Qualcomm has recently unveiled an earbud reference design based on the company’s QCC5141 low-power premium-tier Bluetooth SoC that supports TrueWireless Mirroring and Hybrid Active Noise Cancellation (ANC). What are TrueWireless Mirroring and Hybrid ANC? Qualcomm TrueWireless Mirroring technology relies on only one earbud to maintain the Bluetooth connection with the smartphone, while the secondary bud mirrors the connected bud. If the connected earbud is removed, the secondary earbud assumes the connection with zero interruption. The technology enables both a better, more stable connection and lower power consumption Hybrid Active Noise Cancellation (ANC) is designed to provide high-quality immersive experiences and enable natural leak-through of noise to allow for awareness of surroundings. Qualcomm ANC is fully integrated into this QCC5141 chip to reduce the complexity, cost, and PCB space of adding ANC to earbuds and hearables. QCC5141 Earburd Reference Design Key features and specifications: WiSoC – Qualcomm QCC5141 single-chip Bluetooth SoC with power management, dual audio DSP @ 120 MHz, application […]
Qualcomm entered the wearables market in 2016 with the launch of Snapdragon Wear 2100 quad-core Cortex A7 SoC, followed by other models all based on Cortex-A7 cores including the more recent Wear 3100 platform which also added a QCC1110 co-processor to extend battery life. The company has now made the switch to 64-bit Arm with Snapdragon Wear 4100 and Wear 4100+ both featuring a quad-core Arm Cortex A53 processor and companion chips, but the latter adds QCC1100 Arm Cortex-M0 always-on (AON) co-processor to lower power consumption. Snapdragon Wear 4100+ key features and specifications: SoC – Qualcomm SDM429w or SDA429w CPU – Quad-core Cortex-A53 @ up to 1.7 GHz GPU – Adreno A504 GPU up to 320 MHz with OpenGL ES 3.1 API support DSP – Dual Qualcomm Hexagon QDSP6 v56, dedicated MDSP for modem and GPS, and dedicated ADSP for Open Sensor Execution Environment (SEE) and audio Memory & Storage I/F – LPDDR3 up to 750 MHz, eMMC 5.1 flash […]
Qualcomm Robotics RB3 Development Platform powered by Snapdragon 845 processor gets an upgrade with Robotics RB5 Platform equipped with Qualcomm QRB5165 Robotics processor designed for industrial-grade temperature operating, and featuring a 15 TOPS Qualcomm AI Engine fo artificial intelligence and machine learning applications such as heterogeneous computing, enhanced computer vision, and multi-camera concurrency. The development platform also supports for 4G and 5G connectivity via a companion module and runs Ubuntu and ROS 2.0 operating systems. Qualcomm Robotics RB5 development kit specifications: SoC – Qualcomm QRB5165 with Kryo 585 CPU @ up to 2.84 GHz, Adreno 650 GPU, Adreno 665 VPU, Adreno 995 DPU, Qualcomm Hexagon DSP with quad HVX, and Qualcomm Spectra 480 ISP System Memory – 8GB LPDDR5 RAM (POP) Storage – 128 GB UFS3.0 storage, MicroSD card slot Video Output – 1x HDMI 1.4 port Audio – 2x WSA8810 Class-D on-board speaker amplifier, built-in PDM MIC, support for 4-mic array via mezzanine (NAV MEZZ) Cameras Optional Intel RealSense […]
Qualcomm launched Snapdragon 855, the company’s first 5G mobile processor, in December 2018, before following up the next year with Snapdragon 865, 765, and 765G 5G mobile platforms still targetted to higher-end and premium smartphones. Qualcomm has now introduced its first 5G mobile SoC part of the mid-range Snapdragon 600-series with Snapdragon 690 5G octa-core processor featuring Cortex-A77 and Cortex-A53 cores, and a Snapdragon X51 5G modem delivering up to 2.5 Gbps download speed. Qualcomm Snapdragon 690 5G (SM6350) specifications: CPU – Octa-core Qualcomm Kryo 560 CPU @ up to 2.0 GHz, specifically 2x Cortex 77 cores @ 2.0 GHz and 6x Cortex-A55 cores @ 1.7 GHz GPU – Qualcomm Adreno 619L GPU with support for OpenCL 2.0 FP, OpenGL ES 3.2, Vulkan 1.1, and DX12 APIs DSP – 2x Qualcomm Hexagon 692 with Qualcomm Hexagon Vector eXtensions (HVX), Hexagon Tensor Accelerator, Qualcomm Hexagon Scalar Accelerator Qualcomm Sensing Hub – Ultra-low-power hub for audio, voice, and sensors Memory Support – 2×16-bit […]
A few years ago, Qualcomm launched Snapdragon 212 processor for smart speakers. This post has nothing to do with this, but strangely the company decided to reuse the 212 number in its new Qualcomm 212 LTE IoT modem with the claim of being the “world’s most power-efficient single-mode (NB2) chipset”. Specifically, Qualcomm 212 LTE IoT Modem is said to require less than one micro-amp (1uA) of sleep current, support ultra-low system-level cut-off voltage (as low as 2.2V) with provisions for adapting power usage according to varying source power levels. Qualcomm® 212 LTE IoT Modem key features and specifications: MCU Core – Arm Cortex M3 @ up to 204 MHz Cellular Connectivity 3GPP Rel.14 LTE capabilities: Cat-NB2 with multi-carrier NPRACH and Paging, Cat-NB2 Release Assistance Indication (RAI), Cat-NB2 with larger TBS and 2 HARQ processes Peak Speeds – DL: 127 kbps; UL: 158.5 kbps Frequency Bands (700Mhz to 2.1 GHz for global roaming) LTE low bands: B5, B68, B8, B12, B13, […]
Qualcomm Snapdragon XR1 was the first processor from the company dedicated to extended reality (XR) and virtual reality (VR) applications. It found its way in various hardware development kits, a well as Google Glass Enterprise Edition v2. We missed the company’s announcement of the Snapdragon XR2 platform with 5G support last December, but Qualcomm has now just unveiled the Snapdragon XR2 5G Reference Design to help OEMs shorten time to market. Qualcomm Snapdragon XR2 Platform Qualcomm did not provide detailed specifications, but the company claims Snapdragon XR2 delivers 2x the CPU and GPU performance, 4x more video bandwidth, 6x higher resolution and 11x AI improvement compared to Snapdragon 835 Mobile XR Platform. It’s also the first XR/VR platform to support seven concurrent cameras, optional 5G connectivity, and enables “true” MR (Mixed Reality) thanks to low latency camera pass-through. Some of the highlights of the processor include: Up to 3K by 3K resolution per eye at 90 frames per second (fps) […]
While 5G networks are ramping, most people don’t have coverage, let alone a 5G capable smartphone or laptop, but after Snapdragon X50 and Snapdragon X55, Qualcomm has just unveiled its third-generation 5G modem with Snapdragon X60. The new 5G modem is said to feature the world’s first 5-nanometer 5G baseband and the first 5G modem-RF system to support spectrum aggregation across all key 5G bands, namely mmWave and sub-6 using frequency division duplex (FDD) and time division duplex (TDD). Snapdragon X60 key features: Cellular Technology 5G NR – 5G TDD, SA (standalone), 5G FDD, NSA (non-standalone) LTE – LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE 5G Spectrum – mmWave-sub6 carrier aggregation, sub-6 carrier aggregation (FDD-TDD, FDD-FDD, TDD-TDD), Dynamic Spectrum Sharing (DSS), mmWave, sub-6 GHz mWave specs – 800 MHz bandwidth, 8 carriers, 2×2 MIMO sub-6 GHz spec -: 200 MHz bandwidth, 4×4 MIMO 5G Peak Speeds – Download: 7.5 […]
While 5G is ramping up, 4G LTE handsets will still be dominant in terms of market demand for a few more years. So Qualcomm has unveiled three new mobile SoC for mid-range smartphones with Snapdragon 720G, Snapdragon 622, and Snapdragon 460 that also happen to be one of the first processors to support Navigation with Indian Constellation (NavIC). Snapdragon 460 Key features: CPU – 8x Kryo 240 cores up to 2.3GHz GPU – Adreno 610 GPU DSP – Hexagon 683 with vector extensions, hardware-accelerated TensorFlow Lite ISP – Spectra 340 ISP supporting 25MP camera, or dual 16MP camera Connectivity Cellular – Snapdragon X11 LTE modem WiFi 6 ready Bluetooth 5.1 with advanced audio via the Qualcomm FastConnect 6100 platform GNSS – Dual-Frequency (L1 and L5) GNSS for GPS, Galileo, GLONASS, Beidou, NavIC Quick Charge 3.0 – 0 to 50% in 20 minutes Process – 11nm Snapdragon 460 is an update to the Arm Cortex-A53 based Snapdragon 450 processor with the […]
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