ufs News - CNX Software - Embedded Systems News

April 17, 2026April 17, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Intel Core Series 3 “Wildcat Lake” processor family launched for entry-level laptops and Edge AI systems

After several leaks, the Intel Core Series 3 “Wildcat Lake” entry-level processor family is now official. Intel describes it as the first “hybrid AI-ready Core Series processor”. As expected, the “Computer & CPU tile” comes with up to six cores (2x P cores + 4x LPE cores), up to 2-core Intel Xe 3 graphics, up to 40 TOPS of combined AI performance, and LPDDR5x/DDR5 memory interfaces. The “Platform controller tile” integrates six PCIe Gen4 lanes, two Thunderbolt 4 interfaces, two USB 3.2 and eight USB 2.0 interfaces, as well as WiFi 7 and Bluetooth 6.0 connectivity. The Computer & GPU tile is manufactured using an Intel 18A process, while the Platform controller tile is manufactured with another “External” process (TSMC?). Single-channel memory is confirmed, and it looks like eMMC flash will be replaced with UFS 3.0 memory for edge systems with soldered-on memory, although many systems will make use of […]

March 13, 2026March 13, 2026 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Rockchip RK3538 TV Box SoC and RK3572 mid-range HMI processor are coming soon

While we are eagerly waiting for the RK3668 and RK3688 high-end processors, Rockchip is planning to launch two mid-range SoCs with the RK3538 quad-core Cortex-A55 processor designed for TV boxes, and the RK3572 hexa-core Cortex-A73/A53 SoC for HMI (Human Machine Interface) applications. Rockchip RK3538 TV box SoC Rockchip RK3538 specifications: CPU – Quad-core Arm Cortex-A55 processor with NEON, FPU, ARMv8 Crypto… Cache 32KB L1 instruction cache 32KB L1 data cache and 64KB L2 data cache 512KB unified system L3 cache GPU Arm Mali-G310 3D GPU with support for OpenCL 3.0, OpenGL ES1.1/2.0/3.2, Vulkan 1.2 2D Graphics Engine VPU Decoder H.265, H.264, AV1 (up to two simultaneous 1080p60 channels) VP8, VC1, MPEG-4, MPEG-2, MPEG-1 yp to 1920×1088 @ 60 FPS (1088 is not a typo) H.263 up to 720p60 (M)JPEG up to 8176×8176 @ 76 million pixels per second Encoder – N/A MCU core – RISC-V MCU in PMU domain with […]

February 24, 2026February 27, 2026 by Jean-Luc Aufranc (CNXSoft) - 8 Comments

Kioxia samples UFS 5.0 embedded flash memory with up to 1TB capacity, 10.8 GB/s data rate

Kioxia has announced that it has begun shipping evaluation samples of UFS 5.0 embedded flash memory available in capacities of 512 GB and 1 TB. UFS 5.0 is a new standard for embedded flash storage currently being developed by JEDEC for next-generation mobile devices. The new standard utilizes MIPI M-PHY version 6.0 for the physical layer and UniPro version 3.0 for the protocol. The new High-Speed Gear 6 (HS-GEAR6) mode available in M-PHY version 6.0 can handle up to 46.6 Gbps per lane, meaning that with 2 lanes, it can achieve around 10.8 GB/s read/write performance, outperforming most NVMe SSDs, except for PCIe Gen5 SSDs. As a reminder, the previous UFS 4.0 standard promised up to 4,200 MB/s, so the upcoming UFS 5.0 standard more than doubles the theoretical speed. [Update: note quite “upcoming”, since the UFS 5.0 standard was also published on February 26, 2026] Besides the higher throughput, […]

January 30, 2026January 31, 2026 by Jean-Luc Aufranc (CNXSoft) - 33 Comments

Jupiter 2 – RVA23-compliant SBC features SpacemiT K3 octa-core RISC-V AI SoC, up to 32GB RAM, 256GB UFS

MILK-V Shenzhen Technology has just unveiled the Jupiter 2, the first RVA23-compliant RISC-V SBC powered by a 2.4 GHz SpacemiT K3 octa-core X100 CPU with up to 60 TOPS of AI performance, up to 32GB LPDDR5, 256GB UFS, and PCIe Gen3 x4 NVMe SSD support. Designed by SpacemiT themselves, the board also features an eDP connector, a 10GbE SFP+ cage, a Gigabit Ethernet RJ45 port, built-in WiFi 6 and Bluetooth 5.2 wireless connectivity, two USB Type-C connectors, four USB 2.0 ports, an M.2 Key-B socket coupled with a NanoSIM card slot for 4G LTE or 5G cellular connectivity, and more. Jupiter 2 specifications (preliminary): System-on-Module – K3-CoM260 (aka Jupiter 2 NX) SoC – SpacemiT K3 CPU 8x 64-bit RISC-V X100 “big” cores clocked up to 2.4 GHz, RVA23 compliance; 130 KDMIPS performance (similar to RK3588) 8x RISC-V A100 AI Cores with support for up to 1024-bit RVV1.0 parallel computing, optimized for […]

January 26, 2026January 26, 2026 by Debashis Das - 1 Comment

Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

EXEC Q911 Qualcomm Solution COM HPC Mini Starter Kit

Innodisk has recently introduced the EXEC-Q911, a COM-HPC Mini starter kit designed for edge AI applications powered by a Qualcomm Dragonwing IQ-9075 System-on-Chip (SoC), also known as the QCS9075, which delivers up to 200 TOPS of AI performance. The platform includes 36GB LPDDR5X memory and 128GB UFS 3.1 storage, supports dual 2.5GbE, two 4-lane MIPI CSI-2 camera interfaces, DisplayPort 1.2 and eDP outputs, and multiple expansion options via M.2 (PCIe Gen4 x4/x2) slots. Designed for industrial applications, it operates in a wide -40°C to 85°C operating temperature range, accepts 9–36V DC input, integrates TPM 2.0 security, and offers various I/Os, USB 3.2 Gen 2, CAN FD, RS-232/422/485, GPIO, SPI, and I²C, with longevity guaranteed until 2038. Innodisk EXEC-Q911 specifications: Compute-on-Module – Innodisk EXMA-Q911 COM-HPC Mini module SoC – Qualcomm DragonWing IQ-9075 CPU Octa-core Kryo Gen 6 (Cortex-A78C-based) application cores @ up to 2.36 GHz Quad-core Cortex-R52 real-time cores @ up […]

January 22, 2026January 22, 2026 by Debashis Das - No Comments

Advantech MIO-5355 3.5-inch SBC features Qualcomm QCS6490 or QCS5430 SoC for industrial edge AI

MIO 5355 Qualcomm Dragonwing QCS6490 SBC

Advantech MIO-5355 is a 3.5-inch SBC based on Qualcomm QCS6490 or QCS5430 Edge AI processor. The board features up to 8GB of LPDDR5 memory, 128GB of UFS storage, and supports various operating systems, including Windows 11 IoT Enterprise, Ubuntu 24.04 LTS, and Yocto Linux. We have seen other QCS6490-based hardware in the past, such as the Radxa Dragon Q6A, the Quectel QSM560DR SBC, or the Rubik Pi 3, most of which come in compact form factors. The Advantech MIO-5355 takes a different approach, using a standard industrial 3.5-inch form factor (146 × 102 mm) and targeting industrial deployments with support for –20°C to 70°C operation and long-term availability. Advantech MIO-5355 specifications: SoC (one or the other) Qualcomm DragonWing QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU […]

January 7, 2026 by Debashis Das - 4 Comments

Snapdragon X2 Plus 6-core and 10-core processors target low-power Windows Copilot+ PCs

After announcing the high-end Snapdragon X2 Elite Extreme and X2 Elite processors last year, Qualcomm has now introduced the mid-range Snapdragon X2 Plus platform at CES 2026. While the Elite SKUs target premium laptops, the X2 Plus series is designed for affordable, mainstream Windows 11 Copilot+ PCs. The new lineup includes the X2P-64-100 (10-core) and the X2P-42-100 (6-core), both manufactured on a 3nm process. What’s interesting is that they share the same 80 TOPS AI accelerator, 9523 MT/s LPDDR5x memory support, Snapdragon X75 5G modem, and FastConnect 7800 WiFi 7 and Bluetooth 5.4 as the flagship Elite models. This means that the X2 Plus reduces CPU core counts and GPU frequencies to maximize battery life for thin-and-light Windows 11 Copilot+ laptops, but it does not compromise on I/O, media capabilities, or AI performance, as it features the same USB4, PCIe Gen5, and AV1 video support as the top-tier models. Snapdragon […]

November 14, 2025November 16, 2025 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Qualcomm launches Dragonwing IQ-X SoCs for industrial Windows PCs

Qualcomm Dragonwing IQ-X Windows industrial PC

The Qualcomm Dragonwing IQ-X family, comprised of the IQ-X7181 and IQ-X5181 SoCs, offers eight or twelve Oryon cores clocked at up to 3.4 GHz, an Adreno GPU, and up to 45 TOPS of AI performance for industrial PCs running Windows LTSC. Those are upgrades to the Dragonwing IQ9/IQ8/IQ6 SoCs introduced last year, offering faster cores, higher speed interfaces, and more. The IQ-X chips support up to 64GB LPDDR5x memory, UFS 4.0 and SD 3.0 storage, eDP and USB-C display interfaces, up to six cameras, PCIe Gen4 connectivity for optional Ethernet, WiFi 7, and 5G cellular connectivity, and feature eleven USB interfaces and 221 GPIOs. As industrial-grade parts, they are rated for -40°C to 105°C operation. Qualcomm DragonWing IQ-X7181 and IQ-X5181 specifications: CPU IQ-X5181 – Custom Qualcomm Oryon 8-core 64-bit Armv8 CPU clocked up to 3.4 GHz IQ-X7181 – Custom Qualcomm Oryon 12-core 64-bit Armv8 CPU clocked up to 3.4 GHz […]