DBM10 AI SoC is optimized for battery-powered voice and sensor processing

DBM10 AI Devkit

DSP Group announced DBM10 a low-power AI/ML-enabled dual-core SoC. The SoC is equipped with a DSP (Digital Signal Processor) and a dedicated nNetLite NN (Neural Network) processor that improves voice and sensor processing and ensures low-power consumption when working with sufficient-sized neural networks. Key Specifications of NN Processor Form factor: ~4 mm2  Ultra-low-power inference consumption – ~500 µW (typical) for voice NN algorithms Runs Hello Edge 30-word detection model @ 1 MHz (125 MHz available) Allows porting of large models (10s of megabytes) without significant accuracy loss using model optimization and compression. DBM10 AI SoC uses the combined functioning of machine learning, voice, and sensor parameters. This includes voice trigger (VT), voice authentication (VA), voice command (VC), noise reduction (NR), acoustic echo cancellation (AEC), sound event detection (SED), proximity and gesture detection, sensor data processing, and equalization. The DBM10 is suitable for battery-operated devices like smartphones, tablets, and wearables. It […]

RISC-V hardware & software ecosystem highlights in 2020

RISC-V hardware software 2020

The RISC-V Summit 2020 is currently taking place virtually, and RISC-V International, a non-profit corporation aiming to drive the adoption and implementation of the RISC-V instruction set architecture (ISA), took the occasion to remind us of the growth of the ISA both in terms of commercial adaption, education, and other projects. Calista Redmond, CEO of RISC-V International, detailed the growth in memberships: This year, our technical community has grown 66 percent to more than 2,300 individuals in our more than 50 technical and special interest groups. We’re seeing increased market momentum of RISC-V cores, SoCs, developer boards, software and tools across computing from embedded to enterprise … We’re proud of our growing global membership, which has more than doubled in the last year to 1,000 total members, including 222 organizations.” RISC-V also launched the RISC-V Exchange now listing over 124 RISC-V cores, SoCs, and developer boards, as well as 129 […]

zGlue Launches the Open Chiplet Initiative in Collaboration with Google and Antmicro

Open Chiplet Initiative

We first covered zGlue’s ZiP (zGlue Integration Platform) in 2018 as the company introduced its multi-chip module similar to SiP (system-in-package) via a crowdfunding campaign. Just like SiP, the technology packages several components into a single package, but costs have been brought down to enable low-volume production of custom chips for a reasonable price. Since then the company announced new ZiP multi-chip modules such as nRF52832 based Omnichip and the FPGA, Arm or/and RISC-V based GEM ASIC by Antmicro. The company recently announced the Open Chiplet Initiative, a collection of open-source designs, tools and file formats, launched in collaboration with Google and  Antmicro. There are four main types of tools within the Open Chiplet Initiative: Open Chiplet Interfaces – Currently only ZEF (zGlue Chiplet Info Exchange Format) is provided. It defined the part numbers, pins, and mechanical dimensions of various parts. The ZEF specification can be found on Github. Design […]

Omnichip Devkit 2 Features Nordic nRF52832 based zGlue ZiP Multichip Module

zGlue Omnichip Devkit

We first covered zGlue Integration Platform (ZiP) in 2018 when the company introduced its chip-stacking technology with a fitness tracker based on ZGZL1BA ZiP equipped with chips from Dialog Semiconductor, Analog Devices, Macronix, MCube and others. The concept is similar to SiP (System-in-Package), but zGlue claims the costs and lead times are much lower with the technology. Earlier this year, ZiP was back in the news thanks to Antmicro GEM custom RISC-V/Arm ASIC, and today, I was informed about zGlue Omnichip devkit 2 that is equipped with a ZiP of the same name, and that can be used to evaluate the technology. zGlue OmniChip ZiP zGlue OmniChip ZiP is a multichip module with the following ICs (aka Chiplets) and specifications: Nordic Semiconductor nRF52832 Cortex-M4F microcontroller with Bluetooth LE and NFC connectivity Texas Instruments BQ25120AYFPR battery charger, buck regulator Maxim Integrated MAX86140ENP+ optical pulse oximeter Texas Instruments TMP108AIYFFR temperature sensor Bosch […]

Antmicro GEM ASIC Leverages zGlue Technology to Quickly Bring Custom Arm/RISC-V SoC’s to Market

Antmicro GEM1 zGlue Chip

Introduced in 2018, ZiP (zGlue Integration Platform) chip-stacking technology aims to produce chips similar to Systems-in-Package (SiP) but at much lower costs and lead times. We first found it in a Bluetooth tracker featuring ZGLZ1BA custom chip manufactured with zGlue technology and integrating an Arm Cortex-M0 MCU, flash memory and sensors into a single package. But now the technology is back in the news with Antmicro announcing GEM chiplet-based ASIC last December. At the time of the announced the company’s GEM1 chip featured two Lattice iCE40 FPGAs with a MIPI CSI-2 switch, and they had started working on GEM2 chip combining a hard RISC-V processor and Lattice iCE40 FPGA. Those are so-called demonstrators chip as Antmicro customers will be able to easily and quickly design their own 6×9 mm chip(s) with RISC-V and/or ARM CPUs, FPGAs, sensors, radios and other functional elements to meet the requirements of their specific applications. […]

Intel Phases Out Quark SoCs and Microcontrollers

Intel Quark Discontinued

I had completely forgotten about Intel Quark SoCs and MCUs found in development kits and modules such as the Arduino 101 board or Intel Curie module. Last time I heard about those chips, Intel had just discontinued several boards including the two aforementioned products, and I just assumed the Quark chips had quietly reached end-of-life as well. But actually those will still be available for a bit longer, with Intel having just issued a product change notification for the discontinuance & end of life of the following parts: Intel Quark SoC X1020D Intel Quark SoC X1000 Intel Quark SoC X1010 Intel Quark SoC X1021D Intel Quark SoC X1001 Intel Quark SoC X1011 Intel Quark SoC X1020 Intel Quark SoC X1021 Intel Quark Microcontroller D1000 Intel Quark Microcontroller D2000 Intel Quark SE C1000 Microcontroller Intel Quark Microcontroller D2000 Intel Quark SE C1000 Microcontroller In case you have a product based one […]

MicroSemi Introduces PolarFire FPGA & RISC-V SoC

Polaris FPGA + RISC-V SoC

In the past we’ve covered SoCs comprised of Arm cores and FPGA fabric via Xilinx Zynq-7000 series SoCs and Zynq UltraScale+ series MPSoCs, respectively featuring up to two Arm Cortex A9 cores, and up to four Cortex A53 cores. MicroSemi has now announced an alternative, not based on Arm cores, but instead based on SiFive U54-MC RISC-V cores combined with PolarFire FPGA fabric. PolarFire FPGA RISC-V SoC key features & specifications: FPGA – Microsemi PolarFire FPGA Processor Cores – Up to 4x SiFive U54-MC RISC-V cores clocked at up to 1.5GHz (performance similar to Cortex-A35 cores); 28nm process Deterministic Coherent Multi-core CPU Cluster Deterministic L2 Memory Subsystem System Memory I/F –  Integrated DDR4/LPDDR4 Controller and PHY Storage – Secure Boot, 128K Boot Flash Debug capability Rich I/Os Low Power – Low static power; power optimized transceivers, up to 50% lower power compared to SRAM based FPGAs So we don’t have […]

MediaTek Helio P22 SoC for “Mid Range Premium” Smartphones Relies on 12nm Manufacturing Process

MediaTek already has plenty of Arm Cortex A53 processors in their portfolio, but with MediaTek Helio P22 they’ve now added another one. One of the selling point of the new processor is that it is manufactured using a 12nm manufacturing process, just like the recently announced Helio P60 SoC, which better performance for the similar power consumption thanks to a higher CPU clock (2.0 GHz). MediaTek Helio P22 specifications: Processor – 8x Arm Cortex A53 @ up to 2.0 GHz GPU – Imagination PowerVR GE8320 GPU @ up to 650MHz System Memory – Up to 4GB LPDDR3 @ 933MHz, up to 6GB LPDDR4x @ 1600 MHz Storage I/F – eMMC 5.1 Connectivity Cellular Technologies – Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), FDD / TDD LTE, HSPA + Specific Functions -TAS 2.0, HUPE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71 LTE Category – Cat-4, Cat-7 DL / Cat-13 UL GNSS – […]