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July 3, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

NVIDIA Jetson Orin Nano/NX-based Mekotronics AI Box targets humanoid robots, Smart Cities management, transportation applications

Mekotronics AI Box NVIDIA Jetson Orin Nano NX

Better known for its unique Rockchip industrial PC designs, Mekotronics has now launched an “AI Box” based on the NVIDIA Jetson Orin Nano 4GB/8GB or Jetson Orin NX 8GB/16GB for humanoid robots, smart transportation (V2X) applications, Smart Cities, Smart Agriculture, medical imaging, and more. While the company often provides niche features on its Rockchip systems, its Jetson embedded computer offers pretty standard interfaces with an HDMI video output, six USB Type-A ports, two Gigabit Ethernet RJ45 ports (one with PoE), a 40-pin GPIO header, two camera connectors, a terminal block for CAN Bus and UART, and a system connector for LEDs, power button, etc… Mekotronics AI Box specifications: Compatible modules NVIDIA Jetson Orin Nano 4GB up to 34 TOPS NVIDIA Jetson Orin Nano 8GB up to 67 TOPS NVIDIA Jetson Orin NX 8GB up to 117 TOPS NVIDIA Jetson Orin NX 16GB up to 157 TOPS Storage 2x M.2 Key-M […]

June 5, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

$54 ThinkNode G4 Wi-Fi HaLow gateway extends the range of Ethernet or 2.4 GHz WiFi 4 devices

Elecrow’s ThinkNode G4 is a Wi-Fi HaLow gateway with Ethernet and 2.4 GHz WiFi that allows you to connect compatible devices or extend the range of existing devices when used with two gateways or in an 802.11s Mesh configuration with multiple gateways. It’s based on a (legacy) Mediatek MT7628N MIPS processor paired with a Quectel FGH100M featuring Morse Micro MM6108 Wi-Fi HaLow SoC introduced in 2022 with a data rate of up to 32.5 Mbps and a range of up to one kilometer with line-of-sight. ThinkNode G4 specifications: Core module – HLK-7628N Module SoC – Mediatek MT7628N MIPS processor @ up to 580 MHz System Memory – 128MB DDR2 RAM Storage – 32 MB SPI flash Connectivity – 2.4 GHz WiFi 4 2×2 MIMO 802.11b/g/n up to 300 Mbps combined WiFi HaLow Module – Quectel FGH100M based on Morse Micro MM6108 chipset WiFi protocol – IEEE 802.11ah Frequency band – 850~950 […]

May 28, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

AAEON MIX-PTLWV1 Panther Lake industrial mini-ITX motherboard offers quad DisplayPort, dual 10GbE, and more

Industrial Panther Lake mini ITX motherbaord

AAEON MIX-PTLWV1 is an industrial mini-ITX motherboard based on Intel Core Ultra Series 3 “Panther Lake” processors with up to two 10GbE and two 2.5GbE RJ45 jacks, and four 4K-capable DisplayPort video outputs. The motherboard also supports up to 128GB DDR5 C/SO-DIMM memory, M.2 NVMe SSD storage, optional WiFi and Bluetooth, and/or 4G LTE/5G cellular via M.2 modules, a PCIe Gen4 x8 slot for expansion, six serial interfaces, 12V-24V wide DC input, and more. AAEON MIX-PTLWV1 specifications: SoC – Intel Panther Lake processor (PTL-H404/PTL-H484 families) with Intel Xe LPG graphics; TDP: 15 to 25W System Memory – Up to 128GB via 2x 262-pin DDR5 C/SO-DIMM sockets up to 6400MHz (H404 SKU) or 7200MHz (H484 SKU) Storage – M.2 2280 M-Key (PCIe Gen4 x4) socket for NVMe SSD Display Interfaces 4x DisplayPort 1.4 up to 4096 x 2160 @ 60Hz 40-pin LVDS/eDP co-layout connector for Default: 18/24 bit dual-channel LVDS up […]

May 5, 2026May 5, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Congatec conga-TC300 COM Express module features up to Intel Core 7 350 Wildcat Lake processor

Intel Wildcat Lake COM Express Compact module

congatec conga-TC300 is an entry-level edge AI COM Express Type-6 Compact module powered by 15W Intel Core Series 3 “Wildcat Lake” SoCs up to the Core 7 350 hexa-core processor. The module supports up to 64GB DDR5 SO-DIMM memory and features optional on-board UFS 3.1 storage, an Intel i226 2.5GbE controller, and two standard 220-pin board-to-board connectors exposing I/Os such as SATA, DDI and LVDS or eDP display interfaces, USB4, USB 3.2, USB 2.0, PCIe Gen4/Gen3, and more. congatec conga-TC300 specifications: Wildcat Lake SoC (one or the other) Intel Core 3 305 6-core CPU – 2x P-cores @ 1.5/4.3 GHz (Turbo) + 4x LPE-cores @ 1.4/3.3 GHz (Turbo) GPU – 1-core Intel Xe3 Graphics @ 2.3 GHz (9 TOPS) NPU – N/A Intel Core 5 320 6-core CPU – 2x P-cores @ 1.5/4.6 GHz (Turbo) + 4x LPE-cores @ 1.4/3.4 GHz (Turbo) GPU – 2-core Intel Xe3 Graphics @ 2.5 […]

April 22, 2026April 22, 2026 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Raspberry Pi RP2350 board offers NB-IoT cellular connectivity, GNSS, and Wi-Fi indoor location

Raspberry Pi RP2350 board NB-IoT cellular

Challenger+ RP2350 NB-IoT is a Feather-compatible board pairing a Raspberry Pi RP2350 microcontroller and a certified NB-IoT cellular module with built-in GNSS, suitable for long-range, low-power connectivity. It looks to be a variant of the earlier Challenger+ RP2350 WiFi6/BLE5 board that replaces an ESP32-C6 WiFi 6, BLE, and 802.15.4 module with an STMicroelectronics ST87M01 NB-IoT and GNSS module. It still offers Challenger+ RP2350 NB-IoT specifications: Microcontroller – Raspberry Pi RP2350A MCU CPU Dual-core Arm Cortex-M33 processor @ 150MHz Dual-core 32-bit RISC-V processor @ 150MHz Up to two cores can be used at a given time Memory – 520KB internal RAM 8KB OTP Storage Package – QFN-60; 7×7 mm Memory – 8MB PSRAM Storage – 8MB SPI flash Cellular connectivity Module – STMicro ST87M01-1301 LTE Cat NB2 (NB-IoT), 3GPP Release 15 Worldwide regional bands coverage – B1, B3, B5, B8, B20, and B28 Single-tone / Multi-tone / Extended TBS and 2 […]

March 19, 2026 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Grinn GenioSoM-360 MediaTek Genio 360P LGA system-on-module enables Edge AI in space-constrained applications

Grinn GenioSoM-360 is the first system-on-module (SoM) based on MediaTek Genio 360P octa-core Cortex-A76/A55 SoC with a 7.4 TOPS AI accelerator. It comes in a compact (30x30mm) LGA package targeting edge AI applications in space-constrained applications. The SoM features up to 8GB LPDDR4x RAM, up to 64GB eMMC flash, a PMIC, and exposes all I/Os through 303 pads, notably MIPI DSI, LVDS, eDP/DP display interfaces, MIPI CSI camera interfaces, Gigabit Ethernet, USB 3.2/2.0 interfaces, PCIe Gen2, CAN FD, and more Grinn GenioSoM-360 specifications: SoC – MediaTek Genio 360P (MT8367); note the photo above shows the MT8366, the hexa-core Genio 360 variant Octa-core CPU 2x Arm Cortex-A76 cores clocked at up to 1.9 GHz (industrial) / 2.0GHz (commercial) 6x Arm Cortex-A55 cores clocked at up to 1.7 GHz (industrial) / 2.0GHz (commercial) GPU – Arm Mali-G57 MC2 at up to 700MHz with support for OpenGL ES 3.2, Vulkan 1.1, OpenCL 2.0 […]

March 5, 2026March 5, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

ADLINK Express-PTL Panther Lake COM Express Type 6 module supports up to Intel Core Ultra 7 368H, 128GB DDR5

ADLINK Express-PTL COM Express Type 6 computer-on-module is built on Intel Core Ultra Series 3 “Panther Lake-H” SoCs up to the 16-core Core Ultra 7 368H processor delivering 180 TOPS of AI performance. The module pairs up to 128 GB DDR5 memory with IBECC support, features high-speed I/O such as PCIe Gen4, multiple display options, USB4/Thunderbolt capability, and industrial features such as TSN Ethernet, TPM 2.0, and advanced power management. As an industrial part, the Express-PTL is designed to operate across an extended –40°C to 85°C temperature range, and targets applications in robotics, industrial automation, medical imaging, transportation, and smart infrastructure. ADLINK Express-PTL specifications: SoC – Intel Core Ultra Series 3 Panther Lake-H processors (one or the other) Intel Core Ultra 5 336H 12-core (4P+4E+4LPE) processor up to 1.9 GHz / 4.6 GHz (Turbo) with 18MB cache, 4-core Xe3 graphics (37 TOPS), 47 TOPS NPU; TDP: 25W (15-65W cTDP) Intel […]

February 23, 2026February 23, 2026 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

The Ambient IoT Alliance aims to promote and develop standards for batteryless IoT devices using energy harvesting

The Ambient IoT Alliance, or AIoTA, is a global, cross-industry coalition working to promote and develop standards for batteryless IoT devices relying on energy harvesting for power. Ambient Internet of Things (IoT) refers to a class of IoT devices powered by radio waves, light, motion, heat, or any other viable ambient energy source. It is an evolution of legacy IoT and RFID technologies that promises lower costs and high scalability through Bluetooth, 5G Advanced, and the IEEE 802.11bp ambient power communication (AMP) standard. The alliance says its mission is to “promote and support the development of an open, harmonized, and aligned multi-standard ecosystem”. Ambient IoT-enabled devices can gather location, temperature, humidity, and/r other data, and communicate with the wireless infrastructure through a nearby mobile device, wireless access points, domestic appliances, or other standard gateways using a compatible standard. This reduces maintenance costs since batteries do not need to be replaced, […]