC CYW5557x family of Wi-Fi 6/6E SoCs for IoT and streaming devices with features like enhanced range and improved network efficiency. More recently,  Infineon announced the PSOC Edge E81, E83, and E84 MCU based on Cortex-M55/M33 microcontrollers. Feel free to check those out if you are looking for Infineon-specific MCUs. Infineon AIROC […]

Abluetech PTR7002 WiFi 6 and PTR5302 WiFi 6 and BLE 5.4 modules feature Nordic Semi nRF7002/nRF5340 wireless chips

PTR5302 nRF7002 nRF5340 WiFi 6 BLE module

Shenzhen-based Abluetech has launched two low-power wireless modules based on Nordic Semi nRF7002 and nRF5340 wireless chips. The PTR7002 is a dual-band WiFi 6 module based on the nRF7002 chip, and the PTR5302 module combines the nRF7002 with the nRF5340 wireless microcontroller to offer dual-band WiFi 6 and Bluetooth LE 5.4 connectivity Abluetech PTR7002 dual-band WiFi 6 module with nRF7002 PTR7002 specifications: Chipset – Nordic Semi nRF7002 Wireless Dual-band Wi-Fi 6 Tx power  – Up to +21dBm Rx sensitivity –  -96.5dBm @ 2.4GHz / -90.5dBm @ 5GHz PHY bandwidth – Up to 86 Mbps (MCS7) 1SISO; 20MHz bandwidth Modes – Station, Wi-Fi Direct, Soft AP (Wi-Fi 4 operation only), simultaneous Station +Soft AP/Wi-Fi Direct/Station modes. 2.4GHz and 5GHz dual-band PCB antenna Range – Up to 300 meters Host interface – SPI / QSPI; AT command set Supply Voltage – 2.9 to 4.5V Power Consumption (@ 3.6V TBC) Tx peak current […]

Solder Party’s “RP2350 Stamp” modules features Raspberry Pi RP2350A or RP2350B microcontroller

RP2350 Stamp RP2350 Stamp XL

Solder Party’s RP2350 Stamp is an update to the company’s tiny RP2040 Stamp module based on a Raspberry Pi RP2350A, and they also introduced the RP2350 Stamp XL module that makes use of the extra GPIO pins on the RP2350B, and a “RP2xxx Stamp Carrier XL” carrier board taking either module. RP2350 Stamp and RP2350 Stamp XL The RP2350 Stamp has exactly the same layout as the RP2040 Stamp and mostly benefits from the more powerful Cortex-M33 cores, additional memory, and security features, while the XL variant adds more GPIOs, footprint for a PSRAM chip, as well as UART and SWD connectors. Both come with a 16MB SPI flash for storage. RP2350 Stamp specifications: Microcontroller – Raspberry Pi RP2350A MCU CPU – Dual-core Arm Cortex-M33 processor @ 150MHz Memory – 520KB internal RAM 8KB OTP Storage Package – QFN-60; 7×7 mm Storage – 16MB flash I/Os – All 30x I/Os […]

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