Qualcomm Wi-Fi 7 Networking Pro Series SoCs support up to 33 Gbps PHY rate, up to 2,000 clients

Qualcomm Wi-Fi 7 networking pro

Qualcomm has announced the Wi-Fi 7 capable Qualcomm Networking Pro Series Gen 3 family designed for routers and access points with a PHY rate up to 33 Gbps with the quad-band 16-stream Networking Pro 1620 platform and offers some competition to the recently announced Broadcom WiFi 7 access point chips. The company will also offer the tri-band 12-stream Networking Pro 1220 with up to 21.6 Gbps aggregated link rate, the quad-band 8-stream Networking Pro 820 capable of 16.5 Gbps PHY rate, and at the low-end of the scale, the Networking Pro 620 limited to 10.8 Gbps with three bands and six streams. Qualcomm Networking Pro 1620 (IPQ9574) platform specifications: CPU – Quad-core Arm Cortex-A73 @ 2.2 GHz System Memory – DDR3L, DDR4 16/32-bit Storage –  eMMC, NAND, Serial NOR, SD/eMMC Networking Wired – 6 Port Integrated Ethernet Switch 4 x 2.5 GbE + 5 GbE + 10 GbE Wireless Wi-Fi […]

Linux 5.17 release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 5.17 changelog

Linus Torvalds has just released Linux 5.17: So we had an extra week of at the end of this release cycle, and I’m happy to report that it was very calm indeed. We could probably have skipped it with not a lot of downside, but we did get a few last-minute reverts and fixes in and avoid some brown-paper bugs that would otherwise have been stable fodder, so it’s all good. And that calm last week can very much be seen from the appended shortlog – there really aren’t a lot of commits in here, and it’s all pretty small. Most of it is in drivers (net, usb, drm), with some core networking, and some tooling updates too. It really is small enough that you can just scroll through the details below, and the one-liner summaries will give a good flavor of what happened last week. Of course, this means […]

UCIe (Universal Chiplet Interconnect Express) open standard for Chiplets with heterogeneous chips

UCIe Open Chiplet platform-on-a-package

We first heard about Chiplet, chips that gather IP or chips from different vendors into a single chip, in 2020 with the now-defunct zGlue’s Open Chiplet Initiative, but the term recently came back to the forefront last month with Intel’s investment into the “Open Chiplet Platform” that aims to offer a modular approach to chip design through chiplets with each block/chiplet customized for a particular function. It turns out there’s now an official standard called the Universal Chiplet Interconnect Express (UCIe) whose specification defines the interconnect between chiplets within a package, and not only backed by Intel, but also AMD, Arm, ASE, Google Cloud, Meta, Microsoft, Qualcomm, Samsung, and TSMC. UCIe defines the Physical Layer (Die-to-Die I/O) and protocols to be used for the chiplet interfaces, currently PCIe and CXL (Compute Express Link), but more protocols will be added to the specification in the future. The goal is to provide […]

Snapdragon X70 5G modem leverages “AI” to reach 10 Gbps

Snapdragon X70 5G AI modem

Qualcomm has announced their latest 5G modem with the Snapdragon X70 that is said to “uses the power of AI” to enable 5G speeds up to 10 Gbps, wider coverage, low latency, and higher power efficiency. The company explains the Qualcomm 5G AI Suite enables AI-powered optimizations of sub-6 GHz and mmWave 5G links on the Snapdragon X70 through various techniques: AI-based channel-state feedback and dynamic optimization AI-based mmWave beam management for superior mobility and coverage robustness AI-based network selection for superior mobility and link robustness AI-based adaptive antenna tuning for up to 30% improved context detection for higher average speeds and coverage That’s about all the details we have about the “artificial intelligence” part, and I’m not convinced neural networks are actually used here. For reference, the previous generation Snapdragon X65 was also sold as a 10Gbps 5G modem, but maybe Snapdragon X70 can achieve high speeds more reliably. […]

Qualcomm announces FastConnect 7800 WiFi 7 & Bluetooth 5.3 solution

Qualcomm FastConnect 7800 WiFi 7 chip highlights

Qualcomm has just announced the FastConnect 7800 WiFi 7 and Bluetooth 5.3 subsystem for smartphones, laptops, and virtual reality headsets promising peak speeds of 5.8 Gbps as well as sub-2 millisecond latency. We first detailed some of WiFi 7 features such as up to 40 Gbps link, and real-time capabilities when MediaTek showcased its future 802.11be compliant Filogic processor to customers, so it should be no surprise that Qualcomm had been working on its own solution, and announced it at Mobile World Congress 2022. Qualcomm FastConnect 7800 (WCN785x-1, WCN785x-5) specifications: Wi-Fi Standards – Wi-Fi 7 (802.11be), Wi-Fi 6E, Wi-Fi 6 (802.11ax), 802.11ac Wave 2, 802.11a/b/g, 802.11n Spectral Bands: 2.4GHz, 5GHz, 6GHz Peak QAM: 4K QAM Peak speed: 5.8Gbps or 4.3Gbps where the 6GHz spectrum is not available Features 4-stream Dual-band simultaneous (DBS) extended into the High Bands Multi-Link Operation (MLO) using 320 MHz (Single channel or 160 + 160) 8×8 […]

Qualcomm unveils third generation Snapdragon 8cx and 7c+ compute platforms

Snapdragon 8cx Gen3 features

Qualcomm has introduced the third generation of the Snapdragon 8cx and 7c compute platforms with the high-end 5nm Snapdragon 8cx Gen 3 processor offers up to 85% faster CPU and 60% faster GPU performance compared to Snapdragon 8cx Gen 2, while the Snapdragon 7c+ Gen 3, designed for entry-level and mid-range laptops and Chromebooks, is said to gain up to 60% CPU performance and achieve up to 70% faster GPU performance uplift compared to the Snapdragon 7c Gen 2. Snapdragon 8cx Gen 3 Qualcomm Snapdragon 8cx specifications: CPU – Qualcomm Kryo 64-bit CPU. Details based on Anandtech live blog from the Snapdragon Tech Summit: 4x 3.0 GHz Prime cores 4x 2.4 GHz Efficiency Cores 14MB Total Cache (8MB L3+6MB System cache) Performance: +40% for single-thread, +85% for multi-thread GPU – Unnamed Adreno GPU with DirectX 12 (DX12) API support DSP – Qualcomm Hexagon Processor, Qualcomm Sensing Hub AI – Qualcomm […]

Snapdragon 8 Gen 1 Mobile Platform features 3 GHz Cortex-X2 core, 10 Gbps 5G modem

Qualcomm Snapdragon 8 Gen 1

A couple of weeks ago, MediaTek introduces the Dimensity 9000 5G processor with a Cortex-X2 core clocked at 3 GHz, and it was just a matter of time before Qualcomm announces its own Armv9 processor. So here we are with the “Snapdragon 8 Gen 1 Mobile Platform” equipped with an octa-core CPU subsystem comprised of one Cortex-X2 core clocked at 3 GHz, Cortex-A710 and Cortex-A510 cores, LP-DDR5 memory, as well as an integrated Snapdragon X65 5G modem capable of 10 Gbps download speeds, and all of that manufactured with the latest 4nm Samsung process. Snapdragon 8 Gen 1 (SM8450) specifications: Octa-core Kryo CPU subsystem (details courtesy of Anandtech since Qualcomm will not usually reveal this information) 1x Arm Cortex-X2 core @ 3.0GHz with 1024KB L2 cache 3x Arm Cortex-A710 cores @ 2.5GHz with 512KB L2 cache each 4x Arm Cortex-A510 cores @ 1.80GHz in two clusters, each with an unspecified […]

ECS LIVA Mini Box QC710 Desktop – A $219 Windows on Arm Developer Kit

ECS LIVA Mini Box QC710 Desktop

The “Snapdragon QC710 Developer Kit” for Windows 10 on Arm app development was unveiled last May, and it’s now available for $219 on Microsoft Store as the “ECS LIVA Mini Box QC710 Desktop”. The developer kit can also be purchased at a discount for $197.10 by students, parents(!), teachers, and members of the military. I suppose this applies only to the US military and showing your Taliban membership card may not work. The developer kit looks like a standard mini PC and features a Qualcomm Snapdragon 7c Compute Platform (SC7180), 4GB RAM, 64GB eMMC flash, HDMI output, 10/100M Ethernet and WiFi 5, and several USB ports. ECS LIVA Mini Box QC710 Desktop specifications: SoC –  Qualcomm Snapdragon 7c Compute Platform (SC7180) with octa-core Qualcomm Kryo 468 (2x Cortex-A76, 6x Cortex-A55) CPU @ up to 2.4 GHz, Adreno 618 GPU System Memory – 4GB Storage – 64GB eMMC flash, MicroSD card […]

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