Remi Pi is a compact, low-cost SBC powered by a Renesas RZ/G2L Cortex-A55/M33 SoC

Remi Pi SBC

MYiR Tech Remi Pi is a low-cost SBC based on the company’s MYC-YG2LX CPU module featuring a Renesas RZ/G2L Arm Cortex-A55/M33 processor, 1GB RAM,  8GB eMMC flash, and plenty of ports and interfaces. Those include two gigabit Ethernet ports, a wireless module with dual-band WiFi 4 and Bluetooth 4.2 connectivity, HDMI and LVDS display interfaces, MIPI CSI camera input, a 3.5mm audio jack, a few USB ports, and a 40-pin GPIO header compatible with the one on the popular Raspberry Pi SBCs. Remi Pi specifications: System-on-Module – MYiR MYC-YG2L23 module with SoC – Renesas RZ/G2L processor (R9A07G044L23GBG) CPU 1.2 GHz dual-core Arm Cortex-A55 processor 200 MHz Arm Cortex-M33 real-time core GPU – Arm Mali-G31 3D GPU VPU – H.264 decoding/encoding System Memory – 1GB DDR4 Storage – 8GB eMMC flash, 32KB EEPROM PMIC – Renesas RAA215300 power management IC Storage – MicroSD card slot Display interfaces HDMI video output LVDS […]

Allwinner T527 System-on-Module features octa-core Cortex-A55 CPU, 2 TOPS AI accelerator

Allwinner T527 system-on-module

MYiR MYC-LT527 is a compact System-on-Module (SoM) based on Allwinner T527 octa-core Arm Cortex-A55 SoC with a 2 TOPS AI accelerator, up to 4GB RAM, 32GB flash, and a land grid array (LGA) comprised of 381 pads with a range of interfaces for displays and cameras, networking, USB, and PCIe, and more. The company also introduced the MYD-LT527 development board to showcase the capabilities of the Allwinner T527 CPU module suitable for a range of applications such as industrial robots, energy and power management, medical equipment, display and controller machines, edge AI boxes and boards, automotive dashboards, and embedded devices that require media and AI functionalities. MYC-LT527 Allwinner T527 System-on-Module MYC-LT527 specifications: SoC – Allwinner T527 CPU Octa-core Arm Cortex-A55 processor with four cores @ 1.80 GHz and four cores @ 1.42GHz E906 RISC-V core up to 200 MHz DSP – 600MHz HIFI4 Audio DSP GPU – Arm Mali-G57 MC1 […]

Renesas RZ/G2UL Arm Cortex-A55/Cortex-M33 industrial system-on-module sells for as low as $17 in volume

Renesas RZ/G2UL development board

MYiR Tech MYC-YG2UL is a tiny (39x37mm) system-on-module based on the Renesas RZ/G2UL SoC with a 1GHz Arm Cortex-A55 application core and 200MHz real-time Cortex-M33 cores designed for industrial HMIs and gateways, and the company has also launched the MYD-YG2UL development board with the module and interfaces such dual gigabit Ethernet, RS485, RS232, CAN Bus, and more. MYC-YG2UL Renesas RZ/G2UL CPU module Specifications: SoC – Renesas RZ/G2UL (Type-I) CPU – Arm Cortex-A55 processor at up to 1 GHz MCU – Arm Cortex-M33 clocked at up to 200 MHz GPU – 2D graphics (Image Scaling Unit) System Memory – 512MB DDR3L Storage – 4GB eMMC flash, 4KB EEPROM 1.0mm pitch 140-pin castellated holes and 50-pin LGA Display – RGB LCD interface Camera – MIPI CSI interface Networking – 2x RGMII (gigabit Ethernet) USB – 2x USB 2.0 Analog – 2x ADC Other I/Os – 5x SCIF, 2x SCI, 2x CAN FD, 4x […]

SemiDrive D9-Pro (D9360) Arm Cortex-A55/R5 processor powers industrial CPU module for motor control

MYD JD9360 SemiDrive D9 Pro Development Board

MYiR MYC-JD9360 is a CPU Module powered by SemiDrive D9-Pro (D9360) processor with six Arm Cortex-A55 application cores, a dual-core lock-step Cortex-R5 real-time core along with a PowerVR GPU, 4Kp30 H.265/H.264 VPU and a 0.8 TOPS NPU, and designed for motion control and industrial applications. The MYC-JD9360 CPU module also comes with 2GB LPDDR4, 16GB eMMC flash, 16MB QSPI Flash, 256Kbit EEPROM, and exposes I/Os such as PCIe 3.0, USB 3.0, CAN FD, and TSN-enabled Gigabit Ethernet through a 314-pin MXM connector. The company also provides the MYD-JD9360 development board to quickly get started with the module and evaluate the solution. MYiR MYC-JD9360 CPU module with SemiDrive D9-Pro SoC Specifications: SoC – SemiDrive D9-Pro (D9360) CPU Application – Hexa-core Arm Cortex-A55 processor @ 1.6 GHz Real-time – Dual-core lock-step Cortex-R5 cores @ 800MHz GPU – Imagination PowerVR 9XM GPU @ 100 GFLOPS VPU – 4Kp30 H.265/VP8/VP9 video decoder, 4Kp30 H.264 […]

Ultra-compact 45x43mm CPU module features TI Sitara AM6231, AM6252, or AM6254 Arm SoC

Texas Instruments Sitara AM6254 development board

MYiR Tech has just announced the tiny, yet full-featured MYC-YM62X CPU module powered by Texas Instruments Sitara AM6231, AM6252, or AM6254 Cortex-A53/M4 processor for HMI and IoT applications as well as the corresponding MYD-YM62X development board used for evaluation. The new MYiR module joins other Texas Instruments AM62x system-on-modules such as Toradex Verdin AM62, Forlinx FET625x-C, Variscite VAR-SOM-AM62, and others, but at just 45x43mm, it is the smallest AM62x CPU module we’ve seen so far yet the company says it still provides access to all features from the processor thanks to its 222 castellated holes. MYC-YM62X CPU Module Specifications: SoC (one or the other) Texas Instruments AM6254 (AM6254ATCGGAALW) with quad-core Cortex-A53 @ 1.4GHz, Cortex-M4F real-time core @ 400MHz, 3D GPU, 2x PRU-SS running up to 333MHz Texas Instruments AM6252 (AM6252ATCGGAALW) with dual-core Cortex-A53 @ 1.4GHz, Cortex-M4F real-time core @ 400MHz , no GPU, PRU-SS running up to 333MHz Texas Instruments […]

Tiny STM32MP135 system-on-module comes with up to 512MB RAM, 256MB NAND flash or 4GB eMMC flash

MYC-Y135 development board

MYiR Technology’s MYC-YF13X is a system-on-module powered by the latest STMicro STM32MP135 cost-optimized Cortex-A7 microprocessor with 256MB or 512MB DDR3L, 256MB NAND Flash or 4GB eMMC flash, and 32Kbit EEPROM. The new MYC-YF13X has the same 39x37mm stamp-size form factor as the company’s earlier MYC-YA15XC-T CPU module based on the STM32MP15 Cortex-A7 processor, and a development board is also provided with LCD and camera interfaces, dual Gigabit Ethernet, RS485/RS232/CAN bus interfaces, and more. MYC-YF13X specifications: SoC – STMicro STM32MP135 (STM32MP135DAF7) single-core Cortex-A7 processor up to @ 1 GHz Two configurations for memory and storage 256MB DDR3L, 256MB NAND Flash, 32KB EEPROM or 512MB DDR3L, 4GB eMMC Flash, 32KB EEPROM 148-pin stamp hole expansion interface (1.0mm pitch) Display I/F – RGB Interface Camera – Parallel camera Audio – 4x I2S, 2x SAI Networking – 2x RGMII interface USB – 2x USB 2.0 Up to 8x UART Up to 5x I2C Up […]

$14+ Allwinner T113-S3 CPU module comes with 128MB RAM, 256MB NAND flash or 4GB eMMC flash

Allwinner T113-S3 CPU module

MYiR MYC-YT113X is a low-cost solderable CPU module powered by an Allwinner T113-S3 dual-core Cortex-A7 processor with 128MB on-chip DDR3 RAM, and fitted with either a 256MB NAND flash or a 4GB eMMC flash for storage. The industrial temperature grade module provides a lower-end alternative to the company’s earlier MYC-YT507H Allwinner T507-H Cortex-A53 CPU module, and offers various display, camera, audio, Ethernet, USB, and low-speed I/Os through a 140-pin stamp hole design. It is designed for HMI, industrial automation, as well as display and control terminals. MYiR MYC-YT113X specifications: SoC – Allwinner T113-S3 CPU – Dual-core Arm Cortex-A7 @ 1.2 GHz with 32 KB L1 I-cache + 32 KB L1 D-cache per core, and 256 KB L2 cache DSP – Single-core HiFi4 VPU – H.265/H.264 video decoding up to 1080p60 and JPEG/MJPEG video encoding up to 1080p60 Memory – 128 MB DDR3 Storage – 4GB eMMC or 256MB NAND flash, […]

Renesas RZ/G2L CPU module targets HMI and IoT gateway applications

RENESAS RZ/G2L development board

MYIR MYC-YG2LX is Renesas RZ/G2L CPU module with up to 4GB DDR4, 32GB eMMC flash, and various I/Os such as gigabit Ethernet, USB 2.0, camera and display interfaces accessible through 222 castellated holes, and designed for advanced HMI, IoT edge gateways, and other embedded devices with video capabilities. As a reminder, the Renesas RZ/G2L microprocessor comes with up to two Arm Cortex-A55 cores clocked at 1.2 GHz, one 200 MHz Cortex-M33 real-time core, a Mali-G31 GPU for 3D graphics interfaces, and a VPU capable of H.264 encoding/decoding. The company also offers the MYD-YG2LX development board based on the 45x43mm MYC-YG2LX CPU module with easy access to its interfaces. MYIR MYC-YG2LX Renesas RZ/G2L CPU module MYC-YG2LX module specifications: SoC – Renesas RZ/G2L (R9A07G044L23GBG) dual-core Cortex-A55 processor with Cortex-M33 core @ 200 Mhz, Arm Mali-G31 GPU, H.264 hardware video decoding/encoding System Memory – 1 or 2GB DDR4 (option for up to 4GB) […]

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