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Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Linux 6.19 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.19 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.19

Linus Torvalds has just released Linux 6.19 on the Linux Kernel Mailing List (LKML): No big surprises anywhere last week, so 6.19 is out as expected – just as the US prepares to come to a complete standstill later today watching the latest batch of televised commercials. The betting man would expect them all to be AI-generated, but maybe some enterprising company decides to buck the trend? Doubtful, but there’s always a slight chance. But for anybody outside the US, maybe taking the newest kernel out for a spin instead is an option? I have more than three dozen pull requests for when the merge window opens tomorrow – thank you to all the early maintainers. And as people have mostly figured out, I’m getting to the point where I’m being confused by large numbers (almost running out of fingers and toes again), so the next kernel is going to […]

Posted on by Debashis Das - 5 Comments on 8devices Maca 2 – A ultra-long-range data radio with 80km range for drones and robotics

8devices Maca 2 – A ultra-long-range data radio with 80km range for drones and robotics

8devices Maca 2

8devices Maca 2 high-power plug-and-play ultra-long-range wireless data radio targets drones, UAS, robotics, interceptor systems, industrial IoT, and defense-grade communications, where long range, resilience, and scalability are critical. The device features high transmit power of up to 39 dBm (with 36 dBm per RF chain) and a receiver sensitivity of –98 dBm, and is designed for air-to-ground and point-to-point connectivity over distances of up to 80 km. To maintain stable links over extreme distances, the radio supports ultra-narrow channel widths ranging from 1.5 MHz to 19.5 MHz, significantly improving signal-to-noise ratio and resistance to interference and jamming. Additionally, it includes dual Ethernet, USB 2.0, UART, GPIO, and 14–33 V power input. It also supports industrial temperature operation and NDAA/TAA-compliant manufacturing. For unmanned systems, the radio allows users to manage bandwidth asymmetry. It’s a feature where a user can allocate 90% of the channel to downstream video data while reserving 10% […]

Posted on by Debashis Das - 1 Comment on Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

EXEC Q911 Qualcomm Solution COM HPC Mini Starter Kit

Innodisk has recently introduced the EXEC-Q911, a COM-HPC Mini starter kit designed for edge AI applications powered by a Qualcomm Dragonwing IQ-9075 System-on-Chip (SoC), also known as the QCS9075, which delivers up to 200 TOPS of AI performance. The platform includes 36GB LPDDR5X memory and 128GB UFS 3.1 storage, supports dual 2.5GbE, two 4-lane MIPI CSI-2 camera interfaces, DisplayPort 1.2 and eDP outputs, and multiple expansion options via M.2 (PCIe Gen4 x4/x2) slots. Designed for industrial applications, it operates in a wide -40°C to 85°C operating temperature range, accepts 9–36V DC input, integrates TPM 2.0 security, and offers various I/Os, USB 3.2 Gen 2, CAN FD, RS-232/422/485, GPIO, SPI, and I²C, with longevity guaranteed until 2038. Innodisk EXEC-Q911 specifications: Compute-on-Module – Innodisk EXMA-Q911 COM-HPC Mini module SoC – Qualcomm DragonWing IQ-9075 CPU Octa-core Kryo Gen 6 (Cortex-A78C-based) application cores @ up to 2.36 GHz Quad-core Cortex-R52 real-time cores @ up […]

Posted on by Debashis Das - No Comments on Advantech MIO-5355 3.5-inch SBC features Qualcomm QCS6490 or QCS5430 SoC for industrial edge AI

Advantech MIO-5355 3.5-inch SBC features Qualcomm QCS6490 or QCS5430 SoC for industrial edge AI

MIO 5355 Qualcomm Dragonwing QCS6490 SBC

Advantech MIO-5355 is a 3.5-inch SBC based on Qualcomm QCS6490 or QCS5430 Edge AI processor. The board features up to 8GB of LPDDR5 memory, 128GB of UFS storage, and supports various operating systems, including Windows 11 IoT Enterprise, Ubuntu 24.04 LTS, and Yocto Linux. We have seen other QCS6490-based hardware in the past, such as the Radxa Dragon Q6A, the Quectel QSM560DR SBC, or the Rubik Pi 3, most of which come in compact form factors. The Advantech MIO-5355 takes a different approach, using a standard industrial 3.5-inch form factor (146 × 102 mm) and targeting industrial deployments with support for –20°C to 70°C operation and long-term availability. Advantech MIO-5355 specifications: SoC (one or the other) Qualcomm DragonWing QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Arduino UNO Q 4GB board with 4GB RAM, 32GB storage is now available for $59

Arduino UNO Q 4GB board with 4GB RAM, 32GB storage is now available for $59

Arduino UNO-Q 4GB

When the Arduino UNO Q was first unveiled in October 2025, the specifications of the Qualcomm DragonWing SBC listed the ABX00162 SKU with 2GB RAM and 16GB eMMC flash, and the ABX00173 SKU with 4GB RAM and 32GB eMMC flash. So far, only the 2GB variant was available, and Arduino has now announced the availability of the Arduino UNO Q 4GB with 4GB of RAM and 32GB eMMC storage for more complex projects. Arduino UNO Q 4GB (ABX00173) specifications: Application SoC/MPU – Qualcomm QRB2210 CPU – Quad-core Cortex-A53 processor at up to 2.0 GHz GPU – Adreno 702 GPU at 845 MHz with support for OpenGL ES 3.1, Vulkan 1.1, OpenCL 2.0 DSP – Hexagon QDSP6 v66 VPU – 1080p 30 fps encode / 1080p 30fps decode ISP – 2x Image Signal Processor (13 MP + 13 MP or 25 MP) @ 30 fps Real-time MCU – STMicro STM32U585 Arm Cortex-M33 microcontroller […]

Posted on by Debashis Das - No Comments on Quectel SP895BD-AP AIoT module features Qualcomm Dragonwing Q-8750 SoC with 80 TOPS NPU

Quectel SP895BD-AP AIoT module features Qualcomm Dragonwing Q-8750 SoC with 80 TOPS NPU

Quectel SP895BD AP Smart IoT Module

Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the SP895BD-AP smart AIoT module based on the Dragonwing Q-8750. It is designed for high-performance IoT applications, including video conferencing, 8K computing power boards, and smart retail terminals, running on Android 15 or Linux. Earlier in November, we saw Qualcomm introduce the Dragonwing IQ-X series of SoCs for industrial PCs running Windows. The Q-8750 in the Quectel SP895BD-AP seems to be a variant of the high-end version, with an 8-core Oryon CPU (up to 2x 4.32 GHz + 6x 3.53 GHz) and an Adreno Series 8 GPU. It supports 8K video encoding and decoding with three ISPs for up to 3×48MP camera inputs, or a single camera input of 108MP. The module comes in a compact LGA package and supports standard interfaces like MIPI DSI/CSI, PCIe, USB, I2S, UART, I²C, […]

Posted on by Debashis Das - 4 Comments on Snapdragon X2 Plus 6-core and 10-core processors target low-power Windows Copilot+ PCs

Snapdragon X2 Plus 6-core and 10-core processors target low-power Windows Copilot+ PCs

Snapdragon X2 Plus

After announcing the high-end Snapdragon X2 Elite Extreme and X2 Elite processors last year, Qualcomm has now introduced the mid-range Snapdragon X2 Plus platform at CES 2026. While the Elite SKUs target premium laptops, the X2 Plus series is designed for affordable, mainstream Windows 11 Copilot+ PCs. The new lineup includes the X2P-64-100 (10-core) and the X2P-42-100 (6-core), both manufactured on a 3nm process. What’s interesting is that they share the same 80 TOPS AI accelerator, 9523 MT/s LPDDR5x memory support, Snapdragon X75 5G modem, and FastConnect 7800 WiFi 7 and Bluetooth 5.4 as the flagship Elite models. This means that the X2 Plus reduces CPU core counts and GPU frequencies to maximize battery life for thin-and-light Windows 11 Copilot+ laptops, but it does not compromise on I/O, media capabilities, or AI performance, as it features the same USB4, PCIe Gen5, and AV1 video support as the top-tier models. Snapdragon […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs target AI-enhanced drones, cameras, TVs and media hubs

Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs target AI-enhanced drones, cameras, TVs and media hubs

Dragonwing Q-7790

Qualcomm has made a range of announcements at CES 2026, and notably introduced the Dragonwing Q‑7790 and Q‑8750 processors supporting on‑device AI for drones, smart cameras & industrial vision, AI TVs/media hubs, and video collaboration systems. The mid-range Dragonwing Q-7790 targets both consumer and industrial IoT devices, and offers up to 24 TOPS of on-device AI, 4K video outputs and camera inputs, and AV1 hardware video decode. The higher-end Dragonwing Q-8750 is designed for more advanced IoT applications, delivers up to 77 TOPS (dense) for real-time inference and up to 11B LLMs, handles 8K displays and 8K cameras, and supports up to 12 physical cameras for drones, media hubs, and multi-angle vision systems. Dragonwing Q-7790 Dragonwing Q-7790 (CQ7790M/CQ7790S) specifications: CPU – Octa-core Kryo processor up to 2.8 GHz 1x Gold+ core @ 2.8 GHz 4x Gold cores @ 2.4 GHz 3x Silver cores @ 1.8 GHz GPU – Qualcomm Adreno […]