Ultra-compact 45x43mm CPU module features TI Sitara AM6231, AM6252, or AM6254 Arm SoC

Texas Instruments Sitara AM6254 development board

MYiR Tech has just announced the tiny, yet full-featured MYC-YM62X CPU module powered by Texas Instruments Sitara AM6231, AM6252, or AM6254 Cortex-A53/M4 processor for HMI and IoT applications as well as the corresponding MYD-YM62X development board used for evaluation. The new MYiR module joins other Texas Instruments AM62x system-on-modules such as Toradex Verdin AM62, Forlinx FET625x-C, Variscite VAR-SOM-AM62, and others, but at just 45x43mm, it is the smallest AM62x CPU module we’ve seen so far yet the company says it still provides access to all features from the processor thanks to its 222 castellated holes. MYC-YM62X CPU Module Specifications: SoC (one or the other) Texas Instruments AM6254 (AM6254ATCGGAALW) with quad-core Cortex-A53 @ 1.4GHz, Cortex-M4F real-time core @ 400MHz, 3D GPU, 2x PRU-SS running up to 333MHz Texas Instruments AM6252 (AM6252ATCGGAALW) with dual-core Cortex-A53 @ 1.4GHz, Cortex-M4F real-time core @ 400MHz , no GPU, PRU-SS running up to 333MHz Texas Instruments […]

Tiny STM32MP135 system-on-module comes with up to 512MB RAM, 256MB NAND flash or 4GB eMMC flash

MYC-Y135 development board

MYiR Technology’s MYC-YF13X is a system-on-module powered by the latest STMicro STM32MP135 cost-optimized Cortex-A7 microprocessor with 256MB or 512MB DDR3L, 256MB NAND Flash or 4GB eMMC flash, and 32Kbit EEPROM. The new MYC-YF13X has the same 39x37mm stamp-size form factor as the company’s earlier MYC-YA15XC-T CPU module based on the STM32MP15 Cortex-A7 processor, and a development board is also provided with LCD and camera interfaces, dual Gigabit Ethernet, RS485/RS232/CAN bus interfaces, and more. MYC-YF13X specifications: SoC – STMicro STM32MP135 (STM32MP135DAF7) single-core Cortex-A7 processor up to @ 1 GHz Two configurations for memory and storage 256MB DDR3L, 256MB NAND Flash, 32KB EEPROM or 512MB DDR3L, 4GB eMMC Flash, 32KB EEPROM 148-pin stamp hole expansion interface (1.0mm pitch) Display I/F – RGB Interface Camera – Parallel camera Audio – 4x I2S, 2x SAI Networking – 2x RGMII interface USB – 2x USB 2.0 Up to 8x UART Up to 5x I2C Up […]

$14+ Allwinner T113-S3 CPU module comes with 128MB RAM, 256MB NAND flash or 4GB eMMC flash

Allwinner T113-S3 CPU module

MYiR MYC-YT113X is a low-cost solderable CPU module powered by an Allwinner T113-S3 dual-core Cortex-A7 processor with 128MB on-chip DDR3 RAM, and fitted with either a 256MB NAND flash or a 4GB eMMC flash for storage. The industrial temperature grade module provides a lower-end alternative to the company’s earlier MYC-YT507H Allwinner T507-H Cortex-A53 CPU module, and offers various display, camera, audio, Ethernet, USB, and low-speed I/Os through a 140-pin stamp hole design. It is designed for HMI, industrial automation, as well as display and control terminals. MYiR MYC-YT113X specifications: SoC – Allwinner T113-S3 CPU – Dual-core Arm Cortex-A7 @ 1.2 GHz with 32 KB L1 I-cache + 32 KB L1 D-cache per core, and 256 KB L2 cache DSP – Single-core HiFi4 VPU – H.265/H.264 video decoding up to 1080p60 and JPEG/MJPEG video encoding up to 1080p60 Memory – 128 MB DDR3 Storage – 4GB eMMC or 256MB NAND flash, […]

Renesas RZ/G2L CPU module targets HMI and IoT gateway applications

RENESAS RZ/G2L development board

MYIR MYC-YG2LX is Renesas RZ/G2L CPU module with up to 4GB DDR4, 32GB eMMC flash, and various I/Os such as gigabit Ethernet, USB 2.0, camera and display interfaces accessible through 222 castellated holes, and designed for advanced HMI, IoT edge gateways, and other embedded devices with video capabilities. As a reminder, the Renesas RZ/G2L microprocessor comes with up to two Arm Cortex-A55 cores clocked at 1.2 GHz, one 200 MHz Cortex-M33 real-time core, a Mali-G31 GPU for 3D graphics interfaces, and a VPU capable of H.264 encoding/decoding. The company also offers the MYD-YG2LX development board based on the 45x43mm MYC-YG2LX CPU module with easy access to its interfaces. MYIR MYC-YG2LX Renesas RZ/G2L CPU module MYC-YG2LX module specifications: SoC – Renesas RZ/G2L (R9A07G044L23GBG) dual-core Cortex-A55 processor with Cortex-M33 core @ 200 Mhz, Arm Mali-G31 GPU, H.264 hardware video decoding/encoding System Memory – 1 or 2GB DDR4 (option for up to 4GB) […]

AEC-Q100 qualified module features Allwinner T507-H processor for automotive applications

Allwinner T507-H development board

We first wrote about Allwinner T507 when we covered a module and devkit from Forlinx, but now MYiR Tech has designed its own AEC-Q100 qualified system-on-module (MYC-YT507H) and the MYD-YT507H development board based Allwinner T507-H processor. MYC-YT507H – Allwinner T507-H SoM Specifications: SoC – Allwinner T507-H with a quad-core Arm Cortex-A53 processor @ 1.5GHz, Arm Mali-G31 MP2 GPU with support for OpenGL ES 3.2/2.0/1.0, Vulkan1.1, OpenCL 2.0; 4K60 H.265/VP9/AVS2 video decoder, 4K H.264/MJPEG video encoder System Memory – 1 or 2GB LPDDR4 Storage – 8GB eMMC flash, 32Kbit EEPROM (or is it 32KB/256Kbit – see block diagram below) 222x castellated holes with 1.0mm pitch for carrier board connection Networking – 1x RGMII and 1x RMII Video 1x HDMI 2.0a up to 4Kp60 2x single-channel LVDS or 1x dual-channel LVDS or 24-bit RGB up to 1080p60 1x TV CVBS output with PAL/NTSC Camera – 1x DVP digital camera, 1x MIPI CSI […]

MYIR MYC-J1028X CPU module features NXP LS1028A dual Cortex-A72 SoC with time-sensitive networking (TSN)

LS1028A CPU module heatsink

MYIR has introduced the MYC-J1028X CPU module based on NXP LS1028A dual Cortex-A72 processor with time-sensitive networking (TSN) support, as well as the MYD-J1028X development board with five Gigabit Ethernet ports, and other interfaces to evaluate the solution. The MYC-J1028X is equipped with 2GB DDR4, 8GB eMMC flash, a 32Kbit EEPROM, and a temperature sensor by default, and exposes all I/Os through a 314-pin MXM 3.0 edge connector. The module also comes with footprints to solder a QSPI NAND Flash, XSPI NOR Flash, and/or ECC memory. Typical applications include industrial routers, industrial control, edge computing, automotive electronics, industrial IoT, and more. MYC-J1028X CPU module MYC-J1028X SoM specifications: SoC – NXP Layerscape LS1028A (LS1028AXN7PQA) dual-core Cortex-A72 processor @ 1.5 GHz with 3D GPU, integrated TSN Ethernet switches and Ethernet controllers System Memory – 2GB DDR4 (optional 3GB / 4GB DDR4); optional DDR4 ECC Storage 8GB eMMC flash (optional 16GB / 32GB) […]

MYIR introduces i.MX 8M Plus module and devkit with AI/ML capabilities

MYIR i.MX 8M Plus development kit

There are already plenty of i.MX 8M Plus systems-on-module, but here’s one more courtesy of MYIR Tech with MYC-JX8MPQ i.MX 8M Plus module with as well as MYD-JX8MPQ development board for evaluating the solution. The module is especially well suited to applications leveraging Artificial Intelligence (AI) and Machine Learning (ML) with the NXP Cortex-A53/M7 integrating a 2.3 TOPS Neural Processing Unit (NPU). The module comes with up to 6GB LPDDR4, 128GB eMMC flash, 32MB QSPI flash, a PMIC for power management, as well as a 314-pin MXM 3.0 connector exposing the I/Os from the processor. MYC-JX8MPQ module specifications: SoC – NXP i.MX 8M Plus (MIMX8ML8CVNKZAB) quad-core Cortex-A53 processor @ 1.6 GHz, real-time Arm Cortex-M7 co-processor @ 800 MHz, 2.3 TOPS AI accelerator, 2D/3D GPU, HiFi4 Audio DSP, and 1080p VPU System Memory – 3GB LPDDR4 (option up to 6GB) Storage – 8GB eMMC flash (option up to 128GB), 32MB QSPI […]

A Smaller STM32MP1 SoM – Meet MYIR MYC-YA15XC-T CPU Module

Smaller STM32MP1 SoM

MYIR launched a fairly compact SoM and accompanying development board based on STM32MP1 Cortex-A7 microprocessor in January 2020. But apparently, the 45mm by 43mm MYC-YA157C module was too big (or expensive) for some customers, so the company has now designed a smaller STM32MP1 SoM with MYC-YA157C-T measuring just 39mm by 37mm thanks to the removal of the Ethernet PHY. MYC-YA15XC-T STM32MP1 system-on-module Specifications: SoC (one or the other) STM32MP151AAC3 single-core Cortex-A7 processor up to @ 800 MHz with Cortex-M4 core @ 209 MHz STM32MP153AAC3 dual-core Cortex-A7 processor up to @ 800 MHz with Cortex-M4 core @ 209 MHz, and CAN FD interface STM32MP157AAC3 dual-core Cortex-A7 processor up to @ 800 MHz, with Cortex-M4 core @ 209 MHz, 3D GPU, DSI display interface, and CAN FD Two configurations for memory and storage 256MB DDR3L, 256MB Nand Flash, 32KB EEPROM or 512MB DDR3L, 4GB eMMC Flash, 32KB EEPROM 148-pin stamp hole expansion […]

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